• Title/Summary/Keyword: boron paste

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Evaluation of Neutron Shielding Performance of Polyethylene Coated Boron Carbide-Incorporated Cement Paste using MCNP Simulation (MCNP 시뮬레이션을 통한 폴리에틸렌 코팅 탄화붕소 혼입 시멘트 페이스트의 중성자 차폐 성능 평가)

  • Park, Jae-Yeon;Jee, Hyeon-Seok;Bae, Sung-Chul
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.11a
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    • pp.114-115
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    • 2018
  • To develop an effective shielding material for spent fuel that emits fast neutrons is necessary. In this study, thermal neutron and fast neutron shielding performance of polyethylene coated boron carbide-incorporated cement paste was quantitatively analyzed by Monte Carlo N-Particle transport code (MCNP) simulations. As the results of the simulations, fast neutrons were effectively shielded through large quantity of hydrogen and boron elements in polyethylene and boron carbide.

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BORIDING OF STEEL WITH PECVD METHOD

  • Lee, M.J.;Lee, K.Y.;Lee, J.H.;Kim, Y.H.
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.249-252
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    • 1999
  • Boriding is one of the chemical method to increase surface hardness as well as carburizing, and nitriding. Gas boriding and boron paste boriding methods were investigated to replace salt bath boriding. Boron paste boriding method is selected due to safety, small waste and low cost. And then boriding is also carried out micro-pulsed PECVD in order to increase efficiency of boriding. Mechanical properties, microstructure, surface concentration, and depth profile of borided layer is investigated by micro-vickers hardness tester, SEM, XRD, and AES.

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Characteristics of Mono Crystalline Silicon Solar Cell for Rear Electrode with Aluminum and Aluminum-Boron (Aluminum 및 Aluminum-Boron후면 전극에 따른 단결정 실리콘 태양전지 특성)

  • Hong, Ji-Hwa;Baek, Tae-Hyeon;Kim, Jin-Kuk;Choi, Sung-Jin;Kim, Nam-Soo;Kang, Gi-Hwan;Yu, Gwon-Jong;Song, Hee-Eun
    • 한국태양에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.34-39
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    • 2011
  • Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

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Rheology Analysis of Cement Paste According to the Concentration of Borax Diluted Solution (붕사 희석액 농도에 따른 시멘트 페이스트의 레올로지적 분석)

  • Lee, Hyang-Sun;Lee, Yu-Jeong;Han, Dong-Yeop
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2019.05a
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    • pp.110-111
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    • 2019
  • Concrete with high thixotropy has a lower plastic viscosity when pour in, thus demonstrating fluidity, and After poured, the viscosity can be restored again to ensure stable progress without additional liquidity and material separation. Therefore, in this study, a basic study of thixotropy of concrete was proceeded through cross-linked bond of PVA and Borax. Therefore, it is judgment that the higher the concentration of boron solutions, the higher the strength of the interconnections between PVA and boron.

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DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board (DMAB첨가량에 따른 연성회로기판을 위한 무전해 Ni 도금박막에 관한 연구)

  • Kim, Hyung-Chul;Rha, Sa-Kyun;Lee, Youn-Seoung
    • Korean Journal of Materials Research
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    • v.24 no.11
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    • pp.632-638
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    • 2014
  • We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

Effect of Additives on the Refractive Index of B2O3-SiO2-Al2O3 Glasses for Photolithographic Process in Electronic Micro Devices

  • Won, Ju-Yeon;Hwang, Seong-Jin;Lee, Jung-Ki;Kim, Hyung-Sun
    • Korean Journal of Materials Research
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    • v.20 no.7
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    • pp.370-373
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    • 2010
  • In fabricating plasma display panels, the photolithographic process is used to form patterns of barrier ribs with high accuracy and high aspect ratio. It is important in the photolithographic process to control the refractive index of the photosensitive paste. The composition of this paste for photolithography is based on the $B_2O_3-SiO_2-Al_2O_3$ glass system, including additives of alkali oxides and rare earth oxides. In this work, we investigated the density, structure and refractive index of glasses based on the $B_2O_3-SiO_2-Al_2O_3$ system with the addition of $Li_2O$, $K_2O$, $Na_2O$, CaO, SrO, and MgO. The refractive index of the glasses containing K2O, Na2O and CaO was similar to that of the [BO3] fraction while that of the SrO, MgO and Li2O containing glasses were not correlated with the coordination fraction. The coordination number of the boron atoms was measured by MAS NMR. The refractive index increased with a decrease of molar volume due to the increase in the number of non-bridging oxygen atoms and the polarizability. The lowest refractive index (1.485) in this study was that of the $B_2O_3-SiO_2-Al_2O_3-K_2O$ glass system due to the larger ionic radius of $K^+$. Based on our results, it has been determined that the refractive index of the $B_2O_3-SiO_2-Al_2O_3$ system should be controlled by the addition of alkali oxides and alkali earth oxides for proper formation of the photosensitive paste.

Characteristics of the PbO-Bi2O3-B2O3-ZnO-SiO2 Glass System Doped with Pb Metal Filler (Pb 금속필러가 첨가된 PbO-Bi2O3-B2O3-ZnO-SiO2계 유리의 특성)

  • Choi, Jinsam;Jeong, DaeYong;Shin, Dong Woo;Bae, Won Tae
    • Journal of the Korean Ceramic Society
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    • v.50 no.3
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    • pp.238-243
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    • 2013
  • We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

A Study on the Boronizing treatment of the microalloyed steel (비조질강의 Boronizing 처리에 관한 연구)

  • 김강형;선명숙;윤재홍;변응선;권동일
    • Journal of the Korean institute of surface engineering
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    • v.29 no.4
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    • pp.268-277
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    • 1996
  • Boronizing treatment of Microalloyed steel has been investigated by mean of Boronizing paste mainly consisted of $B_4C$ at various temperatures and times. The micro hardness of the boride layers were about HV 1200~1500. The thickness of the boride layer were increased with an increase of square root of treatment time at constant temperature. The activation energy for diffusion of boron in the specimen obtained from the slope of Arrhenius plots was 254 kJ/mol, but 197 kJ/mol for the induction heated specimen. The boride layer had a good corrosion resistance in solutions of 20% HCl and 20% $H_2SO_4$, solution. In 20% $HNO_3$ solution, however, its corrosion resistance increased. The boride layer had a good high temperature oxidation resistance at below $800^{\circ}C$, but at temperature above $900^{\circ}C$, the oxidation resistance decreased as the oxidation temperature.

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