• 한국재료학회지
• /
• 제19권2호
• /
• pp.73-78
• /
• 2009

This study investigated the dependence of the various sputtering conditions (Ar pressure: $2{\sim}10\;mTorr$, Power: $50{\sim}150\;W$) and thickness ($50{\sim}1200\;nm$) of Si thin film on the electrochemical properties, microstructural properties and the capacity fading of a Si thin film anode. A Si layer and a Ti buffer layer were deposited on Copper foil by RF-magnetron sputtering. At 10 mTorr, the 50 W sample showed the best capacity of 3323 mAh/g, while the 100 W sample showed the best capacity retention of 91.7%, also at 10 mTorr. The initial capacities and capacity retention in the samples apart from the 50W sample at 10 mTorr were enhanced as the Ar pressure and power increased. This was considered to be related to the change of the microstructure and the surface morphology by various sputtering conditions. In addition, thinner Si film anodes showed better cycling performance. This phenomenon is caused by the structural stress and peeling off of the Si layer by the high volume change of Si during the charge/discharge process.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1507-1510
• /
• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• 한국재료학회지
• /
• 제28권6호
• /
• pp.317-323
• /
• 2018

Crystal structure of the $L1_2$ type $(Al,X)_3Ti$ alloy (X = Cr,Cu) is analyzed by X-ray diffractometry and the nonuniform strain behavior at high temperature is investigated. The lattice constants for the $L1_2$ type $(Al,X)_3Ti$ alloys decrease in the order of the atomic number of the substituted atom X, and the hardness tends to increase. In a compressive test at around 473K for $Al_{67.5}Ti_{25}Cr_{7.5}$, $Al_{65}Ti_{25}Cr_{10}$ and $Al_{62.5}Ti_{25}Cu_{12.5}$ alloys, it is found that the stress-strain curves showed serration, and deformation rate dependence appeared. It is assumed that the generation of serration is due to dynamic strain aging caused by the diffusion of solute atoms. As a result, activation energy of 60-95 kJ/mol is obtained. This process does not require direct involvement. In order to investigate the generation of serrations in detail, compression tests are carried out under various conditions. As a result, in the strain rate range of this experiment, serration is found to occur after 470K at a certain critical strain. The critical strain increases as the strain rate increases at constant temperature, and the critical strain tends to decrease as temperature rises under constant strain rate. This tendency is common to all alloys produced. In the case of this alloy system, the serration at around 473K corresponds to the case in which the dislocation velocity is faster than the diffusion rate of interstitial solute atoms at low temperature.

• 동의생리병리학회지
• /
• 제27권4호
• /
• pp.391-399
• /
• 2013

The aim of the present study was to investigate the antioxidant efficacies between extracts of Prunus yedoensis(PY) and Betulae platyphyllae var. japonica(BP). HPLC pattern was different between barks and extract solvents. Content of total phenolic compound was the highest in ethanol extract of BP(382.201 mg/g ext.) and its content was 1.9 times higher than that from the water extract of PY. Total antioxidant efficacy also was the highest in ethanol extract of BP (292 copper reducing equivalents). Nitric oxide scavenging activity was almost 70% in ethanol extract of BP treated 200 ug/ml and it was higher than positive control(ascorbic acid). DPPH radical scavenging ability was up by 80% in all samples. ABTS cation decolorization from each barks was activated over 85% in all samples at 100 ug/ml concentration, especially, the activity was the highest (94.4%) in ethanol extract of BP. Hydrogen peroxide scavenging activities were also highest (45%) in ethanol extract of BP at 200 ug/ml concentration and were as high as positive control. Stimulation of the macrophages RAW 264.7 cells with lipopolysaccharide (LPS) increased intracellular ROS levels and ethanol extract of BP at 200 ug/ml concentration reduced ROS levels up to 41 %. The results indicated that the barks of PY and BP has potent antioxidant activities and ethanol extract of BP of them has the highest antioxidant activities.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.449-449
• /
• 2013

