• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.1
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• pp.9-16
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• 1993

To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.91-98
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• 2024

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest "theoretically" possible temperature of 145 ℃. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 ℃, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 ℃. In particular, it is interesting to note that in the pressure sintering bonding process at 145 ℃, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 ℃, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 ℃, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.1
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• pp.26-33
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• 2004

Self-etching priming bonding system was recently developed in order to simplify the clinical skills & save chair time after continuous improvements on dentin bonding agents. To test the magnitude of microleakage of a new "self-etching priming bonding agent" using sound premolar 4th, 5th, 6th generation dentin bonding agent was applied. Measure the magnitude of infiltration to the gap of enamel-restoration interface and dentin-restoration interface. After bonding of composite resin to sample surfaces according to the manufactures direction and 500 times thermocycling on dwell time 30 second, and microleakage was measured by the ratio of the depth to the axial wall and the magnitude of infiltration. Afterward analyzed by ANOVA test. The result were as follows ; 1. Enamel groups showed lesser microleakage (Group I, II, III, IV) than dentin groups(Group V, VI, VII, VIII). (p<0.05) 2. There are no statical differences among the dentin groups, in enamel groups, group IV showed more microleakage than group I, II, III. (p<0.05). For a clinical acceptance, better enamel marginal adaptation is required.

• Journal of Korean Tunnelling and Underground Space Association
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• v.10 no.2
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• pp.105-118
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• 2008

Shotcrete is one of the main support materials in tunnelling. Its bonding state on excavated rock surfaces controls the safety of the tunnel: De-bonding of shotcrete from an excavated surface decreases the safety of the tunnel. Meanwhile, the bonding state of shotcrete is affected by blasting during excavation at tunnel face as well as bench cut. Generally, the bonding state of shotcrete can be classified as void, de-bonded, or fully bonded. In this study, the state of the back-surface of shotcrete is investigated using impact-echo (IE) techniques. Numerical simulation of IE technique is performed with ABAQUS. Signals obtained from the IE simulations were analyzed at time, frequency, and time-frequency domains, respectively. Using an integrated active signal processing technique coupled with a Short-Time Fourier Transform (STFT) analysis, the bonding state of the shotcrete can be evaluated accurately. As the bonding state worsens, the amplitude of the first peak past the maximum amplitude in the time domain waveform and the maximum energy of the autospectral density are increasing. The resonance frequency becomes detectable and calculable and the contour in time-frequency domain has a long tail parallel to the time axis. Signal characteristics with respect to ground condition were obtained in case of fully bonded condition. As the ground condition worsens, the length of a long tail parallel to the time axis is lengthened and the contour is located in low frequency range under 10 kHz.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• Transactions of Materials Processing
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• v.13 no.7
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.785-790
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• 2002

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

• Journal of Korean Tunnelling and Underground Space Association
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• v.12 no.3
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• pp.247-255
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• 2010

Bonding strength of shotcrete is a significant influential factor which plays the role of collapse prevention of tunnel crown and of debonding prevention of shotcrete induced by the blasting vibration. Thus, the evaluation of the shotcrete bonding state is one of the core components for shotcrete quality control. In this study, the peak particle velocities induced by blasting were measured on the shotcrete in a tunnel construction site and its effect on the bonding state of shotcrete is investigated. Drilling and blasting technique was used for the excavation of intersection tunnel connecting the main tunnel with the service tunnel. Blast-induced vibrations were monitored at some points of the main tunnel and the service tunnel. The shotcrete bonding state was evaluated by using impact-echo test coupled with the time-frequency domain analysis which is called short-time Fourier transformation. Analysis results of blast-induced vibrations and the time-frequency domain impact-echo signals showed that the blasting condition applied to the excavation of intersection tunnel hardly affects on the tunnel shotcrete bonding state. The general blasting practice in Korea was evaluated to have a minor negative impact on shotcrete quality.