• Structural Engineering and Mechanics
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• 제76권5호
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• pp.561-578
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• 2020

The present work addresses the surface integrity and chip morphology in finish hard turning of AISI D3 steel under nanofluid assisted minimum quantity lubrication (NFMQL) condition. The surface integrity aspects include microhardness, residual stress, white layer formation, machined surface morphology, and surface roughness. This experimental investigation aims to explore the feasibility of low-cost multilayer (TiCN/Al2O3/TiN) coated carbide tool in hard machining applications and to assess the propitious role of minimum quantity lubrication using graphene nanoparticles enriched eco-friendly radiator coolant based nano-cutting fluid for machinability improvement of hardened steel. Combined approach of central composite design (CCD) - analysis of variance (ANOVA), desirability function analysis, and response surface methodology (RSM) have been subsequently employed for experimental investigation, predictive modelling and optimization of surface roughness. With a motivational philosophy of "Go Green-Think Green-Act Green", the work also deals with economic analysis, and sustainability assessment under environmental-friendly NFMQL condition. Results showed that machining with nanofluid-MQL provided an effective cooling-lubrication strategy, safer and cleaner production, environmental friendliness and assisted to improve sustainability.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1081-1084
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• 2003

Structural morphology, annealing behavior and dielectric properties of polyaniline-emeraldine base (Pani-EB) and poly methyl methacrylate (PMMA) thin films prepared by spin coating technique have been studied. MIM and MISM structures were used to investigate annealing and dielectric behavior. The XRD and AFM spectrum of as grown and annealed thin films indicates the amorphous nature. The observed amorphous phase, low loss, dielectric behavior and thermal stability even at high temperatures implies the feasibility of utilizing PMMA and Pani-EB thin films as gate dielectric insulator layer in organic thin film transistors which can find application in flat panel display.

• 한국재료학회지
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• 제17권6호
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• pp.331-336
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• 2007

The pure Mg powder compacts were successfully fabricated using SPS process. The machined chip powder showed flake shaped morphology with coarse surfaces, while gas atomized powders were spherical in morphology with smooth surfaces. In this study, SPS process was used to consolidate the pure Mg powder because this process allows high density consolidation in a short time. The results showed that increased sintering temperature from $350^{\circ}C$ to $500^{\circ}C$ with pressure of 30MPa, the maximum values of the density was increased from 98.1% to 99.8% of theoretical density, respectively. However, density of the sintered chip powders was higher than that of gas-atomized powder due to larger contact areas between particles.

• 대한기계학회논문집A
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• 제36권6호
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• pp.591-598
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• 2012

본 연구에서는 CNC선반을 사용하여 다양한 공구재질과 절삭속도에서 벌크금속유리(BMG)의 절삭 특성을 평가하였다. 선반가공시 Zr-기 BMG의 표면거칠기와 칩 형상을 관찰하여 가공조건에 따른 절삭력과 공구툴 마모 등 절삭 특성을 비교 검토하였다. 직경 8 mm $Zr_{50}Cu_{40}Al_{10}$ BMG시험편의 절삭에는 네 종류의 절삭공구를 사용하였다. 가공후 BMG 시험편의 표면거칠기를 측정하였고, 표면거칠기에 미치는 공구 회전속도의 영향을 조사하였다. 회전속도가 빠를수록 낮은 표면거칠기를 나타내었고, 공구 재질의 영향도 크게 나타났다. 칩 형상의 관찰 결과, 산화를 일으키지 않은 BMG 칩은 단열 전단띠 발생과 함께 나선형상의 형태를 나타내지만, 산화를 일으킨 칩은 국부적으로 용융과 함께 칩들이 뭉치는 현상을 나타내었다. BMG시험편을 가공하는 동안 발생한 절삭력은 TiN-WC에서 가장 큰 값을 나타내고, PCD가 그 다음, Cermet툴에서 가장 작은 값을 나타내었다.

• 대한안전경영과학회지
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• 제4권2호
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• pp.223-235
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• 2002

This paper presents some indirect physical evidences indicating that reduced friction occurs in an economical cryogenic machining process, in which LN2 is applied selectively in well-controlled jets to the localized cutting zone. These evidences include cutting force components, tool wear rate and chip morphology. LN2 reduced the tool wear rate to a great extent and elongated the tool life up to four times compared to emulsion cooling. The friction reduction was further reflected in larger shear angle and less secondary deformation in the chip microstructures. This study also found that the effectiveness of LN2 lubrication depends on the approach how LN2 is applied.