최근 반도체 소자의 집적회로는 점점 복잡해지고 있는 반면, 소자의 크기는 작아지고 있으며 그로 인해 패드의 크기가 작아지고 패드사이의 간격 또한 협소해지고 있다. 따라서 웨이퍼 단계에서 제조된 집적회로의 불량여부를 판단하기위한 검사 장비인 프로브카드(Probe Card)의 높은 집적도가 요구되고 있다. 하지만 기존의 MEMS 공법으로 제작되는 프로브 빔은 복잡한 제조 공정과 높은 생산비용, 낮은 집적도의 문제점을 가지고 있다. 본 연구에서는 이러한 문제점을 해결하기 위하여 간단한 제조 공정과 낮은 생산비용, 높은 집적도를 가지는 프로브 빔을 개발하기 위하여 절연절단 방식으로 BeCu (Beryllium-Copper) 프로브 빔을 제작하였다. 낮은 소비 전력으로 우수한 프로브 빔 어레이를 제작하기 위해서 가장 고려해야할 대상은 프로브 빔의 재료와 구조(형상)이다. 절연전단 방식으로 프로브 빔을 형성할 때 요구되는 Fusing current는 프로브 빔의 구조(형상)에 크게 영향을 받는다. 낮은 Fusing current는 소비 전력을 줄여주고, 절연절단으로 형성되는 프로브 빔의 단면(끝)을 날카롭게 하여 프로브 빔과 집적회로의 패드 간의 접촉 저항을 감소시킨다. 프로브 빔의 제작은 BeCu 박판을 빔 형태로 식각하여 제작하였으며, 실리콘 비아 홀(Via hole) 구조의 기판위에 정렬하여 soldering 공정을 통해 실리콘 기판과 BeCu 박판을 접합시켰다. 접합된 프로브 빔의 끝부분을 들어 올린 상태로 전류를 인가하여 stress free 상태로 만들어 내부 응력을 제거하였으며, BeCu 박판에 fusing current를 인가하여 BeCu 박판 프레임으로부터 제거를 하였다. 제작된 프로브 빔의 길이는 1.7 mm, 폭은 $50{\mu}m$, 두께는 $15{\mu}m$, 절단부의 단면적은 1$50{\mu}m^2$로 제작되었다. 그리고 프로브 빔의 절단부의 길이는 $50{\mu}m$ 부터 $90{\mu}m$까지 $10{\mu}m$ 증가시켜 제작되었다. 이후에 절연절단 공정에 요구되는 Fusing current를 측정하였고, 절연절단 후의 절단면의 형상을 SEM (Scanning Electron Microscope)장비를 통하여 확인하였다. 절단부의 길이가 $50{\mu}m$일 때 5.98A의 fusing current를 얻었으며, 절연절단 후 절단부 상태 또한 가장 우수했다. 본 연구에서 제안된 프로브 빔 제작 방법은 프로브카드 및 테스트 소켓(Test socket) 생산에 응용이 가능하리라 기대한다.

• Smart Structures and Systems
• /
• 제14권5호
• /
• pp.901-916
• /
• 2014

Magnetorheological (MR) fluid is one of the field-responsive fluids that is of interest to many researchers due to its high yield stress value, which depends on the magnetic field strength. Similar to electrorheological (ER) fluid, the combination of working modes is one of the techniques to increase the performance of the fluids with limited focus on MR fluids. In this paper, a novel MR testing cell incorporated with valve, shear and squeeze operational modes is designed and constructed in order to investigate the behaviour of MR fluid in combined mode. The magnetic field distribution in the design concept was analyzed using finite element method in order to verify the effective areas of each mode have the acceptable range of flux density. The annular gap of valve and shear were fixed at 1 mm, while the squeeze gap between the parallel circular surfaces was varied up to 20 mm. Three different coil configurations, which were made up from 23 SWG copper wires were set up in the MR cell. The simulation results indicated that the magnetic field distributed in the squeeze gap was the highest among the other gaps with all coils were subjected to a constant applied current of 1 A. Moreover, the magnetic flux densities in all gaps were in a good range of magnitude based on the simulations that validated the proposed design concept. Hence, the 3D model of the MR testing cell was designed using Solidworks for manufacturing processes.

