• Progress in Superconductivity and Cryogenics
• /
• v.24 no.4
• /
• pp.16-24
• /
• 2022

Applications of REBa₂Cu₃O_7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa₂Cu₃O_7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm² (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.7
• /
• pp.615-622
• /
• 2014

Copper pipes have been widely used as components of System Air-Conditioner due to high thermal conductivity. This system consists of 150 pipes, which are approximately 10m long in total. Dimensional changes occur during pipe processing such as expansion, reduction and bending. This processing induces changes in length of pipes and makes dimensional differences from original pipes. The summation of the differences of pipes components leads to make huge cumulative dimensional differences. The cumulative differences can cause serious problems such as crack, refrigerant leakage. However the differences have not been considered so far. To satisfy target quality of the system, it is essential to predict and calibrate the differences. In this paper, the changes in dimension were predicted using FEM and it was found that cumulative differences could cause indesirable stress during assembly process. As a result, dimensional differences or indesirable stress could be reduced using the proposed method.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1807-1812
• /
• 2007

A bulge testing system was developed to measure mechanical properties of thin film materials. A bulge pressure test system for pressurizing the bulge window of the film and a micro out-of-plane ESPI(Electronic Speckle Pattern Interferometric) system for measuring deflection of the film were included in the testing system developed. For the out-of-plane ESPI system, whole field speckle fringe pattern, corresponding to the out-of-plane deflection of the bulged film, was 3-dimensionally visualized using 4-bucket phase shifting algorithm and least square phase unwrapping algorithm. The bulge pressure for loading and unloading was controlled at a constant rate. From the pressure-deflection curve measured by this testing system, ain-plane stress-strain curve could be determined. In this study, elastic modulus of an electrolytic copper film 18 ${\mu}m$ was determined. The modulus was calculated from determining the plain-strain biaxial elastic modulus at the respective unloading slopes of the stress-strain curve and for the Poisson's ratio of 0.34.

• Journal of the Korean Society of Safety
• /
• v.8 no.4
• /
• pp.16-20
• /
• 1993

The combined effect of increased pressure/temperature and the reduced material thicknesses act to increase the stress on the radiator componets. The design life of the radiator is influenced by the cyclic stresses and corrosion, which act to weaken the materials, radiator mechanical failure occurs when a tube or solder Joint ruptures, causing coolant loss or insufficient heat rejection. Therefore, in this study, through strain measurement of the tubes in copper/brass radiator, the strain distribution of the tubes in radiator as function of temperature and pressure is obtained.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.3
• /
• pp.816-824
• /
• 1996

The densification behaviors of copper powder under high temperature processing were investigated. Experimental data were obtained for copper powder under hot isostatic pressing, hot pressing and uniaxial compression. Finite element calculations from the constitutive models by McMeeking and co-workers were compared with the experimental data, The agreements between experimental data and theoretical calculations are reasonably good when hydrostatic stress is dominant, but not as good then deviatoric stress increases.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1784-1787
• /
• 2008

Molecular dynamics (MD) simulations are used to analyze behavior of copper nanowires under cyclic loading. The embedded atom method (EAM) potential is employed to represent atomic interaction. Cyclic load is applied in two ways (Forward Tension / Reverse Compression and Forward Compression / Reverse Tension). The results show that dislocations are piled up as a result of plastic deformation during alternate tensile and compressive loading. After cyclic loading with a change of direction, yield stress decreases in consequence of the effect by the dislocation pileups. On the other hand, under FC/RT cyclic load, phase transformation represent associated with mechanical twinning. And copper nanowire can return to almost former undeformed condition during tensile loading at 300K.

• Structural Engineering and Mechanics
• /
• v.52 no.5
• /
• pp.957-969
• /
• 2014

Among severe plastic deformation methods, groove pressing is one of the prominent techniques for producing ultra-fine grained sheet materials. This process consists of imposing repetitive severe plastic deformation on the plate or sheet metals through alternate pressing. In the current study, a 2 mm pure Cu sheet has been subjected to repetitive shear deformation up to two passes. Hardness and tensile yield and ultimate stress were obtained after groove pressing. Fracture toughness tests have been performed and compared for three conditions of sheet material namely as received (initial annealed state), after one and two passes of groove pressing. Results of experiments indicate that a decrease in the values of fracture toughness attains as the number of constrained groove pressing (CGP) passes increase.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.245-245
• /
• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.3
• /
• pp.28-35
• /
• 2016

Forging operations are non-stationary processes occurring because of indirect pressure, generally, under conditions of three-dimensional stress and deformation. Furthermore, due to friction and the constraints of die geometry, deformation is not homogeneous. Material flow and deformation are largely determined by the shape of the tools. It is well known that net-shape forging can improve the mechanical strength of the final product as well as reduce material waste. Oxygen-free copper that is used for electrical and electronic components has excellent electrical and thermal conductivity. Oxygen-free copper parts have a low productivity in cutting process. Thus, the forging process is performed in order to improve the low productivity in cutting process. The forging of oxygen-free copper for electrode body parts was modeled using finite element simulation and forging experiments that were conducted for producing electrode body parts at room temperature. In order to reduce the cost of cutting products, the forging was performed in a closed cavity to obtain near-net or net-shape parts.

• Environmental Analysis Health and Toxicology
• /
• v.24 no.2
• /
• pp.107-117
• /
• 2009

Metal pollution of aquatic ecosystems is a problem of economic and health importance. Information regarding molecular responses to metal exposure is sorely needed in order to identify potential biomarkers. To determine the effects of heavy metals on chironomids, the full-length cDNA of alcohol dehydrogenase (ADH3) from Chironomus riparius was determined through molecular cloning and rapid amplification of cDNA ends (RACE). The expression of ADH3 was analyzed under various cadmium and copper concentrations. A comparative and phylogenetic study among different orders of insects and vertebrates was carried out through analysis of sequence databases. The complete cDNA sequence of the ADH3 gene was 1134 bp in length. The sequence of C. riparius ADH3 shows a low degree of amino acid identity (around 70%) with homologous sequences in other insects. After exposure of C. riparius to various concentrations of copper, ADH3 gene expression significantly decreased within 1 hour. The ADH3 gene expression was also suppressed in C. riparius after cadmium exposure for 24 hour. However, the effect of cadmium on ADH3 gene expression was transient in C. riparius. The results show that the suppression of ADH3 gene by copper exposure could be used as a possible biomarker in aquatic environmental monitoring and imply differential toxicity to copper and cadmium in C. riparius larvae.