• Journal of Electrochemical Science and Technology
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• v.3 no.4
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• pp.165-171
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• 2012

An experimental study of mass transfer to an amalgamated copper rotating disc electrode has been employed to determine an empirical correlation for the mass transfer rate in laminar flow. The study was performed in a three-electrodes configuration using 0.1 M boric acid and 0.1M potassium chloride as supporting electrolyte with Zn (II) concentration in the range (25-100 mg $dm^{-3}$). Polarization curves at different zinc ion concentration are reported. Hydrogen and oxygen reduction has also been considered.The diffusion coefficients and mass transfer coefficient were obtained using limiting diffusion current technique based on zinc ion reduction. A least squares analysis indicates that the laminar flow results for 13067 < Re > 57552 and 550 < Sc > 1390 can be correlated by the following equation with correlation coefficient (CR) equal to 0.98: $sh=0.61Re^{0.5}Sc^{1/3}$.

• Bulletin of the Korean Chemical Society
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• v.31 no.9
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• pp.2701-2704
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• 2010

This work shows that both L2 and L3 bearing two and four N-$(CH_2)_2OCH_3$ groups, respectively, can be prepared selectively by the reaction of $L^1$ with 1-bromo-2-methoxyethane. The di-N-substituted macrocycle $L^2$ readily forms its copper(II) and nickel(II) complexes. The N-$(CH_2)_2OCH_3$ groups in $[CuL^2]^{2+}$ are coordinated to the metal ion, whereas those in $[NiL^2]^{2+}$ are not involved in coordination. Interestingly, $L^3$ reacts with $Cu^{2+}$ ion to form $[Cu(HL^3)]^{3+}$, in which one tertiary amino group is not involved in coordination.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.127-128
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• 2014

현재 기술 산업에서 PET위 무전해 도금을 실행하기 위해 다양한 전처리 공정과 Catalyst가 소개되고 있다. 그 중에서 가장 일반적으로 사용되고 있는 Catalyst는 Palladium으로서 Tin과 산화 환원 반응으로 Electroless Copper Deposition 단계에서 구리 도금의 Target으로 작용하고 있다. 하지만 상대적으로 Palladium은 생산 비용이 높으며 Tin은 쉽게 산화되는 문제점이 남아 있다. 이를 대체하기 위한 대안 공정으로서 Palladium 대신 Silver를 이용하여 Catalyst로서의 역할을 하는 공정이다. 이전에 PET위 전처리 공정으로 Ultra Violet을 사용하여 표면을 개질 시키는 방법을 연구했으며, 그 후 Potassium Permanganate와 Silver Catalyst의 Mechanism을 연구 했다. PET 표면 개질을 거치면서 화학 구조가 바뀌어 표면에 Carbon Carbon Double Bond를 형성한다. 이때 Permanganate ion이 새로이 형성된 이중 결합과 반응하여 두 개의 extra-OH functional group을 생성함과 동시에 $MnO_2$를 만들어 표면에 흡착 시킨다. $MnO_2$는 전위차에 의해 Silver Ion과 Redox Reaction을 일으키며 실질적인 Catalyst 역할을 하게 된다. Silver Catalyst는 무전해 구리 도금 용액 안에서 Copper의 Target으로 작용한다.

• Journal of the Korean Ceramic Society
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• v.54 no.5
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• pp.438-442
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• 2017

This paper reports the facile synthesis of microlamella-structured porous copper (Cu)-oxide-based electrode and its potential application as an advanced anode material for lithium-ion batteries (LIBs). Nanowire-like Cu oxide, which is created by a simple thermal oxidation process, is radially and uniformly formed on the entire surface of Cu foam that has been fabricated using a combination of water-based slurry freezing and sintering (freeze casting). Compared to the Cu foil with a Cu oxide layer grown under the same processing conditions, the Cu foam anode with 63% porosity exhibits over twice as much capacity as the Cu foil (264.2 vs. 131.1 mAh/g at 0.2 C), confirming its potential for use as an anode electrode for LIBs.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.1-8
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• 2003

Adhesion between rubber compound and copper-film-coated steel plate (abbreviated hereafter as copper film plate) with different thicknesses of copper film was investigated. Two different methods were employed for the preparation of the copper film plates: a substitution plating of preelectroplated zinc with copper ion and a vacuum sputtering of copper on steel plate. Adhesion strength of the copper film plates with rubber compounds was largely dependent upon the thickness of copper film, regardless of their preparation methods. The copper film plates with thinner thickness than 75 nm showed high adhesion comparable to brass, while those with thicker copper film showed poor adhesion due to excessive growth of copper sulfide at adhesion interface.

• Journal of the Korean Applied Science and Technology
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• v.26 no.1
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• pp.69-73
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• 2009

Copper alloy metal fiber was incorporated into the conventional water-soluble metal working fluids to increase the antimicrobial activity. Fluid treated by copper alloy metal fiber is shown that bacteria is disappeared whereas that untreated metal fiber is increased bacteria as increasing the life time. When the electrochemical potential of Cu/Zn ion is -268mV, radicals with molecular oxygen are easily made. Especially, hydroperoxide radical shows strong toxicity to the strains, leading to the conformational change of plasma membrane. As a result antimicrobial activity of copper alloy metal fiber in metal working fluid is superior to that of copper fiber.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1444-1446
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• 1998

Direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films using a focused argon ion laser beam($\lambda$ =514.5nm) on a glass. The thickness and linewidth of the deposited copper films were considered as a function of laser power and scan speed. As the result from AES, there are no other elements except for copper after decomposition in the atmospheric ambient.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.297-301
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• 2006

Si/Mo multilayer anode consisting of active/inactive material was prepared using rf/dc magnetron sputtering. Molybdenum acts as a buffer against the volume change of the Silicon. Multilayer deposited on RT (reversible treatment) copper foil current collector to enhance adhesion between Silicon and copper foil. Deposited Silicon was identified as an amorphous. Amorphous has a relatively open structure than crystal structure, thus prevents the lattice expansion and has many diffusion paths of Li ion. When deposited time of Silicon and Molybdenum is 30 second and 2 second respectably, electrode has more capacity and good cycle stability. A 3000 nm thick multilayer was maintained 99% of the initial capacity (1624 $mAhg^{-1}$) after 100 cycles. As the increase of the multilayer thickness (4500 nm, 6000 nm), Si/Mo mutilayer anodes show aggravation cycle stability.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1791-1793
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• 1998

The thin film metal electrode for PDP needs low resistivity and strong adhesion. But the sputtered copper film is weak, in the adhesion between copper and glass. In this paper, we investigated the characteristics of resistivity and adhesion about Cu thin film using Ion Beam Assisted DC Planar Magnetron Sputtering(DCPM) Device.

• Bulletin of the Korean Chemical Society
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• v.23 no.7
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• pp.943-947
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• 2002

The two reactions between iron ion (Fe3+ ) and o-chlorophenylfluorone (o-CPF) and copper ion (Cu2+ ) and o-CPF are sensitive at pH 6 in the presence of Triton X-100. We have determined the formation constants of the complexes by the spectral correction technique. Because of the poor selectivity of o-CPF to metals, the competition coordination of only the iron ion from the Cu-o-CPF complex was found and applied to the selective detection of iron traces by the Selective Competition Coordination Determination (SCCD) approach.The analysis of several samples shows that the relative standard deviations are less than 5.0% and the recovery of iron ions between 94.5% and 106%.