• Korea-Australia Rheology Journal
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• v.17 no.2
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• pp.35-40
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• 2005

Nanofluid is a novel heat transfer fluid prepared by dispersing nanometer-sized solid particles in traditional heat transfer fluid to increase thermal conductivity and heat transfer performance. In this research we have considered the rheological properties of nanofluids made of CuO particles of 10-30nm in length and ethylene glycol in conjunction with the thermal conductivity enhancement. When examined using TEM, individual CuO particles have the shape of prolate spheroid of the aspect ratio of 3 and most of the particles are under aggregated states even after sonication for a prolonged period. From the rheological property it has been found that the volume fraction at the dilute limit is 0.002, which is much smaller than the value based on the shape and size of individual particles due to aggregation of particles. At the semi-dilute regime, the zero shear viscosity follows the Doi-Edwards theory on rodlike particles. The thermal conductivity measurement shows that substantial enhancement in thermal conductivity with respect to particle concentration is attainable only when particle concentration is below the dilute limit.

• Journal of Powder Materials
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• v.23 no.3
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• pp.228-234
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• 2016

Copper nanoparticles attract much attention as substitutes of noble metals such as silver and can help reduce the manufacturing cost of electronic products due to their lower cost and good conductivity. In the present work, the chemical reduction is examined to optimize the synthesis of nano-sized copper particles from copper sulfate. Sodium borohydride and ascorbic acid are used as reducing and antioxidant agents, respectively. Polyethylene glycol (PEG) is used as a size-control and capping agent. An appropriate dose of PEG inhibits the abnormal growth of copper nanoparticles, maintaining chemical stability. The addition of ascorbic acid prevents the oxidation of nanoparticles during synthesis and storage. Transmission electron microscopy (TEM) and Fourier transform infrared spectroscopy (FTIR) are used to investigate the size of the synthesized nanoparticles and the coordination between copper nanoparticles and PEG. For chemical reduction, copper nanoparticles less than 100 nm in size without oxidized layers are successfully obtained by the present method.

• Resources Recycling
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• v.23 no.6
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• pp.30-39
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• 2014

The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

• Journal of Powder Materials
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• v.10 no.6
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.

• Polymer(Korea)
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• v.34 no.1
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• pp.84-87
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• 2010

Copper-indium-diselenide (CIS) particles were prepared by the electrochemical reduction from the mixture solution of corresponding ion compounds. The prepared CIS was used as an insertion layer or a blending component in the organic photovoltaic bulk heterojunction cells composed of poly(3-octylthiophene) and fullerene. The increase of CIS content resulted in the rapid decrease of the open-circuit voltage as well as short-circuit current. The photovoltaic parameters were analyzed in relation to the structures, composition, and morphology of the photovoltaic blends.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.413-418
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• 2001

We investigated change of crystal structure, surface morphology and crystal orientation of the electrodeposited film from dispersed $SiO_2$ suspensions (colloidal silica) copper sulfate bath and arse corrosion potentials and physical specific properties. As addition of colloidal silica in copper electrolytic hath, the crystal Particles on filial was fined-down, made uniform and account of particles were increased. Hardness of copper electrodeposited film ascended about 15% and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation chanced from (111) to (110) plane. Also, corrosion potential of electrodeposited copper film was noble with colloidal silica addition.

• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.563-566
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• 2002

Copper complexes have been directly incorporated into cellulose acetate (CA) and the resulting light blue colored homogeneous films of 5-20 wt.% copper acetate complex concentrations are found to be thermally stable up to 200 $^{\circ}C$. The reaction chem istry of Cu in CA has been investigated by reacting them with small gas molecules such as CO, H2, D2, O2, NO, and olefins in the temperature range of 25-160 $^{\circ}C$, and various Cu-hydride, -carbonyl, -nitrosyl, and olefin species coordinated to Cu sites in CA are characterized by IR and UV/Vis spectroscopic study. The reduction of Cu(II) complexes by reacting with H2 gas at the described conditions results in the formation of Cu2O and copper metal nanoparticles in CA, and their sizes in 30-120 nm range are found to be controlled by adjusting metal complex concentration in CA and/or the reduction reaction conditions. These small copper metal particles show various catalytic reactivity in hydrogenation of olefins and CH3CN; CO oxidation; and NO reduction reactions under relatively mild conditions.

• Journal of the Korean institute of surface engineering
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• v.49 no.3
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• pp.238-244
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• 2016

Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on ${\alpha}$- or ${\beta}$- phases and how to achieve uniform deposition over the entire surface on ${\alpha}$- and ${\beta}$-phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly ${\alpha}$- and ${\beta}$-phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on ${\beta}$-phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the ${\beta}$-phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size ${\beta}$-phase particles which is ascribed to gas bubbles formed at the ${\beta}$-phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the ${\alpha}$- and ${\beta}$-phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.

• Tribology and Lubricants
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• v.34 no.6
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• pp.226-234
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• 2018

Copper chemical mechanical planarization (CMP) has become a key process in integrated circuit (IC) technology. The results of copper CMP depend not only on the mechanical abrasion, but also on the slurry chemistry. The slurry used for Cu CMP is known to have greater chemical reactivity than mechanical material removal. The Cu CMP slurry is composed of abrasive particles, an oxidizing agent, a complexing agent, and a corrosion inhibitor. Citric acid can be used as the complexing agent in Cu CMP slurries, and is widely used for post-CMP cleaning. Although many studies have investigated the effect of citric acid on Cu CMP, no studies have yet been conducted on the interfacial friction characteristics and step height reduction in CMP patterns. In this study, the effect of citric acid on the friction characteristics and step height reduction in a copper wafer with varying pattern densities during CMP are investigated. The prepared slurry consists of citric acid ($C_6H_8O_7$), hydrogen peroxide ($H_2O_2$), and colloidal silica. The friction force is found to depend on the concentration of citric acid in the copper CMP slurry. The step heights of the patterns decrease rapidly with decreasing citric acid concentration in the copper CMP slurry. The step height of the copper pattern decreases more slowly in high-density regions than in low-density regions.

• Applied Chemistry for Engineering
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• v.35 no.2
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• pp.96-99
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• 2024

A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.