• 전기전자학회논문지
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• 제16권1호
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• pp.34-44
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• 2012

본 논문은 스트레인 게이지(strain gauge)식 로드셀(loadcell)의 대표적인 크립오차(creep error)에 대해서 디지털 신호처리방식을 사용한 실용적인 보상법(compensation method)을 제안한다. 신호의 보상방법은 로드셀의 출력응답을 실측해서 보상상수(시정수)와 보상계수를 결정한 후 마이크로프로세서의 내부메모리에 보상상수와 보상계수를 저장한 후 중량값을 디지털로 표시할 시점에 마이크로프로세서에서 연산처리한 크립에러 보상처리값을 로드셀의 출력신호에서 실측한 에러값과 서로 상쇠시키는 보상방법이다. 추가적으로 보상방법을 디지털전자저울에 직접 적용 시험하기 위해서 전용의 보상소프트웨어를 제작한 후 디지털전자저울의 크립특성을 실측해서 보상전 정격출력의 크립오차 0.03%의 로드셀을 정밀디지털전자저울의 허용오차 범위인 0.01%~0.001%이상으로 복잡한 연산처리 없이 정확하게 직접 보상처리하는 실용적인 방법을 제안했다.

• 콘크리트학회논문집
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• 제11권3호
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• pp.161-170
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• 1999

The KLCC Petronas Tower 2, one of the world tallest twin reinforced concrete towers constructed in Kuala Lumpur, Malysia, was instrumented during construction for the measurement of vertical time-dependent deformation of columns and corewall. Field measurements were made by means of vibrating wire strain gauges at the corewall, tower and bustle perimeter columns at selected floor levels of the building. Parallel to this observation, laboratory tests were performed on concrete cylinders made in the field in order to obtain the variations of concrete compressive strengths, elastic moduli, strains of creep and shrinkage with time. Monitored vertical deformations are in a good agreement with the prediction based on actual construction sequence and concrete properties from laboratory tests, as well as the analytical results reflected in actual column compensation of the building.

• 한국구조물진단유지관리공학회 논문집
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• 제22권1호
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• pp.208-215
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• 2018

기둥축소량을 발생시키는 원인과 현재까지 연구되어온 코드에 대하여 고찰하였다. 코드에서 언급하고 있는 내용들은공시체의 건조수축, 크리프, 압축강도 및 탄성계수 그리고 구조해석에서 산출되는 탄성변형을 다루고 있으나, 장기간의 모니터링에 의해 나타나는 온도에 의한 변형은 기존의 연구에 의해 발생되는 요소들에 의한 것보다 축소량이 적게 발생하는 것을 알 수 있었다. 하지만 기존의 연구에서는 온도에 의한 변형에 대해서는 고려하지 않고 건조수축, 크리프 및 탄성변형에 대하여 다루고 있는 것을 확인 할 수 있고, 공시체의 실험에 대해서는 온도에 대한 항목은 습도에 대한 항으로 대체하여 다루고 있음을 알 수 있다. 이에 대해 제안식에 의한 보정수치는 축소량 산정시 상부방향 4.9 mm 와하부방향 1.0 mm의 오차를 나타내어 측정에 의한 수치와 거의 일치하는 것으로 나타났다. 따라서, 기존의 기둥축소량 산정에 있어서 누락될 수 있는 온도에 대하여 추가적으로 더 연구하여 그 영향계수를(수직온도보정계수, ${\beta}_{vT}$) 고려하고, 공시체의 시험뿐만 아니라 구조체의 온도보정에 관한 기준 보완이 필요한 것으로 파악되었다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1998년도 봄 학술발표회 논문집(I)
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• pp.397-402
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• 1998

