• 한국광학회지
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• 제12권4호
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• pp.270-275
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• 2001

본논문에서는 구면수차가 포함된 광학 디스크 시스템에 환형 위상변조 apodizer를 적용하여 bump 형태에 따른 재생신호를 스칼라 회절 이론을 이용하여 조사하였다. 이때 구면수차의 영향을 최소로 하는 최적변수를 결정하기 위해 동(pupil)의 반경 r에 대한 파면수차량에 절대값을 취해서 얻는 최대치와 임의의 값의 비로 W$_{R}$을 정의하였으며 원추형과 준원추형 그리고 원추형 bump로 다양한 형태의 bump를 고려하였다. 환형 위상변조 apodizer는 bump 반경과 형태의 변화에 따른 재생신호가 균일한 진폭과 유사한 경향을 나타냈으며 항상높은 최대재생신호를 가졌다. 구면수차의 증가에 따른 최대재생신호의 변화는 아주 작았으며 실제 광학 디시크 시스템에 사용 가능한 0.6 이상의 재생신호를 갖는 신호 bump 반경의 변화가 거의 없었다. 특히 $W_R$ 이 0.4와 0.6인 경우에는 구면수차에 대한 보정효과가 가장 큼을 알 수 있었다.

• Tribology and Lubricants
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• 제24권3호
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• pp.140-146
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• 2008

The floating ring seal which is used in the high pressure turbo pump is frequently used in the oxidizer pump and the fuel pump of the turbo pump of the liquid propulsion rocket, because it is able to minimize clearance to decrease the leakage flow rate. But, the floating ring seal has a tendency to increase instability in decreasing eccentricity ratio. To complement this weakness, it is devised bump floating ring seal which is inserted bump in the outer surface. It has various experiment results. But the theoretical study of the bump floating ring seal didn't investigated yet. In this paper, we analyse about static characteristics of bump floating ring seal, compared previous experimental results. To analyze the characteristic of bump floating ring seal, we coupled perturbation method of floating ring seal and FEM of bump foil.

• 한국지능시스템학회논문지
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• 제23권4호
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• pp.286-291
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• 2013

대시야 백색광간섭계(WSI ; White Light Scanning Interferometer)를 이용하여, Flip Chip Bump 검사 공정에 적용하는 것을 목적으로 한 인라인 형태의 플립칩 범프 3차원 검사 장치를 개발한다. 여러 서브스트레이트에 있는 플립칩 범프 높이 측정 결과와 이에 의한 동일한 여러 범프에 대한 반복성 측정 실험 결과를 제시한다. 테스트 벤치에서의 실험 결과와 개발된 플립칩 범프 3차원 검사 장치에서의 실험 결과를 비교하였으며 진동의 영향이 감소되어 개선된 반복성 실험 결과를 얻을 수 있었다. 플립칩 범프 3차원 검사 장치의 검사성능을 평가할 수 있는 기준을 제시한다.

• 정보저장시스템학회논문집
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• 제3권4호
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• pp.183-190
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• 2007

In most hard disk drives that apply the ramp load/unload technology, the head is unloaded at the outer edge of the disk while the disk is rotating. During the unloading process, slider-disk contacts may occur by lift-off force and rebound of the slider. The main issue of this paper is to prevent the slider-disk contact by rebound, and we apply a disk bump to the unloading process. To do so, first, the ranges of bump dimension are determined. Second, the stability of each bump is checked by dynamic simulation. Finally, unload simulations are performed for stable bump designs. As a result of these steps, the effect of the bump design and the position for the unloading performance were investigated. As a consequence, we propose the optimal bump design to improve the unloading performance. Furthermore, we can identify to remove rebound contact by applying a bump on disk during the unloading process.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.674-680
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• 2017

본 논문은 현재 개인 휴대기기 및 대형 디스플레이 장비의 제어에서 폭넓게 사용되고 있는 터치스크린 패널 (TSP; Touch Screen Panel)의 정상 작동 유무를 확인하기 위한 micro bump 제작 기술에 관한 연구이다. 터치스크린 패널은 감압식, 정전식 등의 여러 가지 방식이 있으나 지금은 편리성에 의하여 정전식 방식이 주도하고 있다. 정전식의 경우 해당하는 좌표의 접촉에 따라 전기적 신호가 변화하게 되고, 이를 통하여 접촉 위치를 확인할 수 있으며 따라서 접촉 위치에 따른 전기 특성 검사가 필수적이다. 검사공정에서 TSP의 모델이 변경됨에 따라 새로운 micro bump를 제작이 및 검사 프로그램의 수정이 필수적이다. 본 논문에서는 새로운 micro bump 제작 시 mask를 사용하지 않아 보다 경제적이며 변화에 대응이 유연한 maskless lithography 시스템을 이용하여 micro bump 제작 가능성에 대하여 확인하였다. 이를 위하여 제작되는 bump의 pitch에 따른 전기장 간섭 시뮬레이션을 진행하였으며, maskless lithogrphy 공정을 적용하기 위한 패턴 이미지를 생성하였다. 이후 MEMS 기술에 해당하는 PR(Photo Resist) 패터닝 공정에서 노광(Lithography) 공정 및 현상(Developing) 공정을 통하여 PR 마스크를 제작한 후 electro-plating 공정을 통하여 micro bump를 제작하였다.

• 한국전기전자재료학회논문지
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• 제25권7호
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

• Tribology and Lubricants
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• 제22권1호
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• pp.40-46
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• 2006

This paper presents the influence coefficient method to predict the deflection of bump foil precisely in the sub-structure of AFB(air foil bearing). Heshmat has introduced the simple compliance model to calculate the deflection of bump foil. But this approach can not consider the deflection of bump foil at the edge of AFB, so elasto-hydrodynamic model is insufficient to analyze in case that the eccentricity ratio is greater than 1. Peng has used the average pressure and film thickness, but this approach is not also a realistic model. Influence coefficients of a bump is calculated by finite element method, and introduced in bump deflection equations of the performance analysis of air foil bearing. The effects of the influence coefficient on the bearing performance is discussed in detail for appropriate foil design.

• Tribology and Lubricants
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• 제18권2호
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• pp.153-159
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• 2002

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil Journal bearing. A 52 N weighted bump foil bearing sleeve was lilted off from a rotating Journal at about 3,000 rpm, and produced a load capacity of 500 N at an operating speed of 15,000 rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surfAce were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제34회 추계학술대회 개최
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• pp.212-219
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• 2001

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil journal bearing. A 52N weighted bump foil bearing sleeve was lifted off from a rotating journal at about 3,000rpm, and produced a load capacity of 500N at an operating speed of 15,000rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surface were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• 한국전기전자재료학회논문지
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• 제14권11호
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.