• Structural Engineering and Mechanics
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• v.76 no.5
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• pp.561-578
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• 2020

The present work addresses the surface integrity and chip morphology in finish hard turning of AISI D3 steel under nanofluid assisted minimum quantity lubrication (NFMQL) condition. The surface integrity aspects include microhardness, residual stress, white layer formation, machined surface morphology, and surface roughness. This experimental investigation aims to explore the feasibility of low-cost multilayer (TiCN/Al2O3/TiN) coated carbide tool in hard machining applications and to assess the propitious role of minimum quantity lubrication using graphene nanoparticles enriched eco-friendly radiator coolant based nano-cutting fluid for machinability improvement of hardened steel. Combined approach of central composite design (CCD) - analysis of variance (ANOVA), desirability function analysis, and response surface methodology (RSM) have been subsequently employed for experimental investigation, predictive modelling and optimization of surface roughness. With a motivational philosophy of "Go Green-Think Green-Act Green", the work also deals with economic analysis, and sustainability assessment under environmental-friendly NFMQL condition. Results showed that machining with nanofluid-MQL provided an effective cooling-lubrication strategy, safer and cleaner production, environmental friendliness and assisted to improve sustainability.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1081-1084
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• 2003

Structural morphology, annealing behavior and dielectric properties of polyaniline-emeraldine base (Pani-EB) and poly methyl methacrylate (PMMA) thin films prepared by spin coating technique have been studied. MIM and MISM structures were used to investigate annealing and dielectric behavior. The XRD and AFM spectrum of as grown and annealed thin films indicates the amorphous nature. The observed amorphous phase, low loss, dielectric behavior and thermal stability even at high temperatures implies the feasibility of utilizing PMMA and Pani-EB thin films as gate dielectric insulator layer in organic thin film transistors which can find application in flat panel display.

• Korean Journal of Materials Research
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• v.17 no.6
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• pp.331-336
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• 2007

The pure Mg powder compacts were successfully fabricated using SPS process. The machined chip powder showed flake shaped morphology with coarse surfaces, while gas atomized powders were spherical in morphology with smooth surfaces. In this study, SPS process was used to consolidate the pure Mg powder because this process allows high density consolidation in a short time. The results showed that increased sintering temperature from $350^{\circ}C$ to $500^{\circ}C$ with pressure of 30MPa, the maximum values of the density was increased from 98.1% to 99.8% of theoretical density, respectively. However, density of the sintered chip powders was higher than that of gas-atomized powder due to larger contact areas between particles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.6
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• pp.591-598
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• 2012

In this study, the cutting characteristics of bulk metallic glass (BMG) cut using a computer numerically controlled (CNC) lathe were investigated for different insert tool materials and cutting speeds. The surface roughness, chip morphology, cutting forces, and tool wear during turning of $Zr_{50}Cu_{40}Al_{10}$ BMG alloy were examined. Four kinds of tool materials were used to cut an 8-mm-diameter BMG. The examination of the surface roughnesses of the BMG specimens machined at each cutting speed showed that the surface roughness became better as the cutting speed increased, and the tool materials also influenced the surface roughness. The chip morphology investigations showed that the unoxidized BMG chips had serrated curled chips with adiabatic shear bands, while the oxidized chips exhibited local melting and tangling rather than the usual spiral-shaped chips. The cutting force induced during machining of the Zr-based BMG was the largest for the TiN-WC tool, followed by the polycrystalline diamond (PCD) tool. The cermet tool exerted the smallest cutting force.

• Journal of the Korea Safety Management & Science
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• v.4 no.2
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• pp.223-235
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• 2002

This paper presents some indirect physical evidences indicating that reduced friction occurs in an economical cryogenic machining process, in which LN2 is applied selectively in well-controlled jets to the localized cutting zone. These evidences include cutting force components, tool wear rate and chip morphology. LN2 reduced the tool wear rate to a great extent and elongated the tool life up to four times compared to emulsion cooling. The friction reduction was further reflected in larger shear angle and less secondary deformation in the chip microstructures. This study also found that the effectiveness of LN2 lubrication depends on the approach how LN2 is applied.

