Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1992.05b
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- Pages.26-27
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- 1992
Selective Contact Hole Filling by Electroless Ni Plating
무전해Ni도금에 의한 선택적 CONTACT HOLE 충진
Abstract
The effect of activation and electroless nickel plating conditions on contact properties were investigated for selective electroless nickel plating of Si farers in order to obtain an optimum condition of contact hole filling. According to RCA prosess, p-type si 1 icon (100) surface was cleaned out and activated. The effects of temperture, DMAB concentration, time, and stirring iwere investigated for activation of p-type Si(100) surface. The optimal activation condition obtained was 0.5M HF, 1mM PdCl
반도체 기억소자 contact hole의 선택적 충진의 최적 조건을 연구하기 위하여 무전해Ni도금방법을 채택하여 실리콘의 활성화와 선택적 도금의 공정조건이 Contact Hole 도금피막의 제반 특성에 미치는 영향을 조사하였다. p형 실리콘 100 소지 표면의 활성화 처리는 RCA처리에 의해 먼저 표면을 세척한 다음 온도, PdCl
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