• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.90-106
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• 1995

The "O"S' BONDING make metallic and non-metalic crystal structures and form localized superconducting orbitals , which induce electrical conduction , semi-conduction, and superconduction. The orbitals are proced by Ampere's law, Faraday's law , Meissner effect, highcritical temperature of thecopper oxide layers. abnomal trans-membrane signal in cancer cell and plastic deformations bytwins and dislocations, In the case of alloying metals, the most deterimentla cases of electrical conduction are those of solid solution and intermetalic compound . The highest case for the hardness are also those of solid solution and intermetallic compound. It explains the contributions of the "O"S' BONDING for conduction bands and plastic deformation by twins and dislocations.ns and dislocations.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.3
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• pp.123-128
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• 2008

Ti-6Al-4V alloy is a critical strategic metal used in aerospace structure due to the high specific strength, toughness, durability, low density, corrosion resistance. Examples of application of this alloy are airframe structural components, aircraft gas turbine disks and blades. Forming of this alloy is not easy due to its high strength and low formability. However, this alloy shows superplastic properties that allow for large plastic deformation under certain conditions. Combination of superplastic forming and diffusion bonding(SPF/DB) processes of this alloy has been widely used to replace mechanically fastened structures with reduced weight and fabrication costs. In this study, superplastic forming/diffusion bonding technology has been developed for fabricating lightweight sandwich panels with Ti-6Al-4V alloy. The experimental results show the forming of titanium lightweight sandwich structure is successfully performed from 3 and 4 sheets of Ti-6Al-4V.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Advanced Composite Materials
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• v.16 no.1
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• pp.31-44
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• 2007

The purpose of this study is to improve the examining and understanding of the bonding behavior of Fiber Reinforced Polymer (FRP) sheets bonded to concrete blocks and steel plates under fatigue loading. First, a series of experimental investigations is summarized in the paper. The fatigue behavior of bonding surface between FRP sheets and concrete is finally characterized by the conducted P-S-N diagram representing the relationship among the probability of FRP debonding (P), the bond stress amplitudes (S), and the number of cycles (N) at debonding on a semi-logarithmic scale. The different debonding modes for various fracturing surface are also investigated and evaluated.

• Journal of Korea Foundry Society
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• v.30 no.5
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• pp.187-195
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• 2010

In this study, in order to obtain a useful guide line for design and production of automotive heat exchanger components made of 4343/3003/4343 aluminum clad sheets, it was aimed to improve the understanding about the grain refinement effect on brazing characteristic of the clad sheets. Al-10Ti master alloy was used for grain refinement of 3003 core alloy, and the Ti inoculation level was systematically changed up to 0.1 wt%. The three-layer aluminum clad sheets were fabricated by hot roll bonding process. The effect of grain refinement on brazing characteristic of the clad sheets was investigated by evaluating wettability, bonding strength and sagging resistance.

• Bulletin of the Korean Chemical Society
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• v.34 no.9
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• pp.2711-2719
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• 2013

Hydrogen bonding interaction between alcohols and water molecules is an important characteristic in the aqueous solutions of alcohols. In this paper, a series of molecular dynamics simulations have been performed to investigate the aqueous solutions of low molecular weight alcohols (methanol, ethylene glycol and glycerol) at the concentrations covering a broad range from 1 to 90 mol %. The work focuses on studying the effect of the alcohols molecules on the hydrogen bonding of water molecules in binary mixtures. By analyzing the hydrogen bonding ability of the hydroxyl (-OH) groups for the three alcohols, it is found that the hydroxyl group of methanol prefers to form more hydrogen bonds than that of ethylene glycol and glycerol due to the intra-and intermolecular effects. It is also shown that concentration has significant effect on the ability of alcohol molecule to hydrogen bond water molecules. Understanding the hydrogen bonding characteristics of the aqueous solutions is helpful to reveal the cryoprotective mechanisms of methanol, ethylene glycol and glycerol in aqueous solutions.

• Composites Research
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• v.30 no.6
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• pp.416-421
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• 2017

The structural adhesive have been manufactured for improvement of bonding process between CFRP and metal. The optimal condition for bonding process were investigated by evaluating the lap shear strength with amount of adhesive and curing time and the surface treatment of the CFRP. To confirm proper adhesion conditions, the fracture sections between CFRP and metal was observed using reflection microscope. Not only the improvement of the adhesion condition was important, but surface treatment on CFRP was also important. The optimal curing temperature was at $180^{\circ}C$ for 20 minutes. The improvement for adhesive property was confirmed After surface treatment on CFRP. The optimal amount of structural adhesive for bonding between CFRP and metal was $1.5{\times}10^{-3}g/mm^2$. Through the optimization of bonding process, the improvement of mechanical property over 10% is confirmed in comparison with existing adhesive.

• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.1-8
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• 2012

The effect of the grafting ratio on the mechanical property and adhesion property of the grafted EPDM modified with methacrylic acid (MA) was investigated. The storage modulus of MA-grafted EPDM was maintained higher than that of cross-linked EPDM vulcanizate by sulfur, but it was observed that the storage modulus was decreased at elevated temperature because of the weakened secondary bonding. When the functional group for hydrogen bonding was introduced in EPDM, it had excellent mechanical properties by the aggregate between grafted EPDM molecules and crystallinity of MA. The bonding strength between EPDM and other rubbers was very low because EPDM has nonpolar property and low molecular interaction to others. The bonding strength was increased as increasing grafting ratio and it was excellent enough to break the rubber during the peel test when the grafting ratio was more than 10%.