• 제목/요약/키워드: creep life

검색결과 270건 처리시간 0.031초

1% Cr-Mo-V 강 회전자 축의 크리이프 특성과 수명예측에 관한 연구(I) (A Study on the Creep Properties and Life Prediction of 1% Cr-Mo-V Steel Roter Shaft(I))

  • 조판근;정순호;장윤석;이치우
    • 대한기계학회논문집
    • /
    • 제10권4호
    • /
    • pp.519-528
    • /
    • 1986
  • 본 연구에서는 우선 1차적으로 한국중공업에서 제조한 실제의 터어빈 회전자 축에서 시편을 채취하여 화력발전소 터어빈의 작동 온도에서의 크리이프 거동을 실험 하고, Larson-Miller 법 및 Orr-sherby-Dorn 법에 의하여 수명을 예상하엿으며 열처리 조건의 변화에 따른 크리이프 특성 변화를 고찰하였다.

참조응력 개념에 의한 316LN 강의 크리프 해석 (Creep Analysis of Type 316LN Stainless Steel by Reference Stress Concept)

  • 김우곤;김대환;류우석
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2001년도 추계학술대회논문집A
    • /
    • pp.123-128
    • /
    • 2001
  • The creep constants which are used to the reference stress equations of creep damage were obtained to type 316LN stainless steel, and their determining methods were described in detail. Typical Kachanov and Rabotnov(K-R) creep damage model was modified into the damage equations with reference stress concepts, and the modified equations were applied practically to type 316LN stainless steel. In order to determine the reference stress value, a series of high-temperature tensile tests and creep tests were accomplished at $550^{\circ}C$ and $600^{\circ}C$. By using the experimental creep data, the creep constants used in reference stress equations could be obtained to type 316LN stainless steel, and a creep curve on rupture strain was predicted. The reference stress concept on creep damage can be utilized easily as a design tool to predict creep life because the process, which is quantified by the measurement of voids or micro cracks during creep, is omitted.

  • PDF

유한요소해석을 이용한 소형펀치-크리프 시험에 관한 연구 (II) - SP-Creep 시험과 일축 크리프 시험의 상관성을 중심으로 - (A Study on Small Punch-Creep Test Using Finite Element Analysis II)

  • 이송인;권일현;김연직;안병국;안행근;백승세;유효선
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2001년도 추계학술대회논문집A
    • /
    • pp.111-116
    • /
    • 2001
  • Small punch-creep(SP-Creep) test technique has been applied for evaluating the creep characteristics for high temperature materials. However, in order to evaluate the damage and predict the remaining life, it is necessary to establish a quantitative correlation between SP-Creep and uniaxial-creep test results. This paper presents analytical and experimental results of useful correlation between SP-Creep and uniaxial-creep properties for 9Cr1MoVNb steel at $600{\sim}650^{\circ}C$ in terms of stress(load) and activation energy during creep deformation. Especially, the activation energy obtained from SP-Creep test is linearly related to that from uniaxial-creep test at $650^{\circ}C$ as follows: $Q_{sp-p}{\fallingdotseq}1.37\;Q_{TEN},\;Q_{sp-{\sigma}}{\fallingdotseq}1.53\;Q_{TEN}$.

  • PDF

몽크만·그랜트관계에 기초한 소형펀치 크리프시험 데이터와 일축 크리프시험 데이터의 관계 (Relationship Between Small-punch Creep Test Data and Uniaxial Creep Test Data based on the Monkman-Grant Relation)

  • 김범준;손일선;임병수
    • 한국정밀공학회지
    • /
    • 제30권8호
    • /
    • pp.809-814
    • /
    • 2013
  • The relationship between the small-punch creep test and the conventional creep test was investigated experimentally using a method similar to that of the Monkman-Grant relationship. Uniaxial and small-punch creep rupture tests were carried out on 9Cr-2W ferritic steel (Commercial Grade 92 steel: X10CrWMoVNb 9-2) at elevated temperatures. From the relation derived in the same manner as the Monkman-Grant relation, a correlation between the displacement rate in response to the small-punch creep test and the strain rate in the uniaxial creep test was found, and the creep life was calculated using this relation. Furthermore, the failure modes of the small punch creep test specimens were investigated to show that the fracture was caused by creep.

마찰용접된 니켈기 초내열합금 Alloy718의 고온 크리프 파단 특성 (High Temperature Creep Rupture Characteristics of Ni-Based Alloy718 Jointed by Friction Welding)

  • 권상우;공유식;김선진
    • 한국해양공학회지
    • /
    • 제22권6호
    • /
    • pp.58-63
    • /
    • 2008
  • The short-term high temperature creep rupture behavior of Ni-based Alloy718 steels jointed by friction welding wasinvestigated at the elevated temperatures of 550 to $700^{\circ}C$ under constant stress conditions. The creep rupture characteristics such as creep stress, rupture time, steady state creep rate, and initial strain were evaluated. Creep stress has a quantitative correlation between creep rupture time and steady state creep rate. The stress exponents (n, m) of the experimental data at 550, 600, 650 and $700^{\circ}C$ were derived as 26.1, -22.4, 22.5, -18.5, 17.4, -14.3 and 6.9, -8.1, respectively. The stress exponents decreased with increasing creep temperature. The creep life prediction was derived by the Larson-Miller parameter (LMP) method and the result equation obtained is as follows: T(logtr+20)=-0.00148${\sigma}^2$-3.089${\sigma}$+23232. Finally, the results were compared with those of the base metal for Alloy718.

