• 한국재료학회지
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• 제13권8호
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• pp.524-530
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• 2003

In order to prepare the uniform copper particles from copper sulfate solution by using hydrazine as a reduction agents, the reduction behavior of copper particles from copper sulfate was investigated in detail at room temperature by the observation of reaction products. The effects of $NH_4$OH and $Na_4$$P_2$$O_{7}$ on the formation of uniform copper particles were discussed. ($NHCu_3$)$_4$$SO_4$was completely formed at over pH 11 by adding $NH_4$OH in copper sulfate solution. The fine $Cu_2$O with the particle size of 50 nm was produced in the initial reduction process of (NH$Cu_3$)$_4$$SO_4$solution with $Na_4$$P_2$$O_{ 7}$ and then the Cu$_2$O was converted into copper particles by inserting additional hydrazine. When Cu(NH$_3$)$_4$SO$_4$solution with $Na_4$$P_2$$O_{ 7}$ was reduced at $80^{\circ}C$ by hydrazine, the highly dispersed copper particles with the particle size of about 0.8 $\mu\textrm{m}$ was obtained.

• Tribology and Lubricants
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• 제12권2호
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• pp.32-40
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• 1996

The tribological role of copper alloy fine particles in an additive is not well known compared to solid lubricants such as $MoS_{2}$ and PTFE. In this experimental investigation, a series of friction and wear test was undertaken to gain a better understanding of an additive containing copper alloy fine particles and to identify the effectiveness of copper alloy particles in improving tribological performance of the lubricant. Friction and wear of specimens under lubricated contact condition were studied and the worn surfaces were characterized by AES (Auger Electron Spectroscopy), SEM (Scanning Electron Microscopy) and optical microscopy. It was revealed that a copper-contained layer was formed and this layer resulted in considerable reduction in both friction and wear due to its lubricity and anti-wear property. The analysis of worn surface revealed that copper of the fine alloy particles in the additive helps healing the worn surface by plating and filling wear pits.

• 한국재료학회지
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• 제15권4호
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• pp.263-270
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• 2005

In order to prepare the uniform copper particles from copper chloride solution, the reduction behavior of copper particles from copper chloride and the effects of reduction agent and dispersing agent was investigated. In the case that 2.56 M of $C_6H_8O_6$ was used as a reduction agent, the highly dispersed Cu particles with sharp size distribution were generated from 0.96M of copper chloride solution, and the size of Cu particles was $6\~10\;{\mu}m$. To form $Cu(NH_3)_4Cl_2$ complex solution, $NH_4OH$ was added in the copper chloride solution before the reductive reaction of Cu ion. The generated Cu particles have a two kind of shape, spherical and rod-like. In the case that $N_2H_4{\cdot}H_2O$ was used as a reduction agent, the very fine spherical Cu particles with the size of $0.2\~0.5\;{\mu}m$ was obtained. Arabic gum as a dispersing agent was more effective than $Na_4P_2O_7{\cdot}10H_2O$.

• 한국세라믹학회지
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• 제49권5호
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Advances in nano research
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• 제5권4호
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• pp.359-372
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• 2017

Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of $CuCl_2$ (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of $30-80^{\circ}C$. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at $400^{\circ}C$ and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metalli-ccopper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of $50^{\circ}C$.

• 방사성폐기물학회지
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• 제21권1호
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• 문화기술의 융합
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• 제9권6호
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• pp.855-859
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• 2023

질산구리삼수화물염(copper(II) nitrate trihydrate) 수용액을 공업용 전분(starch)에 함침 시킨 전구체를 이용하여 산화구리(CuO) 나노 입자를 합성하였다. 주사전자현미경(SEM)을 통하여 질산구리삼수화물염 수용액이 함침된 전구체에 대한 구조를 분석하였고, 전구체에 대한 열처리 온도를 증가 시킴에 따라 생성되는 산화구리 입자의 입자 크기와 결정 구조를 X선회절분석법(XRD)과 주사전자현미경(SEM)으로 분석하였다. 분석 결과에 따르면, 전구체에서 유기물질이 완전히 열분해 되어지는 온도는 450-490℃이며, 열처리하는 온도가 증가함에 따라 생성되는 산화구리 입자의 크기와 결정성이 증가하는 것을 확인할 수 있었고, 또한 500-800℃에서 1시간씩 열처리하여 얻은 산화구리 입자의 크기는 100nm-2㎛인 것으로 나타났다. 하소 온도 400℃에서 산화구리 결정상이 형성되고, 800℃까지는 산화구리 단일상만 존재하며, 하소 온도의 증가에 따라 생성되는 입자의 크기가 커지는 것을 확인하였다.

• 자원리싸이클링
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• 제11권6호
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• pp.47-54
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• 2002

내경 2.8cm, 높이 65cm의 반응관을 이용하여 1000∼1400 K에서 산소-질소 혼합 가스류 중을 낙하하는 동정광 입자의 1차원 비등온 산화반응의 초기거동에 대하여 검토하였다. 동 정광은 반응관을 낙하하면서 매우 빠르게 산화 용융되었다. 입자 온도는 미 반응핵 모델과 가스-입자간의 물질전달 및 가스-입자-관벽 사이의 열전달을 조합하여 계산하였다. 계산에 의한 입자 온도는 반응관 상단에서 20∼30cm의 위치에서 최고온도에 도달하였으며, 고 산소분압에서는 약 1700 K에 도달하였다. 산소분압이 0.2 atm 이상인 경우 대부분의 입자는 용융되었다.

• 한국분말재료학회지
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• 제12권6호
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• pp.413-421
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• 2005

Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.

• 동력기계공학회지
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• 제14권4호
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• pp.50-55
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• 2010

In order to investigate tribological effects of nano copper particles impregnated(CuN) on surface polytetrafluoroethylene(PTFE) on sealing wear and an experimental study was carried out to determine the wear behavior of copper nano-particles impregnation two kind thickness in super critical $CO_2$ liquid. Experimental results showed that the friction coefficients of CuN PTFE at the low sliding speed(0.44m/s) and the oil temperature ($60^{\circ}C$) were higher than that of virgin PTFE. And a thin nano copper particles impreganated thickness was formed on the surface in the PTFE and the specimen with this treatment has much better friction properties than the original one. Fortunately, at the high load(80 N) and the oil temperature, the friction coefficient of CuN PTFE was lower than that of virgin PTFE. This evidenced the load carrying capacity of CuN PTFE was much better than that of virgin PTFE under the high load condition(80 N) specially. Therefore, it can be concluded that the friction coefficient variation of CuN PTFE is very small but its wear rate decreases greatly with increase in sliding speed.