• Korean Journal of Optics and Photonics
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• v.12 no.4
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• pp.270-275
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• 2001

We have studied effects of annular phase apodizer and bump shapes on the read-out signal in an optical disc system, using scalar diffraction theory. In order to detennine the optimum parameters of annular phase apodizer which will minimize the influence of spherical aberration, we defined WR as the ratio between the maximum wavefront aberration and some absolute value of wavefront aberration at any position r in the pupil. A cylindric bump, a semi-conic bump and a conic bump were$.$ also considered as different types of bump shape. As the radius and shape of bump varies, the read-out signal from an optical disc system with an annular phase apodizer was similar to that from an optical disc system without apodizer. When spherical aberration increases, the maximum read-out signal of an optical disc system with an annular phase apodizer and minimum bump radii giving read-out signal higher than 0.6 rarely varied. Especially, the optimum parameters at $W_R$ = 0.4 , 0.6 gave the most compensated effect of a spherical aberration.ration.

• Tribology and Lubricants
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• v.24 no.3
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• pp.140-146
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• 2008

The floating ring seal which is used in the high pressure turbo pump is frequently used in the oxidizer pump and the fuel pump of the turbo pump of the liquid propulsion rocket, because it is able to minimize clearance to decrease the leakage flow rate. But, the floating ring seal has a tendency to increase instability in decreasing eccentricity ratio. To complement this weakness, it is devised bump floating ring seal which is inserted bump in the outer surface. It has various experiment results. But the theoretical study of the bump floating ring seal didn't investigated yet. In this paper, we analyse about static characteristics of bump floating ring seal, compared previous experimental results. To analyze the characteristic of bump floating ring seal, we coupled perturbation method of floating ring seal and FEM of bump foil.

• Journal of the Korean Institute of Intelligent Systems
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• v.23 no.4
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• pp.286-291
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• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Transactions of the Society of Information Storage Systems
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• v.3 no.4
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• pp.183-190
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• 2007

In most hard disk drives that apply the ramp load/unload technology, the head is unloaded at the outer edge of the disk while the disk is rotating. During the unloading process, slider-disk contacts may occur by lift-off force and rebound of the slider. The main issue of this paper is to prevent the slider-disk contact by rebound, and we apply a disk bump to the unloading process. To do so, first, the ranges of bump dimension are determined. Second, the stability of each bump is checked by dynamic simulation. Finally, unload simulations are performed for stable bump designs. As a result of these steps, the effect of the bump design and the position for the unloading performance were investigated. As a consequence, we propose the optimal bump design to improve the unloading performance. Furthermore, we can identify to remove rebound contact by applying a bump on disk during the unloading process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.674-680
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• 2017

Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

• Tribology and Lubricants
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• v.22 no.1
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• pp.40-46
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• 2006

This paper presents the influence coefficient method to predict the deflection of bump foil precisely in the sub-structure of AFB(air foil bearing). Heshmat has introduced the simple compliance model to calculate the deflection of bump foil. But this approach can not consider the deflection of bump foil at the edge of AFB, so elasto-hydrodynamic model is insufficient to analyze in case that the eccentricity ratio is greater than 1. Peng has used the average pressure and film thickness, but this approach is not also a realistic model. Influence coefficients of a bump is calculated by finite element method, and introduced in bump deflection equations of the performance analysis of air foil bearing. The effects of the influence coefficient on the bearing performance is discussed in detail for appropriate foil design.

• Tribology and Lubricants
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• v.18 no.2
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• pp.153-159
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• 2002

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil Journal bearing. A 52 N weighted bump foil bearing sleeve was lilted off from a rotating Journal at about 3,000 rpm, and produced a load capacity of 500 N at an operating speed of 15,000 rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surfAce were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.212-219
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• 2001

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil journal bearing. A 52N weighted bump foil bearing sleeve was lifted off from a rotating journal at about 3,000rpm, and produced a load capacity of 500N at an operating speed of 15,000rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surface were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.