• Corrosion Science and Technology
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• v.6 no.4
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.3
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• pp.547-553
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• 1990

With alumina ceramics to copper brazement of cylindrical shape, the thermal stress analysis was carried out by finite element method. Elastic and plastic behaviour was considered to copper, but only elastic behaviour was considered to alumina. Also material properties of alumina and copper were considered in not constant values but variable functions dependent on temperature. The result of analysis is shown that maximum tensile longitudinal stress is occurred at perimeter of alumina side interface and maximum compressive radial and tangential stresses are occurred at center of alumina side interface. Because of bending effect, tensile raidial and tangential stresses are occurred at near bottom of alumina, far from interface.

• Journal of Microbiology and Biotechnology
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• v.32 no.5
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• pp.602-611
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• 2022

The persistence of pathogenic Escherichia coli under acidic conditions poses a serious risk to food safety, especially in acidic foods such as kimchi. To identify the bacterial factors required for acid resistance, transcriptomic analysis was conducted on an acid-resistant enterotoxigenic E. coli strain and the genes with significant changes in their expression under acidic pH were selected as putative resistance factors against acid stress. These genes included those associated with a glutamate-dependent acid resistance (GDAR) system and copper resistance. E. coli strains lacking GadA, GadB, or YbaST, the components of the GDAR system, exhibited significantly attenuated growth and survival under acidic stress conditions. Accordantly, the inhibition of the GDAR system by 3-mercaptopropionic acid and aminooxyacetic acid abolished bacterial adaptation and survival under acidic conditions, indicating the indispensable role of a GDAR system in acid resistance. Intriguingly, the lack of cueR encoding a transcriptional regulator for copper resistance genes markedly impaired bacterial resistance to acid stress as well as copper. Conversely, the absence of YbaST severely compromised bacterial resistance against copper, suggesting an interplay between acid and copper resistance. These results suggest that a GDAR system can be a promising target for developing control measures to prevent E. coli resistance to acid and copper treatments.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.4
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• pp.220-227
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• 2001

The static creep behaviors of dispersion strengthened copper GlidCop were investigated over the temperature range of $650{\sim}690^{\circ}C$ (0.7Tm) and the stress range of 40~55 MPa (4.077~5.61 $kg/mm^2$). The stress exponents for the static creep deformation of this alloy was 8.42, 9.01, 9.25, 9.66 at the temperature of 690, 677, 663, and $650^{\circ}C$, respectively. The stress exponent, (n) increased with decreasing the temperature and became dose to 10. The apparent activation energy for the static creep deformation, (Q) was 374.79, 368.06, 361.83, and 357.61 kg/mole for the stress of 40, 45, 50, and 55 MPa, respectively. The activation energy (Q) decreased with increasing the stress and was higher than that of self diffusion of Cu in the dispersion strengthened copper. In results, it can be concluded that the static creep deformation for dispersion strengthened copper was controlled by the dislocation climb over the ranges of the experimental conditions. Larson-Miller parameter (P) for the crept specimens for dispersion strengthened copper under the static creep conditions was obtained as P=(T+460)(logtr+23). The failure plane observed for SEM slightly showed up transgranular at that experimental range, however, universally it was dominated by characteristic of the intergranular fracture.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.4
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• pp.1041-1050
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• 1995

The deformed shape of rod specimen of copper alloys was measured after the high-velocity impact against a rigid anvil and analyzed with one-dimensional theory to determine dynamic yield stress and strain-rate sensitivity which is defined as the ratio of dynamic yield stress to static flow stress. The evvect of two-dimensional deformation on the determination of dynamic yield stress by the one-dimensional theory, was investigated through comparison with the analysis by hydrocode. It showed that the one-dimensional theory is relatively consistent with two-dimensional hydrocode in spite of its simplicity in analysis.

• BMB Reports
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• v.42 no.11
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• pp.752-757
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• 2009

Copper is essential but toxic in excess for aerobic organisms. Yeast transcription factor ACE1 functions as a sensor for copper and an inducer for the transcription of CUP1. In addition, ACE1 can activate the transcription of superoxide dismutase gene (sod1) in response to copper. In this study, we introduced the yeast ACE1 into Arabidopsis and analyzed its function in plant. Under high copper stress, the transgenic plants over-expressing ACE1 showed higher survival rate than the wild-type. We also found that over-expression of ACE1 in Arabidopsis increased the activities of SOD and POD, which were beneficial to the cell in copper buffering. Excess copper would suppress the expression of chlorophyll biosynthetic genes in Arabidopsis, RT-PCR analysis revealed that over-expression of ACE1 decrease the suppression. Together, our results indicate that ACE1 may play an important role in response to copper stress in Arabidopsis.

• Fisheries and Aquatic Sciences
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• v.17 no.3
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• pp.345-353
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• 2014

Copper has been widely used to control algae and pathogens in fish culture ponds. However, its toxic effects on fish depend not only on its concentration in the water but also on the water quality. A laboratory experiment was conducted to assess copper toxicity in the black rockfish Sebastes schlegeli using a panel of antioxidant enzymes, including glutathione (GSH), glutathione S-transferase (GST), glutathione peroxidase (GPx), glutathione reductase (GR) and superoxide dismutase (SOD), at different levels of copper at three water temperatures (WT, 18, 23, $28^{\circ}C$) for 4 days. After exposure to two copper concentrations (100 and $200{\mu}g/L$), GSH levels and GST activities increased significantly, depending on WT (P < 0.05) in the liver, gill, and kidney of the black rockfish. GPx and SOD activities decreased significantly with both increasing WT and copper treatment in the organs of black rockfish (P < 0.05). These changes can be seen as initial responses to temperature stress and as a sustained response to copper exposure. This also indicates that GSH and related enzymes activities were sensitive indexes to stress by toxicants such as copper. The present findings suggest that simultaneous stress due to temperature change and copper exposure can accelerate changes in enzymes activities in the black rockfish. This provides another example of synergism between environmental temperature and pollutants, which may have important implications for the survival of fish in polluted environments during seasonal warming and/or global climate change.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.4
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• pp.333-339
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• 2008

Densification behavior of copper powder was investigated to study the effect of an aluminum mold under warm pressing. The low flow stress of an aluminum mold is appropriate to apply hydrostatic stress to powder compacts during compaction under high temperature. The suggested powder metallurgy process is very useful under high temperature since copper powder compacts have higher relative density over axial stress of 100 MPa and show more homogeneity as compared with conventional warm pressing. Elastoplastic constitutive equation proposed by Shima and Oyane was implemented into a finite element program (ABAQUS) for densification behavior under warn pressing by using a metal mold. Finite element results agreed well with experimental data for densification and deformation of copper powder compacts in the mold.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.11a
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• pp.45-53
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• 2001

Copper bus-bar is made by drawing process and used in many part of industry. When design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper, to determine shrink fit value is analyzed by automatic shrink fit analysis program, APDL/UIDL language in a commercial FEM package, ANSYS, has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for drawing process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.82-88
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• 2002

Copper bus-bar is made by drawing process and used in many part of industry. Ohen design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper it is analyzed to determine shrink fit value by shrink fit analysis program which is used with APDL/UIDL language in a commercial FEM package, ANSYS. The shrink fit analysis has been developed that enables optimal desist of the dies taking into account the elastic deflections. Elastic deflection is generated in shrink fitting the die inserts and that caused by the stresses generated using DEFORM software for drawing process analysis. This data can be processed as load input data fir a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.