• 한국세라믹학회지
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• 제50권1호
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• pp.50-56
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• 2013

Phosphorescent materials coated with titanium dioxide were fabricated and photocatalytic reactions between these materials and VOCs gases were examined. A thin film (approx. 100 nm) of nanosized $TiO_2$ was deposited on the $Sr_4Al_{14}O_{25}$ : $Eu^{2+}$, $Dy^{3+}$, $Ag^+$ phosphor using low-pressure chemical vapor deposition (LPCVD). The characteristics of the photocatalytic reaction were examined in terms of the decomposition of benzene gas using a gas chromatography (GC) system under ultraviolet (${\lambda}$ = 365 nm) and visible light (${\lambda}$ > 420 nm) irradiation. $TiO_2$-coated $Sr_4Al_{14}O_{25}$ : $Eu^{2+}$, $Dy^{3+}$, $Ag^+$ phosphor showed different photocatalytic behavior compared with pure $TiO_2$. $TiO_2$-coated phosphorescent materials showed a much faster photocatalytic decomposition of benzene gas under visible irradiation compared to the pure $TiO_2$ for which the result was practically negligible. This suggests that the extension of the absorption wavelength to visible light occurred through energy band bending by a heterojunction at the interface of the $Sr_4Al_{14}O_{25}-TiO_2$ composite. Also, the $Sr_4Al_{14}O_{25}-TiO_2$ composite showed the photocatalytic decomposition of benzene in darkness due to the photon light emitted from the $Sr_4Al_{14}O_{25}$ phosphors.

• 한국세라믹학회지
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• 제53권4호
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• pp.400-405
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• 2016

Ferric oxide (${\alpha}-Fe_2O_3$, hematite) is an n-type semiconductor; due to its narrow band gap ($E_g=2.1eV$), it is a highly attractive and desirable material for use in solar hydrogenation by water oxidation. However, the actual conversion efficiency achieved with $Fe_2O_3$ is considerably lower than the theoretical values because the considerably short diffusion length (2-4 nm) of holes in $Fe_2O_3$ induces excessive charge recombination and low absorption. This is a significant hurdle that must be overcome in order to obtain high solar-to-hydrogen conversion efficiency. In consideration of this, it is thought that elemental doping, which may make it possible to enhance the charge transfer at the interface, will have a marked effect in terms of improving the photoactivities of ${\alpha}-Fe_2O_3$ photoanodes. Herein, we report on the synthesis by pulsed electrodeposition of ${\alpha}-Fe_2O_3$-based anodes; we also report on the resulting photoelectrochemical (PEC) properties. We attempted Ti-doping to enhance the PEC properties of ${\alpha}-Fe_2O_3$ anodes. It is revealed that the photocurrent density of a bare ${\alpha}-Fe_2O_3$ anode can be dramatically changed by controlling the condition of the electrodeposition and the concentration of $TiCl_3$. Under optimum conditions, a modified ${\alpha}-Fe_2O_3$ anode exhibits a maximum photocurrent density of $0.4mA/cm^2$ at 1.23 V vs. reversible hydrogen electrode (RHE) under 1.5 G simulated sunlight illumination; this photocurrent density value is about 3 times greater than that of unmodified ${\alpha}-Fe_2O_3$ anodes.

• 한국세라믹학회지
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• 제42권9호
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• pp.624-630
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• 2005

To investigate the possibility of the $ZrO_2$ buffer layer as the insulator for the Metal-Ferroelectric-Insulator-semiconductor (MFIS) structure, $ZrO_2$ and $SrBi_2Ta_2O_9$ (SBT) thin films were deposited on the P-type Si(111) wafer by the R.F. magnetron-sputtering method. According to the process with and without the post-annealing of the $ZrO_2$ buffer layer and SBT thin film, the diffusion amount of Sr, Bi, Ta elements show slight difference through the Glow Discharge Spectrometer (GDS) analysis. From X-ray Photoelectron Spectroscopy (XPS) results, we could confirm that the post-annealing process affects the chemical binding condition of the interface between the $ZrO_2$ thin film and the Si substrate. Compared to the MFIS structure without the post-annealing of the $ZrO_2$ buffer layer, memory window value of MFlS structure with post-annealing of the $ZrO_2$ buffer layer were considerably improved. The window memory of the Pt/SBT (260 nm, $800^{\circ}C)/ZrO_2$ (20 nm) structure increases from 0.75 to 2.2 V under the applied voltage of 9 V after post-annealing.

