• Korean Journal of Materials Research
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• v.13 no.8
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• pp.524-530
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• 2003

In order to prepare the uniform copper particles from copper sulfate solution by using hydrazine as a reduction agents, the reduction behavior of copper particles from copper sulfate was investigated in detail at room temperature by the observation of reaction products. The effects of $NH_4$OH and $Na_4$$P_2$$O_{7}$ on the formation of uniform copper particles were discussed. ($NHCu_3$)$_4$$SO_4$was completely formed at over pH 11 by adding $NH_4$OH in copper sulfate solution. The fine $Cu_2$O with the particle size of 50 nm was produced in the initial reduction process of (NH$Cu_3$)$_4$$SO_4$solution with $Na_4$$P_2$$O_{ 7}$ and then the Cu$_2$O was converted into copper particles by inserting additional hydrazine. When Cu(NH$_3$)$_4$SO$_4$solution with $Na_4$$P_2$$O_{ 7}$ was reduced at $80^{\circ}C$ by hydrazine, the highly dispersed copper particles with the particle size of about 0.8 $\mu\textrm{m}$ was obtained.

• Tribology and Lubricants
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• v.12 no.2
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• pp.32-40
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• 1996

The tribological role of copper alloy fine particles in an additive is not well known compared to solid lubricants such as $MoS_{2}$ and PTFE. In this experimental investigation, a series of friction and wear test was undertaken to gain a better understanding of an additive containing copper alloy fine particles and to identify the effectiveness of copper alloy particles in improving tribological performance of the lubricant. Friction and wear of specimens under lubricated contact condition were studied and the worn surfaces were characterized by AES (Auger Electron Spectroscopy), SEM (Scanning Electron Microscopy) and optical microscopy. It was revealed that a copper-contained layer was formed and this layer resulted in considerable reduction in both friction and wear due to its lubricity and anti-wear property. The analysis of worn surface revealed that copper of the fine alloy particles in the additive helps healing the worn surface by plating and filling wear pits.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.263-270
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• 2005

In order to prepare the uniform copper particles from copper chloride solution, the reduction behavior of copper particles from copper chloride and the effects of reduction agent and dispersing agent was investigated. In the case that 2.56 M of $C_6H_8O_6$ was used as a reduction agent, the highly dispersed Cu particles with sharp size distribution were generated from 0.96M of copper chloride solution, and the size of Cu particles was $6\~10\;{\mu}m$. To form $Cu(NH_3)_4Cl_2$ complex solution, $NH_4OH$ was added in the copper chloride solution before the reductive reaction of Cu ion. The generated Cu particles have a two kind of shape, spherical and rod-like. In the case that $N_2H_4{\cdot}H_2O$ was used as a reduction agent, the very fine spherical Cu particles with the size of $0.2\~0.5\;{\mu}m$ was obtained. Arabic gum as a dispersing agent was more effective than $Na_4P_2O_7{\cdot}10H_2O$.

• Journal of the Korean Ceramic Society
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• v.49 no.5
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Advances in nano research
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• v.5 no.4
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• pp.359-372
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• 2017

Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of $CuCl_2$ (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of $30-80^{\circ}C$. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at $400^{\circ}C$ and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metalli-ccopper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of $50^{\circ}C$.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.21 no.1
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• The Journal of the Convergence on Culture Technology
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• v.9 no.6
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• pp.855-859
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• 2023

Copper oxide (CuO) nanoparticles were successfully synthesized using a precursor in which industrial starch was impregnated with an aqueous solution of copper (II) nitrate trihydrate. The microstructure of the precursor impregnated with an aqueous solution of copper nitrate trihydrate was confirmed with a scanning electron microscope (SEM), and the particle size and the crystal structure of the copper oxide particles produced as the temperature of the heat treatment of the precursor increased was analyzed by X-ray diffraction (XRD) and the scanning electron microscope (SEM). As a result of the analysis, it was confirmed that the temperature at which the organic matter of the precursor is completely thermally decomposed is 450-490℃, and that the size and crystallinity of the copper oxide particles increased as the heat treatment temperature increased. The size of the copper oxide particles obtained through heat treatment at 500-800℃ during 1 hour was 100nm~2㎛. It was confirmed that the copper oxide crystalline phase is formed at a heat treatment temperature of 400℃, and only the copper oxide single phase existed up to 800℃. And it was also confirmed that the size of particles produced increased as the calcination temperature increased.

• Resources Recycling
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• v.11 no.6
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• pp.47-54
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• 2002

Copper concentrate particles were fed from the top of vertical reaction tube of 2.8 cm ID and 65 cm long with an $O_2$-$N_2$ gas mixture. The reaction tube was heated to 1000 K to 1400 K. The copper concentrate particles were very rapidly oxidized and melted down during their descent in the reaction tube. The particle temperature were calculated by combining an unreacted core model, mass transfer between gas and particles, and heat transfer between gas, particles and tube wall. The particle temperature reached its maximum at the height of 20 to 30 cm from the top of the reaction tube, and it attained about 1700 K at higher oxy-gen partial pressure. The most particles were melted at the oxygen partial pressure above 0.2 atm.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.413-421
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• 2005

Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.

• Journal of Power System Engineering
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• v.14 no.4
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• pp.50-55
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• 2010

In order to investigate tribological effects of nano copper particles impregnated(CuN) on surface polytetrafluoroethylene(PTFE) on sealing wear and an experimental study was carried out to determine the wear behavior of copper nano-particles impregnation two kind thickness in super critical $CO_2$ liquid. Experimental results showed that the friction coefficients of CuN PTFE at the low sliding speed(0.44m/s) and the oil temperature ($60^{\circ}C$) were higher than that of virgin PTFE. And a thin nano copper particles impreganated thickness was formed on the surface in the PTFE and the specimen with this treatment has much better friction properties than the original one. Fortunately, at the high load(80 N) and the oil temperature, the friction coefficient of CuN PTFE was lower than that of virgin PTFE. This evidenced the load carrying capacity of CuN PTFE was much better than that of virgin PTFE under the high load condition(80 N) specially. Therefore, it can be concluded that the friction coefficient variation of CuN PTFE is very small but its wear rate decreases greatly with increase in sliding speed.