컴퓨터 화상처리 기법을 이용한 고온 구조물의 수명평가 연구 (A Study on Life Assessment for In-Service High-Temperature Components Using Image Processing Technique)

  • 김효진;정재진
    • 한국정밀공학회지
    • /
    • 제15권4호
    • /
    • pp.44-50
    • /
    • 1998
  • The creep life fraction can be evaluated by the degree of grain deformation since the grain of Cr-Mo base metal deforms in the direction of stress. The grain deformation method using image processing technique is developed for life assessment of in-service high-temperature components. The new assessment model of grain deformation method is presented to apply to in-service components and is verified by interrupted creep test for ex-serviced material of 1Cr-0.5Mo steel. The proposed model, which is irrespective of stress direction, is to evaluate mean of the absolute deviation for the measured ratios which are diametrical maximum to minimum dimensions for grains.

  • PDF

플립 칩 BGA 솔더접합부의 열사이클링 피로해석 (Thermal Cycling Fatigue Analysis of Flip-Chip BGA Solder Joints)

  • 김경섭;유정희;김남훈;장의구;임희철
    • 한국마이크로전자및패키징학회:학술대회논문집
    • /
    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
    • /
    • pp.27-32
    • /
    • 2002
  • In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

  • PDF

SUS 316 강의 온도의존성 결정입경이 크리이프 거동에 미치는 영향 (Effect of the grain size of temperature dependence on the creep behavior of SUS 316)

  • 오세욱;강욱
    • Journal of Welding and Joining
    • /
    • 제1권2호
    • /
    • pp.61-68
    • /
    • 1983
  • Austenitic stainless steel has been investigated widely for creep strength of heat resistant material and effects of grain sizes due to various solution treatment time under constant temperature. It was studied that effects of grain sizes subject to solution treatment temperature 1100.deg. C, 1125.deg. C, 1175.deg. C, 1250.deg C, and 1300.deg. C respectively on the creep strength, fracture behaviour and fractography of SUS 316 stainless steel. The experimental results obtained were as follows. 1. The optimum grain size for the maximum creep strength did not vary with creep testing temperatures and stress levels. 2. Among various grain sizes due to different solution treatment temperature, the optimum grain size for the creep strength was found 0.044mm. Also the size showed the minimum initial strain regardless creep temperature. 3. Garofalo's equation of creep rupture life was applied well to SUS 316 stainless steel. 4. The fractography of optimum size was ductile intergranular fracture of dimple type and showed along with the increase of grain size intergranular fracture of w type.

  • PDF

Al합금의 크리프 파단수명에 관한 연구 (The Creep-Rupture Life of Al Alloy)

  • 배춘익;진도훈
    • 한국기계기술학회지
    • /
    • 제13권4호
    • /
    • pp.125-130
    • /
    • 2011
  • Technological mode progress demands the use of materials at high temperature and pressure. Constant load creep tests have been carried out over the range of stresses at high temperatures. One of the most critical factors in considering such applications as the most critical one is the creep behavior. In order to investigate the creep behavior in this study, the stress exponents during creep were determined over the temperature range of $275^{\circ}C$ to $325^{\circ}C$ and the stress range of 36MPa to 72MPa. The applicability of modified Monkman-Grant relationship was also discussed.

플립 칩 BGA 솔더 접합부의 열사이클링 해석 (Thermal Cycling Analysis of Flip-Chip BGA Solder Joints)

  • 유정희;김경섭
    • 마이크로전자및패키징학회지
    • /
    • 제10권1호
    • /
    • pp.45-50
    • /
    • 2003
  • 시스템 보드에 플립 칩 BGA가 실장된 3차원 유한요소 해석 모델을 구성하여 열사이클시험 과정에서 발생되는 솔더 접합부의 피로수명을 예측하였다. 피로 모델은 Darveaux의 경험식에 기초하여 비선형 점소성 해석을 수행하였다. 해석은 4종류의 열사이클시험 조건과 패드구조, 솔더 볼의 조성과 크기의 변화에 따라 발생하는 크리프 수명을 평가하였다. 해석결과 $-65∼150^{\circ}C$의 열사이클시험 조건에서 가장 짧은 피로수명을 보였으며, $0∼100^{\circ}C$ 조건과 비교하면 약 3.5 배 정도 증가하였다. 동일한 시험조건에서 패드구조 변화에 따른 피로수명 차이는 SMD구조가 NSMD구조에 비해 약 5.7% 증가하였다 결과적으로 솔더 접합부에서 크리프 변형에너지 밀도가 높으면 피로수명은 짧아지는 것을 알 수 있었다

  • PDF