• 한국세라믹학회지
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• 제39권10호
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• pp.948-954
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• 2002

차세대 발전 시스템에서 사용되는 고온 가스 필터용 지지층 소재를 제조하기 위하여 용융 Si 침윤 방법으로 기공율이 32∼36%, 주기공 크기가 37∼90 ${\mu}m$ 범위를 갖는 고강도 다공질 반응소결 탄화규소(RBSC)를 개발하였다. 반응소결 탄화규소 다공체의, 최대 파괴강도는 120MPa이었으며, 용융 Si 침윤 방법으로 제조된 반응소결 탄화규소 다공체에서는 SiC 입자 사이에 SiC/Si로 이루어진 기지상이 형성되어 있기 때문에 파괴 강도 및 열충격 특성이 점토 결합 탄화규소 다공체 보다 우수하였다. 반응소결 탄화규소 다공체의 기공율 및 기공 크기는 잔류 Si의 양 및 성형체에 사용한 SiC 입자 크기에 따라 다르게 나타났다.

• 한국전자파학회논문지
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• 제20권12호
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• pp.1243-1251
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• 2009

본 논문에서는 능동 위상 배열 레이더에 사용되는 X-밴드 송수신 모듈의 설계와 측정 결과에 대해 기술한다. 일반적으로 능동 위상 배열 레이더는 고출력, 낮은 잡음 지수, 높은 TOI(Third Order Intercept), 송수신에서의 충분한 이득을 갖는 반도체 송수신 모듈을 요구한다. 송수신 모듈은 광대역에서 9 W의 출력 특성을 나타낸다. 잡음 지수는 2.8 dB로 낮다. 위상과 이득은 각각 6비트 위상 변위기와 5비트 감쇄기로 조정된다. LTCC(Low Temperature Co-fired Ceramic)을 사용하여 높은 집적도를 갖는 송수신 모듈을 구현하였다. 모듈은 디지털 인터페이스를 통합하고 3개의 전원을 사용한다.

• 한국산학기술학회논문지
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• 제18권1호
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• pp.592-598
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• 2017

적외선 투과 특성을 이용하여 광학 창 등으로 사용되는 세라믹 재료들은 광학적 특성이 잘 공개되어 있지 않다. 통상적으로 사용되는 굴절률 시험기를 이용하여 고온 세라믹 재료의 굴절률을 측정하는 것은 매우 어렵기 때문에 특별한 방안이 도입되어야 한다. 본 연구에서는 간접적인 방법을 통해 고온 조건에서 세라믹 재료의 광학특성을 평가하는 실용적인 방법을 제시하고자 한다. 먼저 평가대상인 세라믹 재료 샘플을 요구되는 고온 조건을 유지하기 위한 시스템을 제작하여 광분광기에 장착하였다. 이 시스템을 이용하여 온도를 변화하며 시료 온도에 따른 투과율을 측정하였다. 이렇게 측정된 투과율 데이터는 Sellmeier 분산식을 적용하는 광학 시뮬레이션 모델에 적용되어 굴절률 자료를 산출하는데 사용된다. 이 시뮬레이션 모델은 시행착오법을 이용하여 Sellmeier 분산식에 포함되는 변수들을 찾는데 이용된다. 이를 이용하여 굴절률을 계산하며 그 값을 이용하여 다시 투과율을 계산하고 그 결과를 측정된 투과율과 비교하여 그 결과가 일치할 때까지 반복하여 그 온도에서 재료의 변수로 정하였다. 이 방법을 사파이어 재료에 적용하여 그 결과를 상온에서 공개 데이터와의 비교를 통해 검증하였다.

