• Journal of the Korean Ceramic Society
• /
• v.48 no.5
• /
• pp.335-341
• /
• 2011

Continuous SiC fiber-reinforced SiC-matrix composites ($SiC_f$/SiC) had been fabricated by electrophoretic infiltration combined with ultrasonication. Nano-sized ${\beta}$-SiC added with 12 wt% of $Al_2O_3-Y_2O_3$ additive and Tyranno$^{TM}$-SA3 fabric were used as a matrix phase and fiber reinforcement, respectively. After hot pressing at 5 different conditions, the density, microstructure and mechanical properties of $SiC_f$/SiC were characterized. Hot pressing at relatively severe conditions, such as $1750^{\circ}C$ for 1 and 2 h, resulted in a brittle fracture behavior due to the strong fiber-matrix interface in spite of their high flexural strength. On the other hand, toughened $SiC_f$/SiC composite could be achieved by hot pressing at milder condition because of the formation of weak interface in spite of the decreased flexural strength. These results proposed the importance of weak fiber-matrix interface in the fabrication of ductile $SiC_f$/SiC composite.

• Proceedings of the Korean Ceranic Society Conference
• /
• 2000.04a
• /
• pp.154.1-154.1
• /
• 2000

• Journal of the Korean Ceramic Society
• /
• v.56 no.6
• /
• pp.589-595
• /
• 2019

The top-seeded solution growth (TSSG) method is an effective approach for the growth of high-quality SiC single crystals. In this method, the temperature gradient in the melt is the key factor determining the crystal growth rate and crystal quality. In this study, the effects of the aperture at the top of the hot-zone on the growth of the SiC single crystal obtained using the TSSG method were evaluated using multiphysics simulations. The temperature distribution and C concentration profile in the Si melt were taken into consideration. The simulation results showed that the adjustment of the aperture at the top of the hot-zone and the temperature gradient in the melt could be finely controlled. The surface morphology, crystal quality, and polytype stability of the grown SiC crystals were investigated using optical microscopy, high-resolution X-ray diffraction, and micro-Raman spectroscopy, respectively. The simulation and experimental results suggested that a small temperature gradient at the crystal-melt interface is suitable for growing high-quality SiC single crystals via the TSSG method.

• Proceedings of the Korean Reliability Society Conference
• /
• 2001.06a
• /
• pp.337-337
• /
• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.9 no.3
• /
• pp.9-17
• /
• 2000

The use of ceramic inserts in steel forging tools offers significant technical and economic advantages over other materi-als of manufacture. These potential benefits can however only be realised by optimal design of the tools so that the ceramic insert are not subjected to stresses that led to their premature failure. In this paper the data on loading of the tools is determined from a commercial forging simulation package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite-element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic detections generated in shrink fitting the die inserts and that caused by the stresses generated in the forging process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads. Simulation results have been validated as a result of experimental investigation. Laboratory tests on ceramic insert dies have verified the superior performance of the Zirconia and Silicon Nitride ceramic insert in order to prolong maintenance life.

• Transactions on Electrical and Electronic Materials
• /
• v.12 no.1
• /
• pp.32-34
• /
• 2011

A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.4
• /
• pp.63-70
• /
• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Journal of the Korean Ceramic Society
• /
• v.44 no.10
• /
• pp.548-553
• /
• 2007

Ceramic green sheets consisting Bi-based glass frit were fabricated for an application to PDP transparent dielectric front panel. The dispersion condition of the slurry for tape casting was pre-examined, and two kinds of hinder and plasticizer were used in the non-aqueous slurry system. In the fabrication process for the frit film, the properties such as dry and firing shrinkage, elongation, and transmittance were examined at the condition of various mixing ratio of plasticizers. In the mixing ratio of polyethylene glycol to dibutyl phthalate of 3:5wt%, a good adhesion, elongation and transmittance were observed at the firing temperature of $580^{\circ}C$. The photograph for the cross section of the interface was also showed a dense microstructure.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.04a
• /
• pp.470-474
• /
• 1997

Since the ceramic/metal joints is joined at high temperature, the residual stress will develop during when cooled from bonding temperature due to remarkable difference of thermal expansion coefficient between creamic and metal. Moreover, the edge of jointed interface makes singular stress field in the ceramic/metal joints and this singular stress field much influences on the strength of joints. In this study, The influence of residual stress, mechanical load and repeat thermal sysle was estimated in the ceramic/metal joints. According to this influence, the change of singular stress field was analyed and then strength test, X-ray measurement are performed.

• Transactions on Electrical and Electronic Materials
• /
• v.10 no.1
• /
• pp.5-8
• /
• 2009

The reliability of multilayer ceramic capacitor with active thin dielectric layer was investigated by highly accelerated life test at various stress condition. The distribution of multilayer ceramic capacitor failure times is plotted as a function of time from Weibull distribution function. According to the test result, voltage acceleration factor is obtained from 2.24 to 2.96. The acceleration by temperature is much higher than other values of active thick dielectric layer. It is clear that median time to failure is affected by the stress voltage for high volumetric efficiency ceramic capacitors with active thin dielectric layer. The degradation under stress of voltage involves electromigration and accumulation of oxygen vacancy at Ni electrode interface of cathode.