• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 제3회 압연심포지엄 논문집 압연기술의 미래개척 (Exploitation of Future Rolling Technologies)
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• pp.293-300
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• 1999

A mathematical model for the analysis of roll gap phenomena in strip temper rolling process is described. The mechanical peculiarities of temper rolling process, such as high friction value and non-circular contact arc, low reduction and non-negligible entry and exit elastic zones as well as central restricted deformation (preliminary displacement or sticking) zone etc., are all taken into account. The deformation of work rolls is calculated with the influence function method and arbitrary contact arc shape is permitted. The strip deformation is modeled by slab method and the entry and exit elastic deformation zones are included. The restricted deformation zone near the neutral point is also considered. The concept and the calculation method of limiting preliminary displacement are used to determine the length of the central restricted deformation zone. The comparison of the model results with the measured mill data is also made.

• 한국정밀공학회지
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• 제27권1호
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• pp.58-63
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• 2010

A new contact force estimation technique is proposed. Keeping the contact force at a certain level between finishing tool and the object is essential since the quality of the finished surface is very sensitive to the contact force during the finishing process. However, the contact force measurement cannot be obtained by simply installing load cells under machine table or in the middle of tool linkage. The reason is that the weight of the machine table and the tool linkage are much heavier than the force to be measured. To that end, a method for estimating disturbance is proposed for a system that is similar to the mechanism of the finishing machine, and the same method is applied to estimate the contact force of the brush-type finishing machine. To verify the effectiveness of the proposed method, a small scale test set-up has been built and the method has been tested.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• 대한기계학회논문집A
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• 제31권3호
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• pp.380-387
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• 2007

We carried out an image analysis of living cells forming their contacts at the bottom of the cell culturing substrate. In order to visualize the contact area selectively, we adopted total-internal-reflection-fluorescence (TIRF) method, which can illuminate the specimen volume within only several hundred nano-meters above the substrate. From the fluorescent intensity of the TRF image, we could calculate the distance of the cell surface from the substrate. As a result, we visualized the origin of cell contacts, their movements, and the change of cell-contact type from the close-contact into focal-contact with information of its vertical displacement representing the temporal evolution process of the three-dimensional cell-surface-profile near the contact area during this metamorphosis.

• 소성∙가공
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• 제29권3호
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• pp.144-150
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• 2020

In this paper, we propose the generation of a double enveloping worm thread profile with a non-developable ruled surface. Thread surface machining cuts all the way from the tip to the tooth root at one time, like full-face contact machining, rather than cutting several times like point machining. This cutting can reduce the cutting duration and achieve the smooth surface that does not require a grinding process for the threaded surface. The mathematical model of the cutting process was developed from theoretical equations, and the tooth surface was generated using two parameters and modeled in the CATIA using the generated Excel data. Additionally, the machining process of the worm was simulated in a numerical control simulation system. To verify the validity of the proposed method, the deviation between the modeling and the workpiece was measured using a 3D measuring machine.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.525-529
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• 2018

The antireflective (AR) coated poly methyl methacrylate (PMMA) substrate was deposited by atomic layer deposition (ALD) on a self-assembled monolayer (SAM) to improve hydrophobicity and mechano-chemical properties of organic thin films. The water contact angles (WCA) were tested to characterize the surface wettability of SAM octadecyltrichlorosilane (OTS) films. Results showed that a contact angle of $105.9^{\circ}$ was obtained for the SAM films with an annealing process, and the highest WCA of $120^{\circ}$ was achieved for the films prepared by the SAM and ALD multi-process. The surface morphology of the SAM films with different assembly times and varying number of ALD cycles was obtained by atomic force microscopy (AFM). The maximum light transmittance for the SAM films on the PMMA substrate reached 99.9% at a wavelength of 450 nm. It was found that the SAM surfaces were not affected at all by the ALD process.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권8호
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• pp.438-444
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• 2000

We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.235-240
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• 2009

Crystlline silicon solar cells markets are increasing at rapid pace. now, crystlline silicon solar cells markets screen-printing solar cell is occupying. screen-printing solar cells manufacturing process are very quick, there is a strong point which is a low cost. but silicon and metal contact, uses Ag & Al pates. because of, high contact resistance, high series resistance and sintering inside process the electric conductivity decreases with 1/3. and In pastes ingredients uses Ag where $80{\sim}90%$ is metal of high cost. because of low cost solar cells descriptions is difficult. therefore BCSC(Buried Contact Solar Cell) is developed. and uses light-induced plating, ln-line galvanization developed equipments. Ni/Cu matel contact solar cells researches. in Germany Fraunhofer ISE. In order to manufacture high-efficiency solar cells, metal selections are important. metal materials get in metal resistance does small, to be electric conductivity does highly. efficiency must raise an increase with rise of the curve factor where the contact resistance of the silicon substrate and is caused by few with decrement of series resistance. Ni metal materials the price is cheap, Ti comes similar resistance. Cu and Ag has the electric conductivity which is similar. and Cu price is cheap. In this paper, Ni/Cu/Ag metal contact cell with screen printing manufactured, silicon metal contact comparison and analysis.