• Journal of fish pathology
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• v.27 no.1
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• pp.57-65
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• 2014

Copper ($CuSO_4$) has been widely used to control algae and pathogens in fish culture ponds. However, its toxic effects on fish depend not only on its concentration in water but also on water quality. The susceptibility of the rockfish, Sebastes schlegeli to copper was evaluated at three water-temperatures (WT; 18, 23 and $28^{\circ}C$) for 4 days. After the exposure of two copper concentrations (100 and $200{\mu}g/L$), a hematological effect was exerted on rockfish, by causing changes in red blood cell count and hematocrit value at $28^{\circ}C$. Total protein levels of the fish showed a tendency of co-increase with glucose depend on the WT, after copper exposure. However, the plasma calcium and magnesium levels were significantly increased at $200{\mu}g/L$ copper, regardless of the WT. Enzymes activities including ALT and LDH in serum were also significantly increased depend upon the copper treatment only. This indicates that inorganic components and enzymes activities were sensitive indexes to stress by toxicant such as copper. The cortisol levels were significantly elevated by both WT rising and copper treatment in serum of rock fish. In conclusion, these changes can be seen as an initial response to temperature stress and as a sustaining response to copper exposure. The present findings suggest that a simultaneous stress by temperature change and copper exposure could accelerate an alteration of hematological and plasma biological parameters in the rockfish.

• BMB Reports
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• v.36 no.5
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• pp.488-492
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• 2003

Neurofilament-L (NF-L) is a major element of neuronal cytoskeletons and known to be important for neuronal survival in vivo. Since oxidative stress might play a critical role in the pathogenesis of neurodegenerative diseases, we investigated the role of copper and peroxide in the modification of NF-L. When disassembled NF-L was incubated with copper ion and hydrogen peroxide, then the aggregation of protein was proportional to copper and hydrogen peroxide concentrations. Dityrosine crosslink formation was obtained in copper-mediated NF-L aggregates. The copper-mediated modification of NF-L was significantly inhibited by thiol antioxidants, N-acetylcysteine, glutathione, and thiourea. A thioflavin-T binding assay was performed to determine whether the copper/$H_2O_2$ system-induced in vitro aggregation of NF-L displays amyloid-like characteristics. The aggregate of NF-L displayed thioflavin T reactivity, which was reminiscent of amyloid. This study suggests that copper-mediated NF-L modification might be closely related to oxidative reactions which may play a critical role in neurodegenerative diseases.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.450-455
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• 2013

In the current study, a new dynamic recrystallization model for predicting high temperature flow stress is developed based on a physical model and the mean field theory. In the model, the grain aggregate is assumed as a representative volume element to describe dynamic recrystallization. The flow stress and microstructure during dynamic recrystallization were calculated using three sub-models for work hardening, for nucleation and for growth. In the case of work hardening, a single parameter dislocation density model was used to calculate change of dislocation density and stress in the grains. For modeling nucleation, the nucleation criterion developed was based on the grain boundary bulge mechanism and a constant nucleation rate was assumed. Conventional rate theory was used for describing growth. The flow stress behavior of pure copper was investigated using the model and compared with experimental findings. Simulated results by cellular automata were used for validating the model.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Korean Society of Safety
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• v.15 no.4
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• pp.28-34
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• 2000

Copper clad aluminum composite materials are being used for economic and structural purposes, The development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important. This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. There are several parameters that have an influence on determining a sound clad extrusion. These variables are extrusion temperature, extrusion ratio, semi-cone angle of die, extrusion force, extrusion velocity, friction of between the container and billet, percentage of copper used and ratio of flow stress of copper to aluminum. In order to investigate the influence of extrusion temperature, extrusion ratio, semi-cone angle of die on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with these variation.

• Journal of Auto-vehicle Safety Association
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• v.13 no.3
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• pp.20-25
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• 2021

Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

• Transactions of Materials Processing
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• v.23 no.1
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• pp.35-40
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• 2014

The deformation characteristics of a double round copper pipe and a single round copper pipe under biaxial compression were studied using a horizontal compression die. The change in punch load and in deformation behavior was measured during the experiments using various compressive deformation rates in the range of 10mm/min. ~ 450mm/min. The maximum punch load for both the double round copper pipe and the single round copper pipe decreased with increasing compressive deformation rate. The maximum punch load for the single round copper pipe was twice that of the double round copper pipe. After a 4.0mm stroke, the deformed shape of the single round copper pipe remained rectangular. However the outer tube of double round copper pipe remained rectangular while the inner tube was clover shaped. The stress and strain distributions in the double round copper pipe and the single round copper pipe show clear differences. The results of numerical simulations using Deform-2D are in good agreement with experimental results.

• Journal of Life Science
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• v.8 no.2
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• pp.216-225
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• 1998

Metal ion-induced and it’s regulatory genes were screened in virulent salmonella typhimurium UK1 and tested cross-regulation with various stresses. Using the techniqud of P22-MudJ(Km, lacZ)-directed lacZ operon fusion, LF40 cuiA::MudJ and Lf153 cuiD::MudJ which were induced by copper were selected. cuia and cuiD were determined anaerobic coper inducible and copper tolerance response gene, respectively. Also cuiA and cuiD locus were determined at 81 and 8min, respectively, on salmonella Genetic Map. The two regulators were identified as cuaR, and cudR, which controls cuiA and cuiD, respectively. cuaR, and cudR appeared as negative regulators because the expression of cuiA-lac-Z and cuiD-lacZ were increased. Copper adapted UK1 showed high resistance to H$_{2}$O$_{2}$, but cuiD did not. The product of the cudR locus was responsible for decreasing the tolerance to copper and H$_{2}$O$_{2}$. Furthemore cuiA and cuiD locus were found to be part of a regulon under the control of a trans-acting regulators, rpoS, oxyR and relA. Therefore, the results suggest CTR participate with oxidative stress on Salmonella.

• Korean Journal of Microbiology
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• v.53 no.4
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• pp.251-256
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• 2017

Some rhizobacteria were isolated, that have copper resistance and can confer copper resistance to plants allowing growth under copper stress. Isolated strains Pseudomonas veronii MS1 and P. migulae MS2 produced 0.13 and 0.26 mmol/ml of siderophore, that is a metal-chelating agent, and also showed 64.6 and 77.9% of biosorption ability for Cu in 20 mg/L Cu solution, respectively. Copper can catalyze a formation of harmful free radicals, which may cause oxidative stress in organisms. Removal activity of 1,1-diphenyl-2-picryl hydrazyl radical and antioxidant capacity of strains MS1 and MS2 increased up to 82.6 and 78.1%, respectively compared to those of control at 24 h of incubation. They exhibited 7.10 and $6.42{\mu}mol$ ${\alpha}$-ketobutyrate mg/h of 1-aminocyclopropane-1-carboxylic acid deaminase activity, respectively, which reduced levels of stress hormone, ethylene in plants, and also produced indole-3-acetic acid and salicyclic acid that can help plant growth under abiotic stress. All these results indicated that these copper-resistant rhizobacteria could confer copper resistance and growth promotion to plants.