• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.26-27
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• 1992

The effect of activation and electroless nickel plating conditions on contact properties were investigated for selective electroless nickel plating of Si farers in order to obtain an optimum condition of contact hole filling. According to RCA prosess, p-type si 1 icon (100) surface was cleaned out and activated. The effects of temperture, DMAB concentration, time, and stirring iwere investigated for activation of p-type Si(100) surface. The optimal activation condition obtained was 0.5M HF, 1mM PdCl$_2$, 2mM EDTA, 7$0^{\circ}C$, 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentration, pH, and plating ti me were studied. The optimal plating condition found was 0. 10M NiS0$_4$.$H_2O$, 0.lIM Citrate, pH 6.8, 6$0^{\circ}C$, 30 minutes. The contact resistence of fi]ms wascomparatively low. It took 30 minutes to obtain 1$\mu$m thick film with 8$\mu$M DMAB concentration. The film surface roughness was improved with increasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained with the condition of temperature 6$0^{\circ}C$ and pH 6.8. The micro-victors hardness of film was about 600Hv and was decreased wi th increasing particle size of plating layer.

• Journal of ILASS-Korea
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• v.20 no.3
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• pp.181-186
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• 2015

This study presents the dynamic wetting characteristics of an impact droplet on hole-patterned textured surfaces. The flat surfaces were manufactured by a drilling machine to generate the micro-order holes, leading to make the surface hydrophobic. Other flat surfaces were fabricated by the anodizing technique to make hydrophilic texture surfaces with a nanometer order. For hydrophilic and hydrophobic textured surfaces with similar texture area fractions, the impinging droplet experiments were conducted and compared with flat surface cases. As results, an anodized textured surface decreases apparent equilibrium contact angle and increases contact diameters, because of increase in contact area and surface energy. This is attributed to more penetration inside holes from larger capillary pressure on nanometer-order holes. On the other hand, temporal evolution of the contact diameter is smaller for the hydrophobic textured surface from less penetration on the micro-order holes.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.12-17
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• 2003

본 연구에서는 MICP Etching system 을 이용한 Via contact 및 Deep contact hole etch process 특성을 연구하였다. Langmuir probe 를 이용한 MICP source 의 Plasma density & electron temperature 측정하였고 탄소와 플로우르를 포함하는 혼합 Plasma 를 형성하여 RF frequency, wall temperature, chamber gap, gas chemistry 등의 변화에 따른 식각 특성을 조사하였다. Plasma density 는 1000w 에서 $10^{11}$/$cm^3$ 이상의 high density plasma와 uniform plasma 형성을 확인하였고 $CH_{2}F_{2}$와 CO의 적절한 혼합비를 이용하여 Oxide to PR 선택비가 10 이상인 고선택비 조건을 확보하였다. 고선택비 형성에 따라 Polymer 형성이 많이 되었고 이를 개선하기 위하여 반응 챔버의 온도 조절을 통하여 Polymer 증착 방지에 효과적인 것을 확인하였다. MICP source를 이용하여 탄소와 플로우르의 혼합 가스와 식각 챔버의 온도 조절에 의한 선택비 증가를 확보하여 High Aspect Ratio Contact Hole Etch 가능성을 확보하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.186-187
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• 1994

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.11
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• pp.78-85
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• 2020

The scaffolding system, which is a construction workbench of the cargo containment for a membrane LNG carrier, is a large truss structure composed of various members. To shorten the installation period and process of the scaffolding system, it is effective to enlarge the mounting unit from the existing two stages to eight stages. Owing to the increase in lifting load according to the large size of the module, the stresses around the pin and hole will be increased significantly. In this study, a tensile strength test and contact stress analysis were performed to confirm the structural safety. The relatively large hole deformation was observed visually near the average load generated in the vertical pipe at the top through tensile strength tests. A contact stress calculation confirmed the stress distribution around the hole. The contact problem was dealt with in terms of the Herzian contact stress. The possibility of 8-stage loading was examined by comparing the yield strength and contact stresses of failure critical locations. As a result, the 8-stage loading method of the existing scaffolding material was inadequate, and a new loading method with proper safety is proposed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.4277-4283
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• 2012

