• Journal of the Korean GEO-environmental Society
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• v.24 no.1
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• pp.15-23
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• 2023

The grouting method is a method of construction for the purpose of waterproofing and reinforcing soft ground. When grout is injected into the ground, there are various types of penetration and diffusion of grout depending on the shape of the ground, the size of soil, the porosity, and the presence or absence of groundwater. the current situation. Therefore, in this study, to investigate the penetration performance of the grouting to conductive material, laboratory tests were performed on the addition of the conductive material. In the injection test, 0%, 3%, and 5% of the mixed water were added as conductive materials to the grout, and the original ground condition was composed of various types of ground composed of gravel and silica sand. Conductive grout is injected by pressure into the model ground using a dedicated injection device, and the injection time (t), pressure (p), flow rate (v) and injection amount (q) are measured, and the hardened body injected in the model ground is collected. Penetration performance was evaluated. In the results of the grout injection experiment, the amount of conductive material used and the grout injection rate showed an inverse relationship, and it was confirmed that the penetration pattern was changed according to the size of the soil particles in the model ground. The grout containing the conductive material has relatively good penetration into the ground and excellent strength and durability of the hardened body, so it was judged that it could be used as an additive for measuring the penetration range of the grout.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.11
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• pp.993-998
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• 2014

Silver (Ag) grid patterned PET substrates were manufactured by thermal roll-imprinting methods. We coated highly conductive layer (HCL) as a supply electrode on the Ag grid patterned PET in the three kinds of conditions. One was no-HCL without conductive PEDOT:PSS on the Ag grid patterned PET substrate, another was thin-HCL coated with ~50 nm thickness of conductive PEDOT:PSS on the Ag grid PET, and the other was thick-HCL coated with ~95 nm thickness of conductive PEDOT:PSS. These three HCLs in order showed 73.8%, 71.9%, and 64.7% each in transmittance, while indicating $3.84{\Omega}/{\Box}$, $3.29{\Omega}/{\Box}$, and $2.65{\Omega}/{\Box}$ each in sheet resistance. Fabrication of organic solar cells (OSCs) with HCL Ag grid patterned PET substrates showed high power conversion efficiency (PCE) on the thin-HCL device. The thick-HCL device decreased efficiency due to low open circuit voltage ($V_{OC}$). And the Ag grid pattern device without HCL had the lowest energy efficiency caused by quite low short current density ($J_{SC}$).

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.116.1-116.1
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• 2011

Materials with a combination of high electrical conductivity and optical transparency are important components of many electronic and optoelectronic devices such as liquid crystal displays, solar cells, and light emitting diodes. In this study, to fabricate a low-resistance and high optical transparent electrode film for organic photovoltaic, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of thermal roll imprinted (TRI) poly-carbonate (PC) patterned films, the manufacture of high-conductivity and low-resistance Ag paste which was filled into patterned PC film using a doctor blade process and then coated with a thin film layer of conductive polymer by a spin coating process. As a result of these imprinting processes the PC films obtained a line width of $10{\pm}0.5{\mu}m$, a channel length of $500{\pm}2{\mu}m$, and a pattern depth of $7.34{\pm}0.5{\mu}m$. After the Ag paste was used to fill part of the patterned film with conductive polymer coating, the following parameters were obtained: a sheet resistance of $9.65{\Omega}$/sq, optical transparency values were 83.69 % at a wavelength of 550 nm.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.107-108
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• 2000

We propose the method which is possible to fabricate the electrodes with the fine pattern and low resistance by photolithography and electroplating. The widths of pattern fabricated were 30, 50, 70 and 100um and the thickness could be up to $10{\mu}m$. The resistivity of the copper electrode electroplated was below $2.0{\mu}{\Omega}$ cm which is about half of photosensitive silver electrode. Dielectric layer was coated on the electrodes by screen printing and the pores harmful to the discharge were not formed after heat treatment. In the viewpoint of resistance and patterning, this method has much higher potential for large area display than other methods like screen printing, photosensitive conductive paste method and sputtering.