The objectives of this paper are to estimate differential column Shortening and to determine appropreate compensation amount in 52 story Amatapura Apartment in Indonesia. for this, a computer program based on PCA and CEB-FIP code is developed. The results show that Elastic and Creep strain are the main factors of column shortening and the maximum differential shortening is appeared near the middle of the building height. The results between field survey and estimation have some difference, the most influential factor of the difference can be lateral restraints provided by horizontal members, which cannot be handled in this developed program. Hence introducing the modification factors from various field survey, this program can be used properly in design and construction procedures.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1997년도 가을 학술발표회 논문집
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• pp.475-480
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• 1997

Highrise concrete buildings are very sensitive to cumulative and differential shortening of their vertical element such as wall and columns. Inelastic deformation due to creep and shrinkage consist of various factors and load history af actual building is very complicated. Therefore, for the accurate prediction and compensation of axial shortening, special efforts in design and construction phase are required to ensure long-term serviceability and strength requirement. In this paper, axial shortening estimation and compensation procedure is presented, which utilized experimentally determined concrete properties and preliminary load history and computerized approach, in case of Plaza Rakyat office tower, 79-story reinforced concrete building under construction in Malaysia.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1996년도 가을 학술발표회 논문집
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• pp.258-266
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• 1996

The purpose of this study is to make a reasonable correction in construction stage through exact prediction of long-time differential column shortening that occurs in the high-rise RC building. For this, a self-developed program adopted PCA code is used to predict differential column shortening with sequential loading process. Using this program, the amount of the different column shortening of Amatapura Apartment in Indonesia is predicted and the effect is analyzed. From the result, the major factor affecting the shortening amount in columns is elastic strain and the effect of shrinkage is very small rather than creep. And maximun differential column shortening is appeared near the middle of the building.

• 한국정밀공학회지
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• 제10권2호
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• pp.86-94
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• 1993

In heavy industries forces which are exceeding the range of available force standard machines have to be measured. Force measuring system using build-up procedure can be applied to measure large forces efficiently. In this study strain gage type force sensors are designed and fabricated, and the build-up force measuring system with 4.5 MN capacity using the developed force sensors is 0.03% or less over the range of 600 kN .approx. 1.5 MN and the force measuring system is less than 0.06% or less over the range of 500 kN .approx. 4.5 MN.

• 콘크리트학회논문집
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• 제14권3호
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• pp.291-298
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• 2002

최근 사용재료의 품질과 설계기법의 향상으로 철근콘크리트 고층구조물에 대한 시공이 활발히 이루어지고 있다. 그러나 대부분의 경우에 시간의존적 비탄성변형을 무시하고 있다. 특히 시공단계에서 발생하는 초기변형은 장기적으로 구조물에 심각한 영향을 미칠 수 있다. 또한, 고층구조물에서 발생하는 부등축소는 탄성변형, 크리프, 건조수축 등이 조합되어 일어나기 때문에 고층구조물의 부등축소를 예측하고 실제 현장에서 보정하기 위해서는 장기거동에 대한 해석이 필수적이다. 본 연구에서는 동바리의 설치/제거를 포함한 실제적인 시공과정을 반영할 수 있는 2차원 골조해석 시스템을 개발하였다. 해석 시스템은 데이터베이스 설계기법과 그래픽 사용자 인터페이스(graphic user interface) 환경에서 개발되었으며, Input module, DB Strore module, Database module, Analytical module, Analysis result generation module로 크게 구성되어 있다. 해석 시스템은 시공단계별로 해석을 반복해석을 수행함으로써 발생하는 수많은 데이터와 정보를 데이터베이스 설계를 통해 효율적인 시스템 관리를 한다. Graphic user interface(GUI) 환경의 지원에 의해 사용자가 데이터의 입력, 수정, 검색 작업을 쉽게 할 수 있으며 해석결과를 그래픽 다이어그램(graphic diagram), 테이블(table), 차트(chart) 등으로 확인할 수 있다. 개발된 시스템은 거푸집과 동바리의 설치 및 제거를 포함하는 일반적인 시공단계를 고려할 수 있으며 기둥의 부등축소량을 예측할 수 있으며, 각각의 시공단계별로 발생하는 기둥의 부등축소량을 실제 실무에서 보정할 수 있도록 지원한다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.