• 제목/요약/키워드: complexing agent

검색결과 96건 처리시간 0.03초

무전해 Ni-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향 (Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Ni-Cu-P Deposits)

  • 오이식;이태희
    • 동력기계공학회지
    • /
    • 제10권3호
    • /
    • pp.58-66
    • /
    • 2006
  • The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing $CuSO_4$ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than $90^{\circ}C$ and under $70^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

  • PDF

니켈 나노입자가 흡착된 에너제틱용 고반응성 알루미늄 분말 합성 (Synthesis of Nickel Nanoparticle-adsorbed Aluminum Powders for Energetic Applications)

  • 김동원;권구현;김경태
    • 한국분말재료학회지
    • /
    • 제24권3호
    • /
    • pp.242-247
    • /
    • 2017
  • In this study, the electroless nickel plating method has been investigated for the coating of Ni nanoparticles onto fine Al powder as promising energetic materials. The adsorption of nickel nanoparticles onto the surface of Al powders has been studied by varying various process parameters, namely, the amounts of reducing agent, complexing agent, and pH-controller. The size of nickel nanoparticles synthesized in the process has been optimized to approximately 200 nm and they have been adsorbed on the Al powder. TGA results clearly show that the temperature at which oxidation of Al mainly occurs is lowered as the amount of Ni nanoparticles on the Al surface increases. Furthermore, the Ni-plated Al powders prepared for all conditions show improved exothermic reaction due to the self-propagating high-temperature synthesis (SHS) between Ni and Al. Therefore, Al powders fully coated by Ni nanoparticles show the highest exothermic reactivity: this demonstrates the efficiency of Ni coating in improving the energetic properties of Al powders.

카드뮴 전해석출에서의 이성분첨가물계의 효과 (The Effect of Some Binary Additive Systems in the Electrodeposition of Cadmium)

  • 이경호
    • 분석과학
    • /
    • 제9권2호
    • /
    • pp.161-167
    • /
    • 1996
  • 이성분계 첨가물을 이용한 카드뮴 석출과 수소 생성의 상대족인 속도를 조절할 수 있는 가능한 방법에 대하여 조사하였다. 수소를 발생하는 물의 전기환원을 억제하는 소수성 필름을 형성할 수 있는 벤질 알코올을 첨가제 중의 하나로 선택하였다. 다른 한 가지 첨가제는 카드뮴(II) 이온의 친수성을 약화시킴으로써 소수성 벤질 알코올 필름층을 쉽게 가로질러 환원극에 전착시킬 수 있는 것을 선택하였다. 전압 전류 효율 연구로부터 이온쌍과 착물 첨가제가 벤질 알코올 필름 존재하에서 카드뮴의 환원을 촉진시킬 수 있다는 것을 확인하였다. 벤질 알코올 필름은 나트륨 이온과 카드뮴의 염화착물을 형성하는 이온쌍을 얻기에 충분하도록 전극 주위의 유전상수를 낮추고, 카드뮴의 환원을 촉진시킨다. 이러한 환원의 촉진은 염화물이 존재하지 않는 황산염 용액에서는 일어나지 않는다. 왜냐하면 카드뮴은 본래 아쿠아 착물과 이온쌍으로 존재하여 카드뮴의 환원을 촉진시키지 못하고 환원을 방해시키기 때문이다.

  • PDF

용액 증착법으로 증착된 CdS 박막의 제조와 고상과 액상 화합제에 따른 표면 특성 비교 (Advanced Transmittance and Surface-Morphology of CdS thin films prepared by chemical bath deposition using various complexing agents for solar cells)

  • 유범근;김진상;박용욱;최두진;윤석진
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
    • /
    • pp.456-456
    • /
    • 2008
  • In the past few years, the deposition and characterization of cadmium sulfide semiconducting thin films has received a considerable amount of interest due to their potential application in the area of electronic and opto-electronic devices fabrications. Polycrystalline CdS thin films posses good optical transmittance, wide band-gap and electrical properties makes it as one of the ideal material for their application to solar cell fabrication. Cadmium sulfate thin films were deposited by the chemical bath deposition method using tartaric acid and triethanolamine as a complexing agent. Deposition parameters such as pH, temperature, deposition time and concentration of the reactant species were optimized so as to obtain reflecting, good adherent uniform thin films on the glass substrate. Reaction mechanism of the thin film formation is also reported. The crystallographic structure and the crystallite size were studied by the X-ray diffraction pattern. The optical band-gap of deposited film is identified by measuring the transmittance in the visible region. Temperature dependence of resistivity confirmed the semiconducting behavior of the film. Scanning electron micrographs (SEM) showed the presence of grain particles of size 50 nm.

  • PDF

환원제로 차아인산나트륨을 사용한 무전해 동도금속도에 미치는 도금액 조성과 도금조건의 영향 (Effects of Bath Compositions and Plating Conditions on Electroless Copper Plating Rate with Sodium Hypophosphite as Reducing Agent)

  • 오이식;박정덕;배영한
    • 동력기계공학회지
    • /
    • 제5권2호
    • /
    • pp.71-78
    • /
    • 2001
  • Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition; $CuSO_4\;0.025M,\;NiSO_4\;0.002M,\;NaH_2PO_2\;0.4M$, sodium citrate 0.06M, $H_3BO_3$ 0.6M, thiourea or 2-MBT $0.2mg/{\ell}$, and operation conditions; pH $9{\sim}10$ at bath temperature rage of $60{\sim}70^{\circ}C$. A small amount of nickel ion($Ni^{2+}/Cu^{2+}$=0.002/0.025) to the hypophosphite reduced solution promotes autocatalysis and continuous plating. An additive such as thiourea or 2-MBT of a small amount($0.2mg/{\ell}$) can be used to stabilize the solution without changing plating rate much. The attivation energy between $20^{\circ}C\;and\;70^{\circ}C$ were calculated to be 11.3kcal/mol for deposition weight. Plating reaction had been ceased by the adjustment of pH above 13, temperature higher than $90^{\circ}C\;and\;under\;20^{\circ}C$. Deposited surface became worse in the case of increment of bath temperature above $80^{\circ}C$.

