• 대한치과의사협회지
• /
• 제37권10호통권365호
• /
• pp.785-795
• /
• 1999

• 한국공작기계학회논문집
• /
• 제16권6호
• /
• pp.168-174
• /
• 2007

A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.

• 한국세라믹학회지
• /
• 제51권2호
• /
• pp.127-131
• /
• 2014

Precipitated calcium carbonate(PCC) inorganic fillers for plastic offera higher replacement ratio with improved mechanical properties than any other inorganic fillers. Due to its secure economic feasibility, its fields of application areexpanding. For optimized PCC grain size and polymer replacement ratio, it is good to maintain at least $0.035{\mu}m$ grains and keep double the grain size of distance between particles, depending on the molecular weight and volume replacement rate of the polymer. PCC has unique characteristics, ie, with smaller grain size, dispersibility decreases, and if grain size is not homogenous, polymer cracking occurs. The maximum replacement ratio of PCC is approximately 30%, but in the range of 10 - 15% it produces the highest mechanical strength. When mixed with a biodegradable plastic like starch, it also improves initial environmental degradability.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.207-207
• /
• 2008

Modern industry has focused on processing that produce low- loss dielectric substrates used complex micron-sized devices using tick film technologies such as tape casting and slip casting. However, these processes have inherent disadvantages fabricating high density interconnect with embedded passives for high speed communication electronic devices. Here, we have successfully fabricated porous alumina dielectric layer infiltrated with polymer solution by using inkjet printing process. Alumina suspensions were formulated as dielectric ink that were optimized to use in inkjet process. The layer was confirmed by field emission scanning electron microscope (FE-SEM) for measuring microstructure and volume fraction. In addition, the reaction kinetics and electrical properties were characterized by FT-IR and the impedance analyzer. The volume fraction of alumina in porous dielectric alumina layer is around 70% much higher than that in the conventional process. Furthermore, after infiltration on the dielectric layer using polymer resins such as cyanate ester. Excellent Q factors of the dielectric is about 200 when confirmed by impedance analyzer without any high temperature process.

• 한국세라믹학회지
• /
• 제56권5호
• /
• pp.461-467
• /
• 2019

Ink-jet printing technology, which utilizes a digitalized design to print fine ink directly on a substrate, has been of interest in various industries due to its high efficiency and adaptability to various materials. Recently, active attempts have been made to apply ceramic materials having excellent heat resistance, light resistance, and chemical resistance to the ink-jet printing process. In this study, ceramic ink was synthesized by combining ceramic pigments with UV curable polymer. 3D printability at various contact angles between ceramic ink and substrate was analyzed in detail. Rheological properties of the synthesized ceramic ink were optimized to meet the requirements of the ink-jet printing process, and the contact angle of UV curable ceramic ink was controlled through surface treatment of the substrate. The potential for additive manufacturing of ceramic material using ink-jet printing was investigated by analyzing the effect of contact angle control on ceramic ink droplets and their 3D printability.

• 한국세라믹학회지
• /
• 제37권3호
• /
• pp.280-287
• /
• 2000

Adsorption behavior and amount of phenolic resin followed silica (SiO2) formation onto silicon nitride(Si3N4) surface were investigated using electrokinetic sonic amplitude (ESA) technique and with UV spectrometer, to fabricate Si3N4/SiC nano-composite based on reaction between SiO2 formed and phenolic resin absorbed onto Si3N4 particle. The amount of SiO2 formed and carbon from phenolic resin absorbed onto Si3N4 surface were calculated quantitatively to adjust the reaction between SiO2 and phenolic resin, resulting in no residual SiO2 and carbon. As a result, pre-heated tempeature for optimized reaction was below 25$0^{\circ}C$, in which there was no residual SiO2 and carbon.

