• Title/Summary/Keyword: bottom electrode

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Characterization of $RuO_2$ Thin Films by Hot-wall Metal Organic Chemical Vapor Deposition (Hot-wall MOCVD에 의한 $RuO_2$ 박막의 특성)

  • 신웅철;윤순길
    • Journal of the Korean Ceramic Society
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    • v.33 no.9
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    • pp.969-976
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    • 1996
  • RuO2 thin films were deposited on SiO2(1000 $\AA$)/Si by hot-wall Metal Organic Chemical Vapor Depositon. The crystallinity of RuO2 thin films increased with increasing deposition temperature and the preferred orienta-tion of RuO2 films converted (200) plane to (101) plane with increasing film thicknesses. Such a change in preferred orientation was influenced on the crystallographic structure and the residual stress of RuO2 thin films. The resistivity of the 2700$\AA$-thick RuO2 thin films deposted at 30$0^{\circ}C$ was 52.7$\mu$$\Omega$-cm and they could be applicable to bottom electrodes of high dielectric materials. However the resistivity of RuO2 thin films increased with decreasing film thicknesses. The grain size and the resistivity of RuO2 thin films were densified with increasing the annealing temperature and showed the decrease of resistivity.

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The Resistivity Properties of SrTiO$_3$ Thin Films by Sputtering method. (스퍼터링 방법을 이용한 SrTiO$_3$박막의 저항을 특성)

  • 이우선;손경춘;서용진;김남오;이경섭;김형곤
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.207-210
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    • 1999
  • The objective of this study Is to deposited the preparation of SrTiO$_3$3 dielectric thin films on Ag/barrier-mater/Si(N-type 100) bottom electrode using a conventional rf-magnetron sputtering technique with a ceramic target under various conditions. It is demonstrated that the leakage current of films are strongly dependent on the atmosphere during deposition and the substrate temperature. The resistivity properties of films deposited on silicon substrates were very high resistivity. Capacitance of the films properties were the highest value(1000pF) and dependent on substrate temperature.

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Structural and Electrical Properties of Bismuth Magnesium Niobate Thin Films deposited at Various Temperatures

  • Park, Jong-Hyun;Yoon, Soon-Gil
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.4
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    • pp.153-156
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    • 2007
  • Structural and electrical properties of the fully crystallized-bismuth magnesium niobate ($Bi_2Mg_{2/3}Nb_{4/3}O_7$, BMN) films with 15 mol% excess bismuth deposited on Pt bottom electrode by pulsed laser deposition are characterized for various deposition temperatures. The BMN films were crystallized with a monoclinic structure from $300^{\circ}C$ and the surface roughness slightly decreases with increasing deposition temperature. The capacitance density of the films increases with increasing deposition temperature and especially, films deposited at $400^{\circ}C$ exhibit a capacitance density of approximately $620nF/cm^2$. The crystallized BMN films with approximately 170 nm thickness exhibit breakdown strength above 600 kV/cm (${\leq}10V$) irrespective of deposition temperature and a leakage current density of approximately $2{\times}10^{-8}A/cm^2$ at 590kV/cm (at 10 V).

CONDUCTIVITIES OF SEA-BOTTOM SEDIMENTS

  • HoWoongShon
    • Journal of the Korean Geophysical Society
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    • v.6 no.2
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    • pp.79-87
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    • 2003
  • An in-situ four-electrode contact resistivity probe system was designed, and field-tested in submarine sediments. Seismic survey was also performed to support and compare the results of electric survey. The probe was designed to be driven to selected depths below the seafloor using a Vibracore system. The four insulated electrodes were, spaced equidistant across the wedge, were extended beyond the probe tip to minimize effects of sediment disturbance by the wedge insertion. In-situ measurements of resistivity were recorded on board by precision electronic equipment consisting of signal generators and processors, and by temperature- monitoring systems. Overall limits of uncertainty at respective depths below the seafloor are up to ±10% of the measured values. Best estimates of conductivity are considered to be ±3 percent of the reported values. Resistivity measurements were made at six sites in carbonate sediments to a maximum depth of penetration of about 5 m. Average values of conductivity range between 0.88 and 1.21 mho/m. The results show the seabed is composed of alternating layers of relatively high-conductivity material (0.8 to 1.4 mho/m) in thicknesses of more or less one meter and layers about 30 cm thick having relatively low conductivities (0.4 to 0.8 mho/m).

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A Study on Characteristics of ZnO/n-Si Low Cost Solar Cells (ZnO/n-Si 저가 박막태양전지의 특성연구)

  • Baik, D.G.;Cho, S.M.
    • Solar Energy
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    • v.19 no.1
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    • pp.29-36
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    • 1999
  • ZnO/n-Si junctions were fabricated by spin coating with ZnO precursor produced by the sol-gel process. In order to increase the electrical conductivity of ZnO films, the films were n-doped with Al impurity and subsequently annealed at about $450^{\circ}C$ under reducing environments. The ohmic contacts between n-Si and AI for a bottom electrode were successfully fabricated by doping the rear surface of Si substrate with phosphorous atoms. The front surface of the substrate was also doped with phosphorous atoms for improving the efficiency of the solar cells. Consequently, conversion efficiencies ranging up to about 5.3% were obtained. These efficiencies were found to decrease slowly with time because of the oxide films formed at the ZnO/Si interface upon oxygen penetration through the porous ZnO. Oxygen barrier layers could be necessary in order to prevent the reduction of conversion efficiencies.