  • PDF

중성염화물욕에서 아연의 고전류밀도 전착특성 (Electrodeposition behaviors of zinc from neutral chloride baths at high current density)

  • 김영근
    • 한국표면공학회지
    • /
    • 제29권4호
    • /
    • pp.219-228
    • /
    • 1996
  • Neutral Zinc Electroplating(NZE) utilizing the electrolyte of pH 6 to 8 has advantages in waste treatment and the protection of equipment. NZE is beneficially used in chromating treatment, but the limiting current density and the current efficiency are low. Therefore this study is investigated to analyse the characteristics of NZE and to obtain high current density and current efficiency. The deposition potential of zinc in the NZE bath is about 110mV, which is lower than acidic bath. The current density possibily increases up to 60A/d$\m^2$ in lower complexing agent content and pH 6. More than 90% of cathodic current efficiency was obtained in NZE bath. The NZE morphology shows smaller grains than acidic bath. The addition of 4$m\ell$/1 second brightener gives finer morphology. As pH becomes higher, (002) plan decreases and (100), (101) and (110) planes increase in the no additives solution.

  • PDF

이부프로펜의 가용화 (Solubilization of Ibuprofen in Aqueous Solution)

  • 이장원;박은석;지상철
    • Journal of Pharmaceutical Investigation
    • /
    • 제27권4호
    • /
    • pp.279-286
    • /
    • 1997
  • In order to formulate 2% ibuprofen solution, the effects of various solublizing agents, such as cosolvents (propylene glycol, polyethylene glycol, glycerin), a complexing agent $(CELDEX{\circledR}\;CH20)$, surfactants $(Poloxamers\;and\;Cremophor{\circledR}\;RH40)$ on the solubility of ibuprofen in aqueous solution were evaluated. Among them, Poloxamer 407 and $Cremophor{\circledR}$ RH40 showed the excellent capacity on the solubilization of ibuprofen. After 2% ibuprofen solution of choice were administered orally to rats, in reference to a 2% ibuprofen syrup in the market, the pharmacokinetic parameters were determined. The absorption rate of ibuprofen from the solution was higher than that from the suspension.

  • PDF

화학반응속도가 Cu CMP에 미치는 영향 (The effect of chemical kinetics of slurry components on Cu CMP)

  • 정원덕;장원문;박성민;정해도
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
    • /
    • pp.372-373
    • /
    • 2006
  • Chemical kinetics affects Cu CMP results (removal rate, Non uniformity etc.) Because Cu is removed by chemical action. Key factors in chemical kinetics are process temperature and concentration of slurry components. In this study, Hydrogen peroxide and citric acid were selected as a oxidant and a complexing agent and Slurry were made by mixing this components. In order to study effects of Chemical Kinetics, X-ray photoelectron spectroscopy (XPS) were performed on Cu sample after etching test as concentration of citric acid and slurry temperature. Finally Cu CMP was performed as same conditions.

  • PDF

ITO/Glass 기판위에 제조된 강유전성 $PbTiO_3$ 박막의 특성 (Properties of Ferroelectric $PbTiO_3$ Thin Films Prepared on ITO/Glass Substrates)

  • 김승현;오영제;김창은
    • 한국세라믹학회지
    • /
    • 제31권11호
    • /
    • pp.1315-1322
    • /
    • 1994
  • In this study, stable PbTiO3 coating solution was prepared using diethanolamine(DEA) complexing agent and deposited on indium-tin oxide(ITO) coated glass substrate. Prepared thin films were dense and crack-free. Perovskite-type PbTiO3 thin films could be obtained above 50$0^{\circ}C$, while the films heat-treated above $650^{\circ}C$ showed undesired properties due to interface reactions between films and substrates and warpage phenomena of substrates. Measured maximum dielectric constant and loss tangent were found to be 144 and 0.0163 at 1 kHz, 55$0^{\circ}C$ heat-treatment, respectively.

  • PDF

Solvothermal Synthesis of Copper Indium Diselenide in Toluene

  • Chang, Ju-Yeon;Han, Jae-Eok;Jung, Duk-Young
    • Bulletin of the Korean Chemical Society
    • /
    • 제32권2호
    • /
    • pp.434-438
    • /
    • 2011
  • Polycrystalline $CuInSe_2$ (CIS) was synthesized through solvothermal reactions in toluene with selected alkyl amines as complexing agents. The alkyl amines were used as reducing agent of selenium and catalytic ligands, enhancing the formation of CIS compounds in the colloidal solution. Toluene does not contribute the syntheses directly but minimizes the amounts of amines required for single phase CIS. We systematically studied the reactivity of amine compounds for the solovothermal syntheses, determined critical concentration of amine and the shortest reaction time. Crystallinity, morphology, chemical composition, and band gap of the prepared $CuInSe_2$ were respectively measured by X-ray diffraction, scanning electron microscopy, inductively coupled plasma atomic emission spectroscopy and UV-vis spectroscopy.