• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.32-37
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• 2002

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.348-348
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• 2008

In recent, the concept of system-on-package (SOP) for highly integrated multifunctional systems has been paid attention to for the miniaturization and high frequency of electronic devices. In order to realize SOP, co-integration of passive devices, such as capacitors, resistors and inductors, and active devices should be achieved. If ceramic thick films can be grown at room temperature, we expect to be able to overcome many problems in conventional fabrication processes. So, we focused on the aerosol deposition method (ADM) as room temperature fabrication technology. ADM is a novel ceramic coating method based on the Room Temperature Impact Consolidation (RTIC) phenomena. This method has a wide range potential for fabrication of co-integration of passive and active devices. In this paper, I will present the future potential of ADM introducing various ceramic dielectric thick films for the integration of electronic ceramics.

• Journal of Bio-Environment Control
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• v.18 no.4
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• pp.475-480
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• 2009

These studies were carried out to find the effect of packing materials and storage temperature to enhance the storability of Salicornia europaea. The fresh weight loss was less than 2% at below $10^{\circ}C$ and non-perforated package, but $25^{\circ}C$ and perforated package treatment showed more than 4% of fresh weight loss that result to deteriorate quality. The carbon dioxide and oxygen contents remained 1~2% and above 15% in non-perforated package, and these contents were in proportion to gas permeability of packing materials. All the temperature treatments except 25c showed rapidly increasing ethylene concent from 7days after storage, and the highest ethylene content was $2^{\circ}C$ treatment that should appear chilling injury. The off-odor and deterioration ratio were lowest in $5^{\circ}C$ among the temperature treatments and $50{\mu}m$ thickness ceramic film treatment at $5^{\circ}C$ storage, while packing materials did not show any trends among the temperature treatments. The shelf life based on visual quality showed highest in $50{\ss}|$ thickness ceramic film packing and $5^{\circ}C$ treatment, and that was 28days.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.6
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• pp.407-411
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• 2000

Low-temperature solder glass for use in electronic package was experimentally prepared and its crystallization behavior was investigated using differential thermal analysis (DTA) under nonisothermal condition. The composition of the solder glass was determined from PbO-ZnO-$B_2$$O_3$-$TiO_2$ glasses containing small amounts of CaO, $SiO_2$$A1_2$$O_3$ and $P_2$$O_5$. The crystallization exotherm corresponding to the formation of lead titanate (PbTiO$_3$) was observed. The crystallization of $PbTiO_3$was a three-dimensional process with the average activation energy of 223$\pm$3 kJ/mol for the crystallization from the glass matrix.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.229-233
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• 2015

Currently, the majority of commercial white LEDs are phosphor converted LEDs made of a blue-emitting chip and YAG yellow phosphor dispersed in organic silicone. However, silicone in high-power devices results in long-term performance problems such as reacting with water, color transition, and shrinkage by heat. Additionally, yellow phosphor is not applicable to warm white LEDs that require a low CCT and high CRI. To solve these problems, mixing of green phosphor, red phosphor and glass, which are stable in high temperatures, is common a production method for high-power warm white LEDs. In this study, we fabricated conversion lenses with LUAG green phosphor, SCASN red phosphor and low-softening point glass for high-power warm white LEDs. Conversion lenses can be well controlled through the phosphor content and heat treatment temperature. Therefore, when the green phosphor content was increased, the CRI and luminance efficiency gradually intensified. Moreover, using high heat treatment temperatures, the fabricated conversion lenses had a high CRI and low luminance efficiency. Thus, the fabricated conversion lenses with green and red phosphor below 90 wt% and 10 wt% with a sintering temperature of $500^{\circ}C$ had the best optical properties. The measured values for the CCT, CRI and luminance efficiency were 3200 K, 80, and 85 lm/w.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.230-235
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• 2000

The extrusion process for long-length multi-filaments of BSCCO 2223 superconductor tape has been investigated with aids of Finite Element Method and experimental inspection. Since the arrangement of filaments in matrix material has characteristic of rotational symmetry, a 2-dimensional commercial FEM package, DEFORM-2D, was adopted to simulate extrusion process with different variables such as hardness of sheath material, lengths of each filament and arrangement. From the FEM analysis, since the inner filaments move faster than the outer one, distribution of filaments is needed to be optimized. In the case of pure Ag matrix, undesirable non-uniform distribution of filament was obtained due to low hardness of sheath material. Dummy sample(brass (sheath) and talc powder(filament)), however, which has relatively high hardness of sheath material, had been produced with desirable results. Therefore, it is necessary to optimize hardness of sheath material, extrusion temperature and billet design.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.42 no.1
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• pp.23-31
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• 2005

Recently, the multimedia and high speed telecommunication systems needs a high frequency and high stability oscillator. The VCXO(voltage controlled -crystal oscillator) have continually downsized to gratify a thin and small size of the telecommunication systems. In his paper, we have developed the small ceramic PECL(positive emitter-coupled logic) VCXO of the 5×7 mm size for gratifying the requested specifications from user, and then use the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO is operating at the 3.3 Voltage and have the frequency range of 120MHz～180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.2A
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• pp.107-113
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• 2005

In this paper, we have developed the miniature ceramic PECL(positive emitter-coupled logic) VCXO of the $5{\times}7mm$ size for gratifying the requested specifications and the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO designed by the inverted Mesa type HFF is operating at the 3.3 Voltage and have the frequency range of 120MHz-180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.563-568
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• 2007

In this paper, the proposed package antenna, which is meander line structure with short pin, is miniaturized to realize RF-SoP at 900 MHz RFID band. The RFID BGA(Ball Grid Array) chip is put in a cavity of LTCC Layers. The coupling and cross talk, which are happen between BGA chip and proposed package antenna, are reduced by faraday cage, which consists of ground and via fences, is realized to enhance the isolation between BGA chip and antenna. The proposed antenna structure is focused on the package level antenna realization at low frequency band. The novel proposed package antenna size is $13mm{\times}9mm{\times}3.51mm$. The measured resonance frequency is 0.893 GHz. The impedance bandwidth is 9 MHz. The maximum gain of radiation pattern is -2.36 dBi.