• 분석과학
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• 제14권6호
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• pp.540-544
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• 2001

Determination of cyanide ion has been studied by adsorptive stripping voltammetry using hanging mercury electrode. Cyanide ion complexed with copper ion is adsorpbed on the electrode and oxidised at the positive potential scan. Optimal conditions of CN determination were found to be ; supporting electrolyte solution ; 0.1 M NaCl of ammonium buffer at pH 10, accumulation potential; -800 mV vs Ag/AgCl, accumulation time ; 300 s, scan rate ; 50mV/s. The linear concentration of cyanide ion was observed in the range $1{\times}10^{-8}$, $1{\times}10^{-7}M$. The detection limit(n/s=3) was $0.13{\mu}g/L$($5{\times}10^{-9}M$) with 3.5% RSD.

• 자원리싸이클링
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• 제17권4호
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• pp.37-46
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• 2008

본 연구는 전자산업으로부터 발생하는 CMP 폐수와 유사한 $0.3{\sim}0.5mg/ml$ 구리를 함유한 조제 황산 용액으로부터 DOWEX G-26 양이온 교환 수지를 사용한 구리 회수 공정 개발에 관한 것이다. 함구리 황산 용액으로부터 구리를 회수하기 위해 용액의 pH, 수지의 사용량, 용액의 산 농도, 용액과 수지의 접촉시간 등을 변수로 다양한 조건에서의 회수 실험을 실시하였다. 평형 pH 2.5, 용액/수지의 비 100mL/g 조건에서 14분의 접촉으로 99.99%의 구리가 흡착되었다. 구리의 흡착은 Langmuir isotherm을 따랐으며, 반응치수는 2차였다. 흡착된 구리는 묽은 황산에 의해 수지로부터 효과적으로 용리되었으며, 이로부터 농축용액을 만들 수 있었다.

• Journal of Radiation Protection and Research
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• 제42권1호
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• pp.63-68
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• 2017

Background: The combined effect of the low energy electron (LEE) irradiation and $Cu^{2+}$ ion on DNA damage was investigated. Materials and Methods: Lyophilized pBR322 plasmid DNA films with various concentrations (1-15 mM) of $Cu^{2+}$ ion were independently irradiated by monochromatic LEEs with 5 eV. The types of DNA damage, single strand break (SSB) and double strand break (DSB), were separated and quantified by gel electrophoresis. Results and Discussion: Without electron irradiation, DNA damage was slightly increased with increasing Cu ion concentration via Fenton reaction. LEE-induced DNA damage, with no Cu ion, was only 6.6% via dissociative electron attachment (DEA) process. However, DNA damage was significantly increased through the combined effect of LEE-irradiation and Cu ion, except around 9 mM Cu ion. The possible pathways of DNA damage for each of these different cases were suggested. Conclusion: The combined effect of LEE-irradiation and Cu ion is likely to cause increasing dissociation after elevated transient negative ion state, resulting in the enhanced DNA damage. For the decrease of DNA damage at around 9-mM Cu ion, it is assumed to be related to the structural stabilization due to DNA inter- and intra-crosslinks via Cu ion.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2000년도 춘계총회 및 학술발표회
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• pp.21-21
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• 2000

• 환경위생공학
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• 제21권3호
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• pp.52-60
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• 2006

The ion exchange resins have been synthesized from chlormethyl styrene-1,4-divinylbenzene(DVB) with 1%, 2%, and 20%-crosslinking and macrocyclic ligand of cryptand 21 by copolymerization method and the adsorption characteristics of uranium(VI), copper(II) and dysprosium(III) metallic ions have been investigated in various experimental conditions. The synthesis of these resins was confirmed by content of chlorine, element analysis, and IR-spectrum. The effects of pH, equilibrium time, dielectric constant of solvent and crosslink on adsorption of metallic ions were investigated. The metal ion was showed fast adsorption on the resins above pH 3. The optimum equilibrium time for adsorption of metallic ions was about two hours. The adsorption selectivity determined in ethanol was in increasing order uranium$(UO^{2+}_2)\;>\;copper(Cu^{2+})\;>\;dysprosium(Dy^{3+})$ ion. The adsorption was in order of 1%, 2%, and 20% crosslink resin and adsorption of resin decreased in proportion to order of dielectric constant of solvents.