• Applied Chemistry for Engineering
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• v.29 no.2
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• pp.162-167
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• 2018

The effect of the average particle size and shape of silver nanoparticles for the transparent conductive film (TCF) was studied. Optical and electrical properties of silver conductive lines coated on the polyethylene terephthalate (PET) film was also measured. Silver nanoparticles produced by Ag-CM, Ag-ME, Ag-EE methods showed an excellent conductivity compared to those produced by Ag-EB, Ag-CR and Ag-PL methods, but a little difference in the transparency. In the case of the former three silver nanoparticles, the average particle size was about 80 nm or less and the size was uniform. For the latter case, the severe agglomeration phenomena of particles was observed and the average particle size was 100 nm or more. This result was consistent with the result of the uniformity of the pattern shape and thickness on conductive line patterns observed by SEM. Therefore, it was confirmed that the electrical characteristics could be obtained when the average particle size of silver nanoparticles is smaller and the uniformity of the particles is maintained.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.73-79
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• 2008

In order to apply for transparent conductive oxide(TCO), we deposited ZnO thin films on the glass at room temperature by RF magnetron sputtering method. Deposition conditions for high transmittance and low resistivity were optimized in our previous studies. Under the deposition condition with the RF power of 200 W, target to substrate distance of 30 mm and working pressure of 5 mTorr, highly conductive($7.4{\times}10^{-3}{\Omega}cm$) and transparent(over 85%) ZnO films were prepared. Highly oriented ZnO film in the [002] direction were obtained with specifically designed ZnO targets. Systematic study on dependence of deposition parameters on electrical and optical properties of the as-grown ZnO films were mainly investigated in this work. And for application tests using these films as transparent conductive oxide anodes, wet chemical etching behaviors of ZnO films were also investigated using various chemicals. Wet-chemical etching behavior of ZnO films were investigated using various acid solutions. The concentrations of these different acid solutions were controlled to study the etching shapes and etching rate. ZnO films were anisotropically etched at various concentrations and wet etching led to crater-like surface structure. Also we firstly found that the etching rate and etching shapes of ZnO films strongly depended on the etchant concentrations (i.e. pH) and the etching rate is exponentially decreased with increasing pH values regardless of the acid etchants.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.538-544
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• 2000

The laser patterning of sputter-deposited CoNdZr/Cu/CoNbZr multi-layered films had been tried using Nd:YAG laser. However generally it is very difficult to remove metal films because of their high reflectance of the laser on the surfaces. As a counterproposal for this problem authors for the first time tried to deposit energy-absorbing layers on the metal films and then irradiated the laser on the surfaces of energy-absorbing layers. Here the energy-absorbing layers consisted of laser energy-absorbing fine powders and binding polymers. Three kinds of powders for the energy-absorbing layers had been used to see the difference in the pattern formation with the degree of laser energy absorption. They were electrically conductive silver powders insulating BaTiO$_3$powder and semiconducting carbon powder. Remarkable difference in width of the formed pattern and the roughness of pattern edge were observed with the characteristic of the powder for the energy-absorbing layer. The pattern width using carbon paste was about three times larger than that using BaTiO$_3$paste. It was observed that the energy-absorbing layer with carbon was the most effective on this micro-patterning.

• New & Renewable Energy
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• v.18 no.4
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• pp.64-69
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• 2022

Double-sided photovoltaic (PV) modules have received significant attention in recent years as a technology that can achieve higher annual energy production rates than single-sided modules. The shingled technology is a promising method for manufacturing high-density and high-power modules. These modules are divided by laser and joined with electrically conductive adhesives. The output efficiency of the divided cells depends on the division pattern and the electrode pattern, making it important to understand the output characteristics. In this study, the output characteristics of large-area double-sided light-receiving shingled cells with different split patterns and electrode patterns were investigated. The M6 size, with 6 divisions in the electrode pattern, had the highest efficiency when using 142 front fingers and 146 rear fingers. The M10 size, with 7 divisions, had the highest output when using 150 fingers equally in the front and rear. The M12 size, also with 7 divisions, showed the highest output characteristics when using 192 front fingers and 208 rear fingers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.