• Polymer Science and Technology
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• v.3 no.1
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• pp.3-12
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• 1992

• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.41-47
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• 2012

The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.

• Journal of the Korean Applied Science and Technology
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• v.30 no.3
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• pp.472-479
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• 2013

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from $350^{\circ}C{\sim}470^{\circ}C$.

• Journal of the Korean Applied Science and Technology
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• v.31 no.2
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• pp.329-336
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• 2014

The conductive polymer composites have attracted considerable attention in the field of industry due to their electrical properties. To understand electrical properties of the composites, their volume specific resistance was measured. Electrical conductivity results showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in the composites composed of conductive filler and insulating matrix. It was found that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. The purpose of this study was to examine electrical properties of the epoxy resins filled with nickel. The sample was prepared using vehicle such as epoxy resin replenished with nickel powder, and the evaluation on their practical use was performed in order to apply them to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 4.666~13.074 when using nickel powder. Weight loss of the conductive composites took place at $350^{\circ}C{\sim}470^{\circ}C$.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10b
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• pp.169-170
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• 2003

There was little development in transparent conductive polymer films and their limited studies have been mainly focused on polymer films coated by water-soluble PEDOT doped with the polymeric counteranion poly(4-styrenesulfonate) (PEDOT-PSS)[1-3]. However PEDOT-PSS as coating material has some difficulties because of high viscosity and low solubility in organic solvent except for in water. In this study, in order to extend practical applications of PEDOT and to prepare conductive PC films, we tried to prepare PEDOT-coated PC films and investigated their conductivity and thermal stability. (omitted)

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.116.1-116.1
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• 2011

Materials with a combination of high electrical conductivity and optical transparency are important components of many electronic and optoelectronic devices such as liquid crystal displays, solar cells, and light emitting diodes. In this study, to fabricate a low-resistance and high optical transparent electrode film for organic photovoltaic, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of thermal roll imprinted (TRI) poly-carbonate (PC) patterned films, the manufacture of high-conductivity and low-resistance Ag paste which was filled into patterned PC film using a doctor blade process and then coated with a thin film layer of conductive polymer by a spin coating process. As a result of these imprinting processes the PC films obtained a line width of $10{\pm}0.5{\mu}m$, a channel length of $500{\pm}2{\mu}m$, and a pattern depth of $7.34{\pm}0.5{\mu}m$. After the Ag paste was used to fill part of the patterned film with conductive polymer coating, the following parameters were obtained: a sheet resistance of $9.65{\Omega}$/sq, optical transparency values were 83.69 % at a wavelength of 550 nm.

• Polymer(Korea)
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• v.24 no.5
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• pp.673-681
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• 2000

Electrically conductive composites have been prepared by treating fabrics with oxidizing agent and exposing them to aniline, which deposited a substantial amount of conductive polymer within the interstices of the material. However the conductivity of the composite fabrics was limited by the irregular deposition of the conductive polymer layer. To improve the conductivity of polyaniline/nylon 6 composite fabrics, we modified the surface characteristics of nylon 6 fabrics by various plasma treatments and increased diffusion and adsorption of aniline by ultrasonic treatments. By the oxygen plasma treatment, attachment of functional groups such as C-O and C-OH increased on the surface of nylon 6 fiber, which promoted adhesion to polyaniline resulting in the higher add-on and electrical conductivity. Electrical conductivities of polyaniline/nylon 6 composite fabrics were highly increased by ultrasonic treatment, which assisted the diffusion of aniline into the inside of nylon fabrics by cavitation and vibration. Also, the effects of monomer concentration and the number of deposition cycles on the nylon 6 fabric conductivity Were investigated. As a result, the fabric conductivity increased with the monomer concentration and the number of polymerization deposition cycles.

• Polymer Science and Technology
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• v.2 no.3
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• pp.149-157
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• 1991

• Polymer(Korea)
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• v.38 no.6
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• pp.782-786
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• 2014

Various kinds of thermal conductive ceramic/polymer composites (aluminum nitride, aluminum oxide, boron nitride, and silicon carbide/epoxy) were prepared by a casting method and their optical images were observed by FE-SEM. Among these, SiC/epoxy composite shows inhomogeneous dispersion features of SiC and air voids in the epoxy matrix layer, resulting in undesirable thermal conductive properties. To enhance the thermal conductivities of SiC/epoxy composites, the epoxy wetting method which can directly infiltrate the epoxy droplet onto filtrated SiC cake was employed to fabricate the homogeneously dispersed SiC/epoxy composite for ideal thermal conductive behavior, with maximum thermal conductivity of 3.85W/mK at 70 wt% of SiC filler contents.

• Polymer(Korea)
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• v.24 no.2
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• pp.268-275
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• 2000

We investigated the effect of polymer sublayer on volumetric resistivity and tensile strength of carbon fiber (CF)/polyethylene composite films fabricated under high intensity electric fields. The dependence of volumetric resistivity and tensile strength of the films on the polymer sublayer thickness or mass part exhibited complex behavior according to CF content and CF layer density in the films. As the thickness of polymer sublayer increases, two groups of processes at thermo-mechanical forming stage would take effects in the properties of the films. The first group comprises the increase of polymer layer thickness having reduced CF content compared with central or upper part of the film and insufficient wetting of CF resulting in the loosened structure near upper film side. The second group, on the other hand, is the improvement of mobility of molten sublayer leading to better distribution of CF throughout the film thickness and the formation of more compact structure. The different degree of contribution of these two competing processes at varied CF content and CF layer density could explain complex dependence of the film properties on the polymer sublayer. These results are important to optimize the electrical and mechanical properties of highly conductive polymer films, which can be used as electromagnetic interference shielding materials.