• 폴리머
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• 제39권3호
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• pp.475-479
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• 2015

모폴로지 분석을 통하여 반복압출에 의한 LCP(Vectra A950)와 PET 블렌드의 droplet 분산 상태를 확인하였다. 반복압출은 블렌드 조건별로 각각 2회, 3회 진행하였으며, 1회 압출 시료의 droplet 분산은 균일한 형태를 보였다. 하지만, 2회 및 3회 반복 압출 시료의 droplet 크기는 증가하였고 droplet이 시료의 중앙에 집중되는 현상을 확인할 수 있었다. 이러한 현상은 LCP/PET 블렌드의 상용성과 점탄성 거동에 기인한 것으로 생각된다. 끝으로 동일 방사조건에서 반복압출 LCP/PET 블렌드 chip을 방사하면 직경이 다른 섬유 제조가 가능할 것으로 생각된다.

• 한국정밀공학회지
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• 제20권9호
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• pp.55-62
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• 2003

This paper investigates the micro-cutting of cemented carbides using PCD (polycrystalline diamond) and PCBN (polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was studied, including cutting speed, depth of cut and various tool rake angle. Summary of the results are shown below. (1) Three type of chip formation process have been proposed by the results of the direct observation in orthogonal micro-cutting of cemented carbide materials. (2) From the whole observation of chip formation, primary WC particles are crushed and/or fine grained in the shearing deformation zone. A part of them are observed to collide directly with a cutting edge of tool by following the micro-cutting. (3) Surface finish, surface morphology and surface integrity is good to obtain by cutting with PCD cutting tool compared with PCBN. (4) The machined surface has the best quality near the low cutting speed of 10${\mu}m$/sec with a cutting depth of 10 ${\mu}m$ using 0$^\circ$ rake angle and 3$^\circ$ flank angle in this condition, but it was found that excessively low speed, for example the extent of 1 ${\mu}m$/sec, is not good enough to select for various reason.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.49-53
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• 2002

The Sn-Cu eutectic solder bump formation ($140{\mu}{\textrm}{m}$ diameter, $250{\mu}{\textrm}{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Cu deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased with increasing time. The plating rate increased generally according to current density. After the characteristics of Sn-Cu plating were investigated, Sn-Cu solder bumps were fabricated on optimal condition of 5A/dm$^2$, 2hrs. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallization). The shear strength of Sn-Cu bump after reflow was higher than that of before reflow.

• Elastomers and Composites
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• 제58권2호
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• pp.87-94
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• 2023

Abrasion tests of an SBR compound were conducted using four different types of abrasion testers (cut and chip, Lambourn, DIN, and LAT100). The abrasion test results were analyzed in terms of size distributions and morphologies of the wear particles. Most wear particles were larger than 1000 ㎛. The wear particle size distributions tended to decrease as the particle size decreased. Except for the Lambourn abrasion test, the wear particles smaller than 212 ㎛ were rarely generated by the other three abrasion tests, implying that small wear particles were produced through friction by introducing talc powder. Shapes of the wear particles varied depending on the abrasion testers. The wear particles generated from the Lambourn abrasion tester had stick-like shapes. The cut and chip abrasion test showed a clear abrasion pattern, but the DIN abrasion test did not show any specific abrasion pattern. The Lambourn and LAT100 abrasion tests showed irregular abrasion patterns.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.48.1-48.1
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• 2009

Performance of organic field-effect transistors (OFETs) with various temperature-cured polyacrylate(PA) copolymer as a gate insulator was studied. The PA thin film, which was cured at an optimized temperature, showed high dielectric strength (>7 MV/cm), low leakage current density ($5{\times}10^{-9}\;A/cm^2$ at 1 MV/cm) and enabled negligible hysteresis in MIS capacitor and OFET. A field-effect mobility of ${\sim}0.6\;cm^2/V\;s$, on/off current ratio (Ion/Ioff) of ${\sim}10^5$ and inverse subthreshold slope (SS) as low as 1.22 V/decwere achieved. The high dielectric strength made it possible to scale down the thickness of dielectric, and low-voltage operation of -5 V was successfully realized. The chemical changes were monitored by FT-IR. The morphology and microstructure of the pentacene layer grown on PA dielectrics were also investigated and correlated with OFET device performance.