• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.6
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• pp.1191-1195
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• 2009

We present the efficient test wrapper design methodology considering the layout distance of scan chain. To test the scan chains in SoC, the scan chains must be assigned to external TAM(Test Access Mechanism) lines. The scan chains in IP were placed and routed without any timing violation at normal mode. However, in test mode, the scan chains have the additional layout distance after TAM line assignment, which can cause the timing violation of flip-flops in scan chains. This paper proposes a new test wrapper design considering layout distance of scan chains with timing violation free.

• Journal of Life Science
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• v.26 no.4
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• pp.431-438
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• 2016

The tumour necrosis factor (TNF)-related apoptosis-inducing ligand (TRAIL) is considered a promising anticancer agent due to its unique ability to induce cancer cell death having only negligible effects on normal cells. However, many cancer cells tend to be resistant to TRAIL. In this study, we investigated the effects and molecular mechanisms of sodium butyrate (SB), a histone deacetylase inhibitor, in sensitizing TRAIL-induced apoptosis in 5637 human bladder cancer cells. Our results indicated that co-treatment with SB and TRAIL significantly increased the apoptosis induction, compared with treatment with either agent alone. Co-treatment with SB and TRAIL effectively increased the cell-surface expression of death receptor (DR) 5, but not DR4, which was associated with the inhibition of cellular Fas-associated death domain (FADD)-like interleukin-1β-converting enzyme (FLICE) inhibitory protein (c-FLIP). Furthermore, the activation of caspases (caspase-3, -8 and -9) and degradation of poly(ADP-ribose) were markedly increased in 5637 cells co-treated with SB and TRAIL; however, the synergistic effect was perfectly attenuated by caspase inhibitors. We also found that combined treatment with SB and TRAIL effectively induced the expression of pro-apoptotic Bax, cytosolic cytochrome c and cleave Bid to truncated Bid (tBid), along with down-regulation of anti-apoptotic Bcl-xL expression. These results collectively suggest that a combined regimen of SB plus TRAIL may offer an effective therapeutic strategy for safely and selectively treating TRAIL-resistant bladder cancer cells.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• Journal of Engineering Education Research
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• v.22 no.2
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• pp.3-15
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• 2019

This study analyzed the evaluations of instructors and experts on flipped learning-based engineering in order to suggest improvement strategies. This study was conducted with 8 engineering courses which participated in the flipped learning course development project of C university from 2017-2018. As a result of the analysis, the instructors and experts pointed out that the pre-learning was not performed and checked effectively. In this regard, the instructors suggested the students' burden of pre-learning, the lack of understanding about flipped learning, and the experts suggested the lack of instructional strategies to facilitate pre-learning. In addition, the instructors and the experts pointed out that the courses were still instructor-centered. The instructors evaluated that they operated the instructor-led course by themselves. In addition, the experts suggested that there was not enough instructional strategies to activate the learner-centered activities. The number of the students and the lecture room environment that were not appropriate for the learner- centered class were the evaluation opinions of both the instructors and the experts. In addition, the professor suggested the lack of understanding and preparation of the flipped learning of the instructors and the learner as the main opinion, and the experts pointed out that the online learning system and classroom was not linked for pre-learning, classroom learning, and the post-learning. Based on these results, suggestions for improvement of flip learning based engineering course were suggested.

• Journal of the Korean Society of Food Science and Nutrition
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• v.40 no.9
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• pp.1201-1207
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• 2011

Tumor necrosis factor-related apoptosis-inducing ligand (TRAIL) has been proposed as a potent tool to trigger apoptosis in cancer therapy. However, as many types of cancer cells remain resistant towards TRAIL-induced cytotoxicity, several combined therapy approaches aimed to sensitize cells to TRAIL have been developed. Genistein, a natural isoflavonoid phytoestrogen, has been shown to have anticancer activity by inducing cell cycle arrest at G2M phase as well as apoptosis in various cancer cell lines. In the present study, we showed that treatment with TRAIL in combination with subtoxic concentrations of genistein sensitized U937 human leukemia cells to TRAIL-mediated apoptosis. Combined treatment with genistein and TRAIL effectively activated caspases through Bid truncation (tBid) and down-regulation of cellular caspase-8 (FLICE)-like inhibitory proteinL ($cFLIP_L$). However, the apoptotic effects of co-treatment with genistein and TRAIL were significantly inhibited by specific caspase inhibitors, which demonstrates the important role of caspases in apoptosis induced by genistein and TRAIL. Overall, our results indicate that genistein can potentiate TRAIL-induced apoptosis through down-regulation of $cFLIP_L$ and up-regulation of pro-apoptotic tBid proteins.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1467-1470
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• 1987

This paper proposes a functional simulation algorithm which decrease the internal memory space and run time in simulation of VLSI. Flip-flop, register, ram, rom, ic and fun are described as functional elements in the simulator. Especially icf is made as new functional element by combining the gate and the functional element, therefore icf is used efficiently in simulation of VLSI. The proposed algorithm is implemented on PC-AT(MS-DOS) in by Prolog-1.

• Electronics and Telecommunications Trends
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• v.28 no.5
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• pp.100-110
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• 2013

플립 칩 본딩 기술은 1960년대에 개발된 기술이지만 가격 경쟁력, 경박단소(輕薄短小)의 부품 구현, 뛰어난 전기적 특성으로 인해 최근에 와서 다시금 주목 받고 있고, 관련 시장이 지속적으로 성장하고 있는 분야이다. 기술 응용 분야로는 스마트 폰, 타블렛 PC 등 개인 휴대 단말기에서 고성능 서버, 게임 컨트롤로 등 다양한 제품을 아우르고 있다. 미세 피치의 경우 관련 시장이 2018년까지 연평균 35%의 폭발적인 성장을 보일 것으로 예측되고 있다. 따라서, 국내외 기업, 연구소, 학계 등에서 활발한 연구 활동이 진행되고 있다. 본고에서는 플립 칩 본딩 기술의 세부 기술을 살펴보며 동시에 피치에 따라 각 세부 기술에 있어 최근에 개발되고 있는 기술 동향을 논의하고자 한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.