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http://dx.doi.org/10.3795/KSME-A.2008.32.4.333

The Effect of an Aluminum Mold on Densification of Copper Powder Under Warm Pressing  

Lee, Sung-Chul (포항공과대학교 대학원 기계공학과)
Park, Tae-Uk (포항공과대학교 대학원 기계공학과)
Kim, Ki-Tae (포항공과대학교 기계공학과)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.32, no.4, 2008 , pp. 333-339 More about this Journal
Abstract
Densification behavior of copper powder was investigated to study the effect of an aluminum mold under warm pressing. The low flow stress of an aluminum mold is appropriate to apply hydrostatic stress to powder compacts during compaction under high temperature. The suggested powder metallurgy process is very useful under high temperature since copper powder compacts have higher relative density over axial stress of 100 MPa and show more homogeneity as compared with conventional warm pressing. Elastoplastic constitutive equation proposed by Shima and Oyane was implemented into a finite element program (ABAQUS) for densification behavior under warn pressing by using a metal mold. Finite element results agreed well with experimental data for densification and deformation of copper powder compacts in the mold.
Keywords
Aluminum Mold; Densification; Finite Element Analysis; Warm Pressing;
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Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 0
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