• The Korean Journal of Ceramics
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• 제5권4호
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• pp.336-340
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• 1999

Glasses in the system $CaO-TiO_2-SiO_2-Al_2O_3-ZrO_2-B_2O_3$ were investigated to find the glass seal compositions suitable for use in the planar solid oxide fuel cell (SOFC). Glass-ceramics prepared from the glasses by one-stage heat treatment at $1,000^{\circ}C$ showed various thermal expansion coefficients (i,e., $8.6\times10^{-6^{\circ}}C^{-1}$ to $42.7\times10^{-6^{\circ}}C^{-1}$ in the range 25-$1,000^{\circ}C$) due to the viscoelastic response of glass phase. The average values of contact angles between the zirconia substrate and the glass particles heated at 1,000-$1,200^{\circ}C$ were in the range of $131^{\circ}\pm4^{\circ}$~$137^{\circ}\pm9^{\circ}$, indicating that the glass-ceramic was in partial non-wetting condition with the zirconia substrate. With increasing heat treatment time of glass samples from 0.5 to 24 h at $1,100^{\circ}C$, the DC electrical conductivity of the resultant glass-ceramics decreased from at $800^{\circ}C$. Isothermal hold of the glass sample at $1100^{\circ}C$ for 48h resulted in diffusion of Ca, Si, and Al ions from glass phase into the zirconia substrate through the glass/zirconia bonding interface. Glass phase and diffusion of the moving ion such as $Ca^{2+}$ in glass phase is responsible for the electrical conduction in the glass-ceramics.

• 한국해양공학회지
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• 제16권6호
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• pp.60-64
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• 2002

This paper describes the machining characteristics of the MoSi$_2$--based composites through the process of electric discharge drilling with various tubular electrodes. In addition to hardness characteristics, microstructures of Nb/MoSi$_2$laminate composites were evaluated from the variation of fabricating conditions, such as preparation temperature, applied pressure, and pressure holding time. MoSi$_2$-based composites have been developed in new materials for jet engines of supersonic-speed airplanes and gas turbines for high-temperature generators. These high performance engines may require new hard materials with high strength and high temperature-resistance. Also, with the exception of grinding, traditional machining methods are not applicable to these new materials. Electric discharge machining (EDM) is a thermal process that utilizes a spark discharge to melt a conductive material. The tool electrode is almost -unloaded, because there is n direct contact between the tool electrode and the work piece. By combining a non-conducting ceramic with more conducting ceramic, it was possible to raise the electrical conductivity. From experimental results, it was found that the lamination from Nb sheet and MoSi$_2$ powder was an excellent strategy to improve hardness characteristics of monolithic MoSi$_2$. However, interfacial reaction products, like (Nb, Mo)SiO$_2$and Nb$_2$Si$_3$formed at the interface of Nb/MoSi$_2$, and increased with fabricating temperature. MoSi$_2$composites, with which a hole drilling was not possible through the conventional machining process, enhanced the capacity of ED-drilling by adding MbSi$_2$, relative to that of SiC or ZrO$_2$reinforcements.

• 센서학회지
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• 제12권6호
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• pp.265-272
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• 2003

본 논문은 파이렉스 #7740 유리 박막을 이용한 MEMS용 MLCA (Multi Layer Ceramic Actuator)와 Si기판의 양극접합 특성에 관한 것이다. 최적의 RF 마그네트론 스피터링 조건 (Ar 100%, input power $1\;W/cm^2$)하에서 MLCA기판위에 파이렉스 #7740 유리의 특성을 갖는 박막을 증착하였다. $450^{\circ}C$에서 1시간 열처리한 다음, -760 mmHg, 600V 그리고 $400^{\circ}C$에서 1시간동안 양극접합했다. 그 다음에 Si 다이어프램을 제조한 후, MLCA/Si 접합계면과 MLCA 구동을 통한 Si 다이어프램 변위특성을 분석 및 평가하였다. 다이어프램 형상에 따라 정밀한 변위 세어가 가능했으며 0.05-0.08 %FS의 우수한 선형성을 나타내었다. 또한, 측정동안 접합계면 균열이나 계면분리가 일어나지 않았다. 따라서, MLCA/Si기판 양각접합기술은 고성능 압전 MEMS 소자 제작공정에 유용하게 사용가능할 것이다.

• Journal of Welding and Joining
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• 제13권3호
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.