Slip coefficient, whose value is dependent on the condition of contact surface at the friction joint of high tension bolt, is determined by slip load. Because contact area affects slip load, contact area that varies with bolt hole size is also related to the slip coefficient. In this study, we manufactured 32 specimens and performed bending and tension tests in order to examine changes in slip coefficient and load with material type, bolt diameter, and size of bolt hole. Slip load of specimens with oversize bolt hole had strength that was more than 80% higher than the slip load of specimens with standard bolt hole, and it also exceeded the design slip strength. In addition, we observed significant correlation between net-section ratio and slip ratio of specimens with oversize and standard bolt hole. However, some differences between the specimens are thought to have been caused by reduction in initial axial force of high tension bolt, which is an important parameter of slip coefficient. It is self-evident that increased bolt hole size would lead to decrease in design strength as it reduces both slip coefficient and bolt axial force. Nevertheless, we suggest that some flexibility in regulation of bolt hole, as long as it does not threaten the structural stability, may be a positive factor in terms of workability and efficiency.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1786-1790
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• 2004

The main objective of this paper is to analyze the performance of various force control algorithms in improving and adjusting the compliance of industrial robots in contact with their environment. Some of fundamental force control algorithms such as sensorless control, impedance control and hybrid position/force control are theoretically analyzed and simulated for various situations of an environment, and then a series of experiments using them were performed. In this paper, a control scheme to use position control in implementing the impedance control was investigated in order to nullify the effect of joint friction. The new reference trajectory is generated using contact force feedback and original desired trajectory. And an inner position control loop is designed to provide accurate position tracking for the new reference trajectory and good disturbance rejection. Experiments to insert a peg in a hole (so-called the peg-in-a-hole task) were performed with HILS (hardware-in-theloop simulation) system based on the results of the analyses and simulations on the characteristics of each control algorithm. The experiments showed that various force control methods improved the performance of robots in close contact with the environment by adjusting their compliance with respect to an arbitrary set of coordinates.

• Tribology and Lubricants
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• v.39 no.2
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• pp.56-60
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• 2023

In this study, we evaluate the anisotropic flow of droplets according to the directionality of asperities. We manufacture a mold with an inclined hole by adjusting the jig angle using a high-power diode laser. Using the manufactured mold, we prepare specimens for wettability studies by the micro molding technique. We fabricate twelve kinds of surfaces with micro-asperities inclined at 0°, 15°, 30°, and 45° for asperity pitches of 100 ㎛, 200 ㎛, and 300 ㎛. We evaluate the static and dynamic behaviors of the droplets as a function of the asperities pitch and inclination angles. The anisotropic effect increases as the pitch increases between asperities, and the anisotropic flow characteristics increase as the inclination angle of the asperities increases. On the surface with hole pitches of 100 ㎛ and 200 ㎛, the contact angle of the droplet shows high hydrophobicity at approximately 160°, but on the surface with the 300-㎛ hole pitch, the contact angle is approximately 110°, indicating that the hydrophobic effect rapidly reduces. Additionally, when the inclination angle of the asperities is approximately 30°, the left and right contact angle deviations of the droplet are the lowest, showing that the roll-off angle is relatively low.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1149-1155
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• 1997

J-integral for a subsurface horizontal crack in a circular plate with an inner hole under rolling line contact is evaluated according to loading positions with various load conditions, crack length and crack location. Two-dimensional crack is modeled, and the relation between Tresca stress for uncracked model and J-integral is discussed. The loading location which gives the maximum J-integral depends on load condition and crack location, and the presence of friction force increases Tresca stress and J-integral near the surface. Regardless of friction force, crack location that gives maximum J-integral is the same as that of maximum Tresca stress in an uncracked model, and the value of J-integral is propotional to crack length. It is also showed that the variation of an inner radius of a disk does not effect J-integral value.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.474-479
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• 1993

Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.