• 한국분말재료학회지
• /
• 제14권3호
• /
• pp.202-207
• /
• 2007

Novel polymer mold process for fabrication of microcomponents using metal nanopowders was developed and experimentally optimized. Polymer mold for forming green components was produced by using a hard master mold and polydimethylsiloxane (PDMS). In the preparation of metallic powder premix for the green components without any defect, 90 wt.% 17-4PH statinless steel nanopowders and 10 wt.% organic binder were mixed by a ball milling process. The green components with very clear gear shape were formed by filling the powder premix into the PDMS soft mold in surrounding at about $100^{\circ}C$. Cold isostatic pressing (CIP) was very potent process to decrease a porosity in the sintered microcomponent. The microgear fabricated by the improved process showed a good dimension tolerance of about 1.2%.

• 청정기술
• /
• 제12권3호
• /
• pp.151-156
• /
• 2006

염색폐수 처리를 위해 세라믹 정밀여과막 (MF)과 고분자 한외여과막 (UF)의 복합공정을 적용, 색도 및 유기물 (TOC) 제거율을 통해 공정을 최적화하고, 염색폐수의 분리효율을 조사하였다. 막 회복을 통한 운전 효율향상을 위해 역세척과 화학세정을 수행한 결과, 역세척에 의한 정밀여과막은 2분 주기로 1초 동안 역세척하였을때 투과수량이 10.3% 증가하였고, 한외여과막은 0.1% 수산화나트륨 용액으로 화학세정하였을 때 97%의 회복률을 나타내었다. 이때, 유기물, 색도, 부유물질(SS)의 제거율은 각각 84.6%, 97.4% 및 100%를 나타내었다. 분 복합공정의 적용은 염색폐수의 색도와 유기물 제거에 효과적임을 확인할 수 있었다.

• 한국재료학회지
• /
• 제20권7호
• /
• pp.392-400
• /
• 2010

The electrospinning process was established as a promising method to fabricate nano and micro-textured scaffolds for tissue engineering applications. A BCP-loaded PCL micro-textured scaffold thus can be a viable option. The biocompatibility as well as the mechanical properties of such scaffold materials should be optimized for this purpose. In this study, a composite scaffold of poly ($\varepsilon$-caprolactone) (PCL)-biphase calcium phosphate (BCP) was successfully fabricated by electrospinning. EDS and XRD data show successful loading of BCP nano particles in the PCL fibers. Morphological characterization of fibers shows that with a higher loaded BCP content the fiber surface was rougher and the diameter was approximately 1 to 7 ${\mu}m$. Tensile modulus and ultimate tensile stress reached their highest values in the PCL- 10 wt% BCP composite. When content of nano ceramic particles was low, they were dispersed in the fibers as reinforcements for the polymer matrix. However, at a high content of ceramic particles, the particles tend to agglomerate and lead to decreasing tensile modulus and ultimate stress of the PCL-BCP composite mats. Therefore, the use of nano BCP content for distribution in fiber polymer using BCP for reinforcement is limited. Tensile strain decreased with increasing content of BCP loading. From in vitro study using MG-63 osteoblast cells and L-929 fibroblast like cells, it was confirmed that electrospun PCL-BCP composite mats were biocompatible and that spreading behavior was good. As BCP content increased, the area of cell spreading on the surface of the mats also increased. Cells showed the best adherence on the surface of composite mats at 50 wt% BCP for both L-929 fibroblast-like cells and MG-63 osteoblast cell. PCL- BCP composites are a promising material for application in bone scaffolds.

• 동굴
• /
• 제80호
• /
• pp.21-24
• /
• 2007

The need for high-frequency decoupling capacitors to supply the transient current requirements to high-speed devices is ubiquitous in current microelectronics applications. Even though materials and their processes have already been developed in terms of their performances, low manufacturing cost cannot be overemphasized in current microelectronics industry. For this reason, we revisited low cost ceramic filled polymer integrated capacitor. Experiments were performed according to the design of experiment (DOE). The best recipe that has the optimized ratio of material composite was obtained using by response optimizer in Minitab. And also, high-frequency measurements were performed to get frequency dependent data using network analyzer.