• 한국어류학회지
• /
• 제18권4호
• /
• pp.293-299
• /
• 2006

두툽상어 (Scyliorhinus torazame)부터 분리된 항산화 효소 Cu,Zn-superoxide dismutase (Cu,Zn-SOD 또는 SOD1)의 핵산 염기서열 및 추정 아미노산 서열을 대상으로 분자 계통학적 분석을 실시하였다. 종래 알려져 있는 척추동물의 Cu,Zn-SOD 서열들을 포함하여 neighbor-joining (NJ), maximum parsimony (MP), maximum likelihood (ML) 및 Bayesian 분석 등을 포함한 다양한 계통 분석을 수행하였으며, 이를 통해 연골어류인 본 어종의 척추동물 분류군 내에서의 계통적 위치를 추정하고자 하였다. 다양한 분자 계통수로부터 얻어진 대부분의 consensus tree들에서 분석에 사용한 분류군들은 종래 알려진 분류학적 위치와 비교적 잘 일치하였고, 이중 두툽상어는 같은 연골어류종인 blue shark와 높은 유연관계를 나타내면서 보다 진화한 경골어류들과는 확연히 구분되는 분지를 형성하였다. 특히 핵산 염기서열을 바탕으로 한 neighbor-joining 분석에서 두툽상어는 경골어류와 양막동물에 비해 보다 원시형태의 척추동물 Cu,Zn-SOD 유전자의 한 형태를 보유하고 있는 것으로 나타났다.

• 마이크로전자및패키징학회지
• /
• 제20권4호
• /
• pp.53-58
• /
• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• 대한기계학회논문집B
• /
• 제34권9호
• /
• pp.825-834
• /
• 2010

사각공동내 자연대류 열전달 실험에서, 단열벽에 의해 열전달이 저하가 관찰되는 영역을 실험적으로 그리고 수치해석적으로 평가하였다. $Gr_H$ 수 $1.53\times10^7$부터 $1.01\times10^{10}$까지 변화시키며, 단열벽이 존재할 때와 그렇지 않을 때를 구분하여 열전달률을 측정하였다. FLUENT 실험의 결과를 예측할 수 있는지 확인하고 실험으로 수행하기 어려운 매우 좁은 영역에 대해 FLUENT를 수행하였다. 실험과 FLUENT의 결과를 다른 연구와 비교한 바 일치함을 보였다. 단열벽이 전체 열전달에 미치는 영향은 예상과 같이 단열벽 근처의 매우 좁은 영역에 국한하여 나타남을 확인하였다. 본 연구는 유사성(Analogy) 원리를 이용하여 열전달계를 전기도금계의 물질전달계로 모사하는 방법론을 개발하는 과정에서 실험을 효율화하고자 하는 방안을 강구하기 위하여 추진되었다. 본 연구를 통하여 단열벽간 거리(전극의 폭)를 매우 줄일 수 있는 이론적 근거를 확보하였다.

• Asian Pacific Journal of Cancer Prevention
• /
• 제16권1호
• /
• pp.9-21
• /
• 2015

Cancer, a serious public health problem in worldwide, results from an excessive and uncontrolled proliferation of the body cells without obvious physiological demands of organs. The gastrointestinal tract, including the esophagus, stomach and intestine, is a unique organ system. It has the highest cancer incidence and cancer-related mortality in the body and is influenceed by both genetic and environmental factors. Among the various chemical elements recognized in the nature, some of them including zinc, iron, cobalt, and copper have essential roles in the various biochemical and physiological processes, but only at low levels and others such as cadmium, lead, mercury, arsenic, and nickel are considered as threats for human health especially with chronic exposure at high levels. Cadmium, an environment contaminant, cannot be destroyed in nature. Through impairment of vitamin D metabolism in the kidney it causes nephrotoxicity and subsequently bone metabolism impairment and fragility. The major mechanisms involved in cadmium carcinogenesis could be related to the suppression of gene expression, inhibition of DNA damage repair, inhibition of apoptosis, and induction of oxidative stress. In addition, cadmium may act through aberrant DNA methylation. Cadmium affects multiple cellular processes, including signal transduction pathways, cell proliferation, differentiation, and apoptosis. Down-regulation of methyltransferases enzymes and reduction of DNA methylation have been stated as epigenetic effects of cadmium. Furthermore, increasing intracellular free calcium ion levels induces neuronal apoptosis in addition to other deleterious influence on the stability of the genome.