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The Effect of Thermal Treatments on the Peel Adhesion Strength of Pt/Ti Thin Film for a Bottom Electrode of Ferroelectric Materials (강유전체의 하부전극용 Pt/Ti 박막의 필 접착력에 미치는 열처리의 영향)

  • Lee, Tae-Gon;Kim, Yeong-Ho;Choe, Deok-Gyun;Gwon, O-Gyeong
    • Korean Journal of Materials Research
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    • v.6 no.6
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    • pp.610-617
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    • 1996
  • 강유전체 재료의 하부전극으로 사용되고 있는 Pt/Ti 박막의 접착력에 대한 열처리 분위기의 영향을 연구하였다. 시편의 접착력은 90$^{\circ}$ 필 테스트 방법을 사용하여 정량적으로 측정하였다. 열처리 후 사용된 분이기에 관계없이 모두 접착력이 감소하였는데 특히 산소분위기에서 열처리 한 시편의 접착력이 매우 크게 감소하였다. AES depth profile과 단면 TEM을 이용하여 계면반응을 관찰한 결과 산소열처리시에는 Ti가 외부에서 확산해 온 산소와 반응하여 rutile TiO2상이 형성됨을 알 수 있었다. 그러므로 산소열처리 후에 일어나는 접착력의 급격한 감소 원인은 열처리시 취약한 TiO2상이 형성되며 이로 인해 Ti 접착층이 고갈되기 때문임을 알 수 있었다.

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The study on the temperature characteristics of conductivity for SrTiO$_3$ thin films. (산화 스트롬튬 박막 전도도의 온도특성에 관한 연구)

  • 이우선;손경춘;박정기;김상용;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.437-440
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    • 1999
  • The objective of this study is to deposited the preparation of SrTiO$_3$dielectric thin films on Ag/barrier-mater/Si(N-type 100) bottom electrode using a conventional rf-magnetron sputtering technique with a ceramic target under various conditions. It is demonstrated that the leakage current of films are strongly dependent on the substrate temperature. The current-voltage characteristics are influenced by the Schottky effict. The resistivity properties of films deposited on silicon substrates were very high resistivity. Conduction mechanisms in the films was dependent on the substrate temperature range.

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Fabrication and microstructure of (Sr .Ca)Ti $O_3$ Ceramic Thin Films by RF Sputtering Method- (RF 스퍼터링법에 의한 (SrCa)Ti $O_3$ 세라믹 박막의 제초 및 미세구조)

  • 김진사;정일형;백봉현;김충혁;최운식;오재한;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.189-193
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    • 1997
  • (S $r_{0.85}$/C $a_{0.15}$)Ti $O_3$(SCT) thin films at various deposition temperature and rf power were grown by rf magnetron sputtering method on optimized Pt-based electrodes (Pt/TiN/ $SiO_2$/Si). The crystallinity of the films increases with increasing deposition temperature. SCT thin film is depend on the surface morphology and crystallinity of Pt films for bottom electrode. Dielectric constant of (S $r_{0.85}$C $a_{0.15}$)Ti $O_3$ thin films deposited on Si wafer substrate are larger with the increase of deposition temperature and gain size.in size.

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Electrical properties of PZT thin films deposited on corning glass substrates (Corning glass 기판위에 증착된 PZT 박막의 전기적 특성)

  • Ju, Pil-Yeon;Jeong, Kyu-Won;Park, Young;Kim, Hong-Joo;Park, Ki-Yup;Song, Joon-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.263-266
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    • 2000
  • Effects of excess Pb(50 mole %) on the crystallization properties of amorphous PZT thin films on the glass substrates by post-annealing in oxygen ambient were investigated to lower the crystallization temperature of the PZT thin films with a single perovskite phase. The PZT thin films(350nm) were prepared on Pt/Ti/corning glass(1737) substrates. The PZT thin films and bottom electrode were deposited by RF magnetron sputtering. Crystallization properties of PZT thin films were strongly dependent on RTA(Rapid Thermal Annealing) temperature. We were able to obtain a perovskite structure of PZT at 600$^{\circ}C$ for 10min. After thermal treatments were done, electrical properties such as I-V, P-E, and fatigue were measured.

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Investigation of the mechanism of Ni-P alloy deposition using by in-situ surface pH measurement during electrodeposition (음극표면 pH 측정에 의한 Ni-P합금의 전착기구 고찰)

  • 이규환;장도연;김동수;이상열;권식철;강성군
    • Journal of the Korean institute of surface engineering
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    • v.35 no.2
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    • pp.93-100
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    • 2002
  • To better understand the codeposition mechanism of phosphorous, surface pH and potential of cathode were measured during electrodeposition of Ni-P alloys. The pH of cathode surface was measured using a flat-bottom glass pH electrode and a 500 mesh gold gauze as cathode. The cathode surface pH was increased with increasing the current density and always higher than the pH in the bulk solution. As a result of overplotting the surface pH and cathode potential on the Pourbaix diagram, it was found that cathode surface shift to the domain of predominant of $H_2$$PO3$-or $H_2$$PO_2$-. Additionally, new deposition mechanism was suggested that $H_2$ $PO_2$- and $H_2$$PO_3$- play important roles in the deposition reaction of Ni-P alloys.