• Polymer(Korea)
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• v.39 no.3
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• pp.475-479
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• 2015

Droplet distribution of LCP(Vectra 950) and PET blend by repeated extrusion was examined through morphology analysis. Repeated extrusion was respectively proceeded twice and three times with blending condition and droplet distribution of only once extrusion sample showed uniform shape. However, droplet size of twice and three times extrusion samples increased and it was confirmed that droplets were concentrated on the center of specimens. It is thought that this phenomena were due to the compatibility and viscoelastic behavior of LCP/PET blend. Finally, it is thought that fiber manufacturing of different diameter is possible from spinning of repeated extrusion LCP/PET blended chip under same spinning condition.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.55-62
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• 2003

This paper investigates the micro-cutting of cemented carbides using PCD (polycrystalline diamond) and PCBN (polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was studied, including cutting speed, depth of cut and various tool rake angle. Summary of the results are shown below. (1) Three type of chip formation process have been proposed by the results of the direct observation in orthogonal micro-cutting of cemented carbide materials. (2) From the whole observation of chip formation, primary WC particles are crushed and/or fine grained in the shearing deformation zone. A part of them are observed to collide directly with a cutting edge of tool by following the micro-cutting. (3) Surface finish, surface morphology and surface integrity is good to obtain by cutting with PCD cutting tool compared with PCBN. (4) The machined surface has the best quality near the low cutting speed of 10${\mu}m$/sec with a cutting depth of 10 ${\mu}m$ using 0$^\circ$ rake angle and 3$^\circ$ flank angle in this condition, but it was found that excessively low speed, for example the extent of 1 ${\mu}m$/sec, is not good enough to select for various reason.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.49-53
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• 2002

The Sn-Cu eutectic solder bump formation ($140{\mu}{\textrm}{m}$ diameter, $250{\mu}{\textrm}{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Cu deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased with increasing time. The plating rate increased generally according to current density. After the characteristics of Sn-Cu plating were investigated, Sn-Cu solder bumps were fabricated on optimal condition of 5A/dm$^2$, 2hrs. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallization). The shear strength of Sn-Cu bump after reflow was higher than that of before reflow.

• Elastomers and Composites
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• v.58 no.2
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• pp.87-94
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• 2023

Abrasion tests of an SBR compound were conducted using four different types of abrasion testers (cut and chip, Lambourn, DIN, and LAT100). The abrasion test results were analyzed in terms of size distributions and morphologies of the wear particles. Most wear particles were larger than 1000 ㎛. The wear particle size distributions tended to decrease as the particle size decreased. Except for the Lambourn abrasion test, the wear particles smaller than 212 ㎛ were rarely generated by the other three abrasion tests, implying that small wear particles were produced through friction by introducing talc powder. Shapes of the wear particles varied depending on the abrasion testers. The wear particles generated from the Lambourn abrasion tester had stick-like shapes. The cut and chip abrasion test showed a clear abrasion pattern, but the DIN abrasion test did not show any specific abrasion pattern. The Lambourn and LAT100 abrasion tests showed irregular abrasion patterns.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.48.1-48.1
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• 2009

Performance of organic field-effect transistors (OFETs) with various temperature-cured polyacrylate(PA) copolymer as a gate insulator was studied. The PA thin film, which was cured at an optimized temperature, showed high dielectric strength (>7 MV/cm), low leakage current density ($5{\times}10^{-9}\;A/cm^2$ at 1 MV/cm) and enabled negligible hysteresis in MIS capacitor and OFET. A field-effect mobility of ${\sim}0.6\;cm^2/V\;s$, on/off current ratio (Ion/Ioff) of ${\sim}10^5$ and inverse subthreshold slope (SS) as low as 1.22 V/decwere achieved. The high dielectric strength made it possible to scale down the thickness of dielectric, and low-voltage operation of -5 V was successfully realized. The chemical changes were monitored by FT-IR. The morphology and microstructure of the pentacene layer grown on PA dielectrics were also investigated and correlated with OFET device performance.