• 제목/요약/키워드: cross-link amorphous structure

검색결과 3건 처리시간 0.017초

Electrical Properties of Organic Materials as Low Dielectric Constant Materials

  • Oh Teresa;Kim Hong Bae;Kwon Hak Yong;Son Jae Gu
    • 반도체디스플레이기술학회지
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    • 제4권3호
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    • pp.5-9
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    • 2005
  • The bonding structure of organic materials such as fluorinated amorphous carbon films was classified into two types due to the chemical shifts. The electrical properties of fluorinated amorphous carbon films also showed very different effect of two types notwithstanding a very little difference. Fluorinated amorphous carbon films with the cross-link break-age structure existed large leakage current resulting from effect of the electron tunneling. Increasing the cation due to the electron-deficient group increased the barrier height of the films with the cross-link amorphous structure, therefore the electric characteristic of the final materials with low dielectric constant was also improved. The lowest dielectric constant is 2.3 at the sample with the cross-link amorphous structure.

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Electrical Properties of Organic Materials as Low Dielectric Constant Materials

  • Oh Teresa;Kim Hong Bae;Kwon Hak Yong;Son Jae Gu
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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    • pp.67-72
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    • 2005
  • The bonding structure of organic materials such as fluorinated amorphous carbon films was classified into two types due to the chemical shifts. The electrical properties of fluorinated amorphous carbon films also showed very different effect of two types notwithstanding a very little difference. Fluorinated amorphous carbon films with the cross-link breakage structure existed large leakage current resulting from effect of the electron tunneling. Increasing the cation due to the electron-deficient group increased the barrier height of the films with the cross-link amorphous structure, therefore the electric characteristic of the final materials with low dielectric constant was also improved. The lowest dielectric constant is 2.3 at the sample with the cross-link amorphous structure.

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SiOC 박막에서 Si-O 결합의 증가와 유전상수의 관계 (Relationship between Dielectric Constant and Increament of Si-O bond in SiOC Film)

  • 오데레사
    • 한국산학기술학회논문지
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    • 제11권11호
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    • pp.4468-4472
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    • 2010
  • ICP-CVD 방법에 의해 제작된 SiOC 박막을 유전상수와 화학적 이동의 상관성에 대하여 조사하였다. SiOC 박막은 플라즈마 에너지에 의해서 해리작용과 재결합작용에 의해서 cross link 구조를 갖게 되는 Si-O 와 C-O 결합으로 구성된 $930{\sim}1230\;cm^{-1}$ 영역에서 혼합된 Si-O-C 주 결합으로 이루어졌다. C-O 결합은 $1270cm^{-1}$에서 보여지는 Si-$CH_3$ 결합의 말단부분인 C-H 결합이 전기음성도가 큰 산소에 의해서 끌리는 효과로부터 만들어진 결합이다. 그러나 Si-O 결합은 Si-$CH_3$ 결합이 분해되고 난뒤 2차 이온결합에 의해서 만들어진 결합이다. Si-O 결합의 증가는 주결합에서 오른쪽 결합이 증가하기 때문이며, FTIR 스펙트라에 의해서 red shift로 나타났다. 이러한 결과는 SiOC 박막이 보다 더 안정되고 강한 박막임을 의미한다. 그래서 SiOC 박막은 열처리 후 비정질도가 높고 거칠기가 감소되는 것을 확인하였다.