• Journal of Welding and Joining
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• 제31권6호
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• pp.58-64
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• 2013

Several joining methods involving resistance welding, laser welding, ultrasonic welding and mechanical joining are currently applied in manufacturing lithium-ion batteries. Cu and Al alloys are used for tab and bus bar materials, and laser welding characteristics for these alloys were investigated with similar and dissimilar material combinations in this study. The base materials used were Al 1050 and oxygen-free Cu 1020P alloys, and a disk laser was used with a continuous wave mode. In bead-on-plate welding of both alloys, the joint strength was higher than the strength of O tempered base material. In overlap welding, the effect of welding parameters on the tensile shear strength and bead shape was evaluated. Tensile shear strength of overlap welded joint was affected by interfacial bead width and weld defect formation. The tensile-shear specimen was fractured at the heat affected zone by selecting proper laser welding parameters.

• 한국환경과학회지
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• 제23권9호
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• pp.1583-1591
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• 2014

PVA-D2EHPA/TOPO beads containing two extractants, di-(2-ethylhexyl) phosphoric acid (D2EHPA) and trioctylphoshine oxide (TOPO) were prepared for the removal of copper ions from aqueous solution. The prepared PVA-D2EHPA/TOPO beads were characterized by SEM and FT-IR. The removal characteristics of copper ions by PVA-D2EHPA/TOPO beads was investigated using batch and continuous systems. In batch experiments, the maximum removal capacity calculated from Langmuir isotherm model was 18.6 mg/g and the optimal pH was in the range of 4.5~6. The continuous experiments showed that the removal capacity of copper ions increased with increasing inlet copper ion concentrations and bed heights, but decreased with increasing inlet flow rates.

• Bulletin of the Korean Chemical Society
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• 제23권10호
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• pp.1394-1398
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• 2002

A novel copper(II) membrane electrode based on diphenylisocyanate bis(acetylacetone) ethylenediimine (DIBAE), as a new hexadentates Schiff's base was prepared. The electrode exhibited a Nernstian response for Cu$^{2+}$ ions over a wide concentration range (1.0 ${\times}$ 10$^{-1}$ to 1.0 ${\times}$ l0$^{-6}$ M) with a limit of detection of 6.0 ${\times}$ 10$^{-7}$ M (39 ppb). The sensor shows a fast response time (15s) and the membrane can be used for more than 4 months without observing any major deviation. The electrode revealed very good selectivity with respect to many cations including alkali, alkaline earth, transition and heavy metal ions. The proposed sensor could be used in a pH range of 3.0-7.5. It was applied to the direct potentiometric determination of copper in black tea, and in wastewater of copper electroplating samples. The electrode was also used in potentiometric titration of the copper(II) ion with EDTA.

• 대한화학회지
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• 제57권5호
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• pp.568-573
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• 2013

A selective and sensitive method for simultaneous determination of copper in blood by adsorptive differential pulse cathodic stripping voltammetry is presented. The procedure involves an adsorptive accumulation of Cu(II)-ETSC (4- ethyl-3-thiosemicarbazide) on a hanging mercury drop electrode, followed by a stripping voltammetry measurement of reduction current of adsorbed complex at about -715 mV. The optimum conditions for the analysis of copper (II) ion are : pH 10.3, concentration of 4-ethyl-3-thiosemicarbazide $3.25{\times}10^{-6}$ M and an accumulation potential of -100 mV. The peak current is proportional to the concentration of copper over the range 0.003-125 ng/mL with a detection limit of 0.001 ng/mL and an accumulation time of 60 s. Moreover, with the use of the proposed method, there is a considerable improvement in the detection limit, the linear dynamic range and the deposition time, compared with the methods of adsorptive stripping voltammetry for the determination of copper. The developed method was validated by analysis of whole blood certified reference materials.

• 한국재료학회지
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• 제16권11호
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• pp.710-714
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• 2006

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).