1 |
W. Lin, K. S. Moon, and C. P. Wong, Adv. Mater., 21, 2421 (2009).
DOI
ScienceOn
|
2 |
Y. Mamunya, A. Boudenne, N. Lebovka, L. Ibos, Y. Candau, and M. Lisunova, Compos. Sci. Technol., 68, 1981 (2008).
DOI
ScienceOn
|
3 |
A. Yu, P. Ramesh, M. E. Itkis, E. Bekyarova, and R. C. Haddon, J. Phys. Chem. C, 111, 7565 (2007).
DOI
ScienceOn
|
4 |
Z. Shi, M. Radwan, S. Kirihara, Y. Miyamoto, and Z. Jin, Appl. Phys. Lett., 95, 224104 (2009).
DOI
|
5 |
S. V. Garimella, A. S. Fleischer, J. Y. Murthy, A. Keshavarzi, R. Prasher, and C. Patel, IEEE Trans. Compon. Packag. Technol., 31, 801 (2008).
DOI
|
6 |
R. Prasher, Proc. IEEE, 94, 1571 (2006).
DOI
ScienceOn
|
7 |
F. Sarvar, D. C. Whalley, D. A. Hutt, P. J. Palmer, and N. J. Teh, Microelectron. Int., 24, 66 (2007).
DOI
|
8 |
T. L. Li and S. L. C. Hsu, J. Phys. Chem. B, 114, 6825 (2010).
DOI
|
9 |
C. Zhi, Y. Bando, T. Terao, C. Tang, H. Kuwahara, and D. Golberg, Adv. Funct. Mater., 19, 1857 (2009).
DOI
ScienceOn
|
10 |
F. Yang, X. Zhao, and P. Xiao, J. Eur. Ceram. Soc., 30, 3111 (2010).
DOI
|
11 |
W. Zhou, S. Qi, Q. An, H. Zhao, and N. Liu, Mater. Res. Bull., 42, 1863 (2007).
DOI
ScienceOn
|
12 |
T. Zhou, X. Wang, G. U. Mingyuan, and X. Liu, Polymer, 49, 4666 (2008).
DOI
ScienceOn
|
13 |
S. Vyazovkin and N. Sbirrazzuoli, Macromol. Chem. Phys., 201, 199 (2000).
DOI
|
14 |
T. Terao, C. Zhi, Y. Bando, M. Mitome, C. Tang, and D. Golberg, J. Phys. Chem. C, 114, 4340 (2010).
|