• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.167-172
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• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• 한국재료학회지
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• 제15권12호
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• pp.818-823
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• 2005

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.96-96
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• 2010

Monodispersed spherical silica-coated ceria nanoparticles were prepared through a sol-gel process using tetraethylorthosilicate (TEOS) and ceria fine particles. In this process, ceria fine particles were also prepared from cerium nitrate. The mean size of ceria particles was 300nm. Silica nanoparticles with narrow particle size distribution were prepared by controlled hydrolysis of TEOS solution. The silica sols were obtained by peptization, the process of redispersing a coagulated colloid, and were coated on ceria particles by the control of the weight ratio of silica/ceria and the pH of the mixture in aqueous solution. The morphologies of particles were characterized with scaning electron microscopy(SEM), transmission electron microscopy(TEM) and atomic force microscopy(AFM). The coating thickness of silica particles obtained by using this method was controlled in the range of 30 - 70nm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.35-37
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• 2005

100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.