• 한국전기전자재료학회논문지
• /
• 제18권9호
• /
• pp.833-839
• /
• 2005

This work describes the effect of the number of roll pressing and the composition of carbon black on the electric and mechanical properties of carbon-PTFE electrode, in which composition is MSP20 : carbon black : $PTFE\;=\;95-X\;:\;X\;:\;5wt.\%$. It was found that the best electric and mechanical properties were obtained for sheet electrode roll pressed about 15 times and for sheet electrode, in which composition is MSP20 : carton black $PTFE\;=\;80\;:\;15\;:\;5wt.\%$. These behaviors could be explained by the network structure of PTFE fibrils and conducting Paths linked with carbon blacks, respectively. On the other hand, cell capacitor using the sheet electrode with $15wt.\%$ of carbon black attached on aluminum current collector with the electric conductive adhesive, in composition is carbon black $CMC\;=\;70\;:\;30wt.\%$, has exhibited the best rate capability between $0.5\;mA/cm^2\~100\;mA/cm^2$ current density and the lowest ESR.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
• /
• pp.355-356
• /
• 2006

This work describes the effect of the number of roll pressing and the composition of carbon black on the electric and mechanical properties of carbon-PTFE electrode, in which composition is MSP20 : carbon black: PTFE = 95-X : X : 5 wt.%. It was found that the best electric and mechanical properties were obtained for sheet electrode roll pressed about 15 times and for sheet electrode, in which composition is MSP20 carbon black : PTFE = 80 : 15 : 5 wt%. These behaviors could be explained by the network structure of PTFE fibrils and conducting paths linked with carbon blacks, respectively. On the other hand, cell capacitor using the sheet electrode with 15 wt.% of carbon black attached on aluminum current collector with the electric conductive adhesive, in composition is carbon black : CMC = 70 : 30 wt.%, has exhibited the best rate capability between 0.5 $mA/cm^2$ ~ 100 $mA/cm^2$ current density and the lowest ESR.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
• /
• pp.353-354
• /
• 2006

This work describes the effect of binders, such as carboxymethylcellulose (CMC), CMC+Polytetrafluoroethylene (PTFE) and PTFE, on the electrochemical and mechanical properties of activated carbon-electrode for electric double layer capacitor. The cell capacitors using the electrode bound with binary binder composed of CMC and PTFE, especially m composition CMC ; PTFE = 60 : 40 wt %, has exhibited the better rate capability and the lower internal resistance than those of the cell capacitor with CMC. On the other hand, the sheet type electrode kneaded with PTFE was bonded with conductive adhesive on Al foil. This cell capacitor using the electrode with PTFE exhibited the best mechanical properties and rate capability compared to the CMC and CMC+PTFE one These behaviors could be explained by the well-developed network structure of PTFE fibrils during the kneading process.

• 한국전기전자재료학회논문지
• /
• 제19권12호
• /
• pp.1167-1171
• /
• 2006

This work describes the effect of binders, such as carboxymethylcellulose (CMC), CMC+ Polytetrafluoroethylene (PTFE) and PTFE, on the electrochemical and mechanical properties of activated carbon-electrode for electric double layer capacitor. The cell capacitors using the electrode bound with binary binder composed of CMC and PTFE, especially in composition CMC PTFE = 60 : 40 wt.%, has better rate capability and the lower internal resistance than those of the cell capacitor with CMC. On the other hand, the sheet type electrode kneaded with PTFE was bonded with conductive adhesive on Al foil. This cell capacitor using the electrode with PTFE exhibited the best mechanical properties and rate capability compared to the CMC and CMC+PTFE one. These behaviors could be explained by the well-developed network structure of PTFE fibrils doting the kneading process.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
• /
• pp.1248-1253
• /
• 2004

This work describes the effect of electrode binder on the characteristics of electric double layer capacitor Among carboxymethylcellulose (CMC), Polyvinylpyrrolidone (PVP), Polyvinyl Alcohol (PVA), and Polyvinylidene Fluoride (PVDF), the unit cell using CMC showed good rate capability between $2.5mA/cm^2{\sim}100mA/cm^2$ current density. However, CMC as a binder is incongruent, because the electrode bound with CMC is rigid and easy to crack during a press and winding process for fabrication of capacitor. The unit cell capacitor using the electrode bound with binary binder composed of CMC and Polytetrafluoroethylene (PTFE), especially in composition CMC : PTFE : 60 : 40 wt.%, has exhibited the better mechanical properties than those of the unit cell with CMC. On the other hand, it was also noted that the mechanical properties of CMC+PTFE electrode, coated on underlayer composed of CMC and carbon black, were much improved the binding force.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.57-64
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
• /
• 제7권1호
• /
• pp.51-59
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 한국전기전자재료학회논문지
• /
• 제17권10호
• /
• pp.1079-1084
• /
• 2004

This work describes the effect of electrode binder on the characteristics of electric double layer capacitor. Among carboxymethylcellulose (CMC), Polyvinylpyrrolidone (PVP), Polyvinyl Alcohol (PVA), and Polyvinylidene Fluoride (PVDF), the unit cell using CMC showed good rate capability at current densities between 2.5 mA/$\textrm{cm}^2$～100 mA/$\textrm{cm}^2$. However, CMC as a binder is incongruent, because the electrode bound with CMC is rigid and easy to crack during a press and winding process for fabrication of capacitor. The unit cell capacitor using the electrode bound with binary binder composed of CMC and Polytetrafluoroethylene (PTFE), especially in composition CMC : PTFE =60 : 40 wt.%, has exhibited the better mechanical properties than those of the unit cell with CMC. On the other hand, the mechanical properties of CMC+PTFE electrode, coated on underlayer composed of CMC and carbon black, were much improved.

• 한국분말재료학회지
• /
• 제24권5호
• /
• pp.395-399
• /
• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 동력기계공학회지
• /
• 제22권1호
• /
• pp.64-71
• /
• 2018

Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.