• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.1-8
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• 2008

We propose how to program the off-line buffing robot path along shoes' outsole shape in the footwear buffing process by a 5-axis microscribe system like robot mechanism. The microscribe system we developed consists of a 5-axis robot link with a turn table, a signal processing unit, PC and an application software program. Itmakes a robot path on the shoes' upper in accordance with the movement of a microscribe with many joints. The developed system calculates the encoder pulse values for the microscribe arm's rotation and transmits the angle pulse values to the PC through a processing unit. Denavit-Hartenberg's(D-H) direct kinematics is used to make the global coordinate from microscribe joint one. Problems with the microscribe's kinematics can be solved efficiently and systematically by D-H representation. With the coordinate values calculated by D-H equation, our system can draw a buffing gauge-line on the upper sole. We obtain shoes' outline points, which are 2 outlines coupled with the points and the normal vector based on the points. By applying the system to the buffing robot in a flexible manufacturing system, it can be used effectively to program the path of a real buffing robot.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1469-1473
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• 2004

We suggest how to program off-line robot path along shoes' outsole shape in the footwear buffing process by a 5-axis microscribe system like robot arms. This microscribe system developed consists a 5-axis robot link with a turn table, signal processing circuit, PC and an application software program. It makes a robot path on the shoe's upper through the movement of a microscribe with many joints. To do this, first it reads 5-encoder's pulse values while a robot arm points a shoes' outsole shape from the initial status. This system developed calculates the encoder pulse values for the robot arm's rotation and transmits the angle pulse values to the PC through a circuit. Then, Denavit-Hartenberg's(D-H) direct kinematics is used to make the global coordinate from robot joint one. The determinant is obtained with kinematics equation and D-H variable representation. To drive the kinematics equation, we have to set up the standard coordinates first. The many links and the more complicated structure cause the difficult kinematics problem to solve in the geometrical way. Thus, we can solve the robot's kinematics problems efficiently and systematically by Denavit-Hartenberg's representation. Finally, with the coordinate values calculated above, it can draw a buffing gauge-line on the upper. Also, it can program off-line robot path on the shoes' upper. We are subjected to obtaining shoes' outline points, which are 2 outlines coupled with the points and the normal vector based on the points. These data is supposed to be transformed into .dxf file to be used for data of automatic buffing robot. This system developed is simulated by using spline curves coupled with each point from dxf file in Autocad. As a result of applying this system to the buffing robot in the flexible footwear manufacturing system, it can be used effectively to program the path of a real buffing robot.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.743-748
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• 2004

In this paper, an analysis on a new robot manipulator developed for the side buffing of the shoes is presented. The robot is composed of five D.O.F. An Analysis on the forward and inverse kinematics was performed. The hardware system including electric wirings, control system, and related system was developed. Also, The teleoperating communication system was developed to shake with other related system Computer programs to track the bonding line of shoes were developed. An user-friendly graphic program was developed using C $^{++}$ language for the users.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.609-613
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• 2004

On this study, electrochemical polishing is adapted to ultra-fine surface for semiconductor large radius gas-tube. The system which buffing and electrochemical polishing can be performed simultaneously was constructed in connection with developing exclusive system. Based on existing papers and the research of background, electrode gap and electrolyte flow were fixed. Current density and electrochemical precision time were chosen as variables. On this study, it is objected to find optimal precision condition and precision variables on the in-process electrochemical polishing.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.76-83
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• 2006

In this paper, an analysis on a new robot manipulator developed for the side buffing of the shoes is presented. The robot manipulator is composed of five degrees of freedom. An analysis on the forward and inverse kinematics was performed. Through the analysis, an analytic solution was derived for the joint angles corresponding to the position and orientation of the tool in the Cartesian coordinates. The hardware system of the robot composed of the control system, input/output interface system, and related electronic system was developed. The communication system was also developed to interact the robot with the related surrounding systems. A graphic user interface(GUI) program including the forward/inverse kinematics, control algorithm, and communication program was developed using visual C++ language.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.537-537
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• 2008

Copper (Cu) has been widely used for interconnection structure in intergrated circuits because of its properties such as a low resistance and high resistance to electromigration compared with aluminuim. Damascene processing for the interconnection structure utilizes 2-steps chemical mechanical polishing(CMP). After polishing, the removal of abrasive particles on the surfaces becomes as important as the polishing process. In the paper, buffing process for the removal of colloidal silica from polished Cu wafer was proposed and demonstrated.

• The tire
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• s.2
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• pp.8-13
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• 1967