• Korean Journal of Metals and Materials
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• v.47 no.7
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• pp.447-453
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• 2009

Isotropic conductive adhesives (ICAs) have been used or considered as an interconnect material for radio frequency identification (RFID) inlays or other flip chip assemblies due to the advantages of having a low temperature and high-speed bonding. In this work, the curing properties of commercial ICAs for the RFID tag application and the signal transmission in conductive lines that contained the ICA joints were evaluated as a function of the degree of cure at 900 MHz frequency range. The ICAs showed adequate signal transmission only after the curing process passed over the critical time. It was also found that the insertion loss of signal was more dependent on the contact states of Ag fillers in the bondline in preference to the electrical resistance of the ICA itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.65-66
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• 2006

Solubility of single wall carbon nanotubes (SWNTs) has been determined in various dispersing media by using the solvent parameters such as Kamlet-Taft parameter and 3-dimensional parameters. Nitric acid-treated SWNTs exhibit significantly improved solubility in hydrogen bondable solvents as well as in solvent mixtures. The forming bucky gel with ionic liquid allows for the new group of dissolving solvent. The dissolution behavior of SWNTs provides a route for SWNT dispersion/exfoliation in preparing electrically conductive films such as transparent electrode.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.237.2-237.2
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• 2013

ReRAM cell, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of conductive filament in a solid electrolyte [1,2]. Especially, Chalcogenide-based ReRAM have become a promising candidate due to the simple structure, high density and low power operation than other types of ReRAM but the uniformity of switching parameter is undesirable. It is because diffusion of ions from anode to cathode in solid electrolyte layer is random [3]. That is to say, the formation of conductive filament is not go through the same paths in each switching cycle which is one of the major obstacles for performance improvement of ReRAM devices. Therefore, to control of nonuniform conductive filament formation is a key point to achieve a high performance ReRAM. In this paper, we demonstrated the enhanced repeatable bipolar resistive switching memory characteristics by spreading the Ag nanocrystals (Ag NCs) on amorphous GeSe layer compared to the conventional Ag/GeSe/Pt structure without Ag NCs. The Ag NCs and Ag top electrode act as a metal supply source of our devices. Excellent resistive switching memory characteristics were obtained and improvement of voltage distribution was achieved from the Al/Ag NCs/GeSe/Pt structure. At the same time, a stable DC endurance (>100 cycles) and an excellent data retention (>104 sec) properties was found from the Al/Ag NCs/GeSe/ Pt structured ReRAMs.

• Elastomers and Composites
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• v.52 no.2
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• pp.136-142
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• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.8
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• pp.651-656
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• 2012

A study on capacitive characteristics of stylus pen for touch panel are progressed in this paper. Also the main factors for capacitive sensitivity are studied. Namely, highly sensitive stylus pen which can be applied to capacitive touch panel are studied based on the analysis of materials and process conditions regardless of pattern shapes. Stylus pen was made of PDMS(Poly-Di-Methyl-Siloxane) and conductive metal powders which does not damage the touch panel surface. We tried to get the advantages of both the properties of soft PDMS and conductive metal powders. We found that potential difference of capacitance change with conductivity of the composite materials(PDMS + metal powders) it implies that during touch process, large voltage difference can be caused by the high conductive materials of stylus pen. Stylus pen made by PDMS with mixed with Ag powders which has large conductivity shows more capacitance change of 1 pF than PDMS with other materials of Ni or C powders.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.422-430
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• 2017

Al/expanded graphite was successfully synthesized through a facile method including ultrasonic and heat treatment. In the well-designed three dimensional structure, expanded graphite(EG) works as a conductive matrix to support coated Al particles. The effects of the fabrication parameters on the microstructures and thermal conductivities of these composites were investigated. As a result, it was found that composites with graphite volume fraction of 17.4-69.4 % sintered at $600^{\circ}C$/45MPa exhibit in-plane thermal conductivities of 380-940 W/mK, over 90 % of the predictions by rule of mixture. According to the non-destructive analysis results, the synergistic enhancement was caused by the formation of efficient thermally conductive pathways due to the hybrid of the differently sized EG. The structure integrates the advantages of expanded graphite as a conductive support, preserving the electrode activity and integrity and improving the electrochemical performance.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.799-802
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• 2008

The metal films ink-jetted using the conductive ink based on a mixture of copper and silver nanoparticles were investigated. The porosity and resistivity of films were minimized by adjusting the mixing ratio of Cu and Ag nanoparticles. We demonstrated that the printed tracks with good conductivity could be obtained at sufficiently lower annealing temperatures where plastic substrates could be used.

• Progress in Superconductivity and Cryogenics
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• v.15 no.4
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• pp.59-62
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• 2013

The conductive link is used as a cooling medium between a cryocooler and magnet in a cryogen-free superconducting magnet system. The low temperature superconducting (LTS) magnet has one solenoidal configuration with a metal former which has a 52 mm room temperature bore. The superconducting coil is installed in the cryostat maintaining high vacuum and cooled by a two-stage cryocooler. In order to maintain the operating temperature of magnet at the designed level, the cold head temperature of the cryocooler must be lower so that heat can be removed from the superconducting coil. Also, temperature difference is occurred between the magnet and cryocooler and its magnitude is dependent upon the contact resistance at the interfacial surface between metals in the conductive link. In the paper, the performance of the LTS magnet is investigated with respect to the conductive link between the magnet former and the cold head of the cryocooler. The effects of the contact pressure and interfacial materials on the temperature distribution along the conductive link are also presented.