• 한국건축시공학회지
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• 제14권3호
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• pp.216-222
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• 2014

단면수복 보수를 실시한 RC조 부재의 내하성능 회복을 예측 평가하기 위하여 FEM해석이 빈도 높게 사용되고 있으나 부착에 대한 정보가 부족하여 정확도 있는 예측이 힘든 실정이다. 수치해석의 입력데이터가 되는 철근과 폴리머 시멘트 모르타르의 부착특성을 평가하기 위하여 폴리머 시멘트 모르타르를 이용한 일련의 인발실험을 실시하였다. 동시에 범용성있는 해석결과 활용을 위하여 부착특성을 부착강성과 부착강도로 정의하고 비선형 FEM 감도 역해석을 실시하였다. 결과를 요약하면 보수재료의 화학적 부착보다 물리적 부착이 지배적이며 폴리머 분말수지의 함유에 의해 다소 부착계면의 성능이 저하하는 것을 알 수 있었다. 부착계면의 물성은 강성과 강도로 구분하여 모델화하는 것이 합리적인 것으로 사료된다.

• Advances in materials Research
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• 제1권2호
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• pp.147-160
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• 2012

In the present study, diffusion bonding was carried out between AZ31B magnesium and AA2024 aluminium in the temperature range of $405^{\circ}C$ to $475^{\circ}C$ for 15 min to 85 min and 5MPa to 20 MPa uniaxial loads was applied. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analyzed by means of optical microscopy, scanning electron microscopy, energy dispersive spectrometer and XRD. The maximum bonding and shear strength was obtained at $440^{\circ}C$, 12 MPa and 70 min. The maximum hardness values were obtained from the area next to the interface in magnesium side of the joint. The hardness values were found to decrease with increasing distance from the interface in magnesium side while it remained constant in aluminium side. It was seen that the diffusion transition zone near the interface consists of various phases of $MgAl_2O_4$, $Mg_2SiO_4$ and $Al_2SiO_5$.

• 한국자동차공학회논문집
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• 제21권4호
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• pp.113-119
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• 2013

The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magnesium alloy AZ31 with the aid of a pure Ni interlayer. A $13{\mu}m$ thick pure Ni foil was used in order to form a Mg-Ni eutectic liquid at the joint interface. The interface of reaction and composition profiles were investigated as a function of bonding time using a pressure of 0.16 MPa and a bonding temperature of $515^{\circ}C$. The quality of the joints produced was examined by metallurgical characterization and the joint microstructure developed across the diffusion bonds was related to changes in mechanical properties as a function of the bonding time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.430-433
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• 2005

Laser bonding between similar and dissimilar thermoplastics has been investigated by making use of laser transmission weld technique. Spot welding of two layers of plastic materials has been demonstrated by using of a high-quality diode-laser with 808nm wavelength. Weld areas increases according to power density, exposure time. The results of peel out test show that peel strengths increase with the area of molten plastics. Layers, which have the same chemical properties, have good bonding qualities. A bonding method which dye film is coated on the interface is used for laser bonding between plastics with high transmission for laser wavelength. Laser transmission bonding is worthy of attention because it is not in contact, requires a few tooling devices, allows a flexible energy delivery and produces nearly invisible welds

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1996년도 봄 학술발표회 논문집
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• pp.129-134
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• 1996

Bonding strength of reinforcing material has been recognized to be the most important factor which determines the strengthening effect and the durability of repair work. The properties of bonding layers affects the stress distribution at the end of the plate, therefore the behavior of bonding layer has to be investigated. In this study, the stress distribution at the end of the bonded plate has been tested and compared with Roberts' analysis. Shear stress and vertical normal stress at the end of strengtening plate are analysized and the effedts of bonding layer thickness, plate thickness and plate length on the bonding behavior are tested. The test results showed that thickness is one of the most important factor, which is the thinner the thickness, the smaller the maximum stress.

• 통합자연과학논문집
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• 제5권3호
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• pp.195-197
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• 2012

Halogen atoms in a molecule are traditionally considered as electron donors, since they have unshared electrons. Normally when they are bonded, there are three lone pair electrons. These lone pairs can function as Lewis bases. However, when they are bound to electron withdrawing groups, they can act as Lewis acids. Since the situation is similar hydrogen bonding (HB), this type of interaction is named as halogen bonding (XB). This mainly comes from the uneven distribution of electron density around the halogen atoms. Since the electron density around halogen atom opposite to ${\sigma}$-bond is depleted, its electropositive region is called ${\sigma}$-hole. This ${\sigma}$-hole can attract halogen bond acceptors, requiring more stringent directionality compared to HB. Since this interaction mainly comes from electrostatic origin, the geometry tends to be linear. Since the XB energy is comparable to corresponding HB. Still in its infancy, XB shows a broad range of applicability, with potentially more useful properties, compared to corresponding HB.

• 한국재료학회지
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• 제20권6호
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Tribology and Lubricants
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• 제21권6호
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• pp.302-305
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• 2005

Various carbon nanotubes (CNTs) are added into the epoxy matrix as reinforcements to investigate the effect on the wear behavior. Effects to the tribological properties of different loading concentrations and types of surface modification are investigated by using a linear reciprocal wear tester. As increasing the concentration of CNTs shows the reduction of the wear loss. Moreover, surface modified CNTs give better tribological property than as produced CNTs. It is due that the functional groups on the surface of CNTs increase the interfacial bonding between CNTs and epoxy matrix through chemical bonding. Changes in worn surface morphology are observed by optical microscope and SEM to investigate the wear behavior. CNTs in the epoxy matrix near the surface are exposed and it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the CNTs.

• Applied Science and Convergence Technology
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• 제26권3호
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• pp.43-46
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• 2017

Aluminum-doped ZnO (AZO) thin films were deposited by atomic layer deposition (ALD) with respect to the Al doping concentrations. In order to explain the chemical stability and electrical properties of the AZO thin films after hydrogen peroxide ($H_2O_2$) solution immersion treatment at room temperature, we investigated correlations between the electrical resistivity and the electronic structure, such as chemical bonding state, conduction band, band edge state below conduction band, and band alignment. Al-doped at ~ 10 at % showed not only a dramatic improvement of the electrical resistivity but also excellent chemical stability, both of which are strongly associated with changes of chemical bonding states and band edge states below the conduction band.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.1-1
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• 1994

;The electronic state calculations for various types of ceramic materials have beell performed by the use of $DV-X\;{\alpha}$ cluster method. The molecular orbital levels and wave functions for model clusters have been computed to study the electronic properties ami chemical bonding of the ceramics. For ${\beta}-sialon(Si_{6-z}Al_zO_zN_{8-z})$ which is a high temperature structural material based on ${\beta}-Si_3N_4$, we have made model cluster calculations to estimate the strength of chemical bonding between atoms by the Mulliken population analysis. It is found that the covalent bonding between Si and N atoms is very strong in pure ${\beta}-Si_3N_4$, but the covalency around solute atom is considerably weakened when Si atom is substituted by AI. This tendency is enhanced by an additional substitution of oxygen atom for N. The result calculated can well explain the experimental data of changes in mechanical properties such as the reductions of Young's modulus and Vickers hardness with increment of z-value in ${\beta}-sialon$. Various model clusters for transition metal oxides which show many interesting physical and chemical properties have also been calculated. High-valent perovskite-type iron oxides EMFe0_3E(M=Ca and Sr) possess very interesting magnetic and chemical properties. In these oxides, iron exists as $Fe^{4+}$ state, but the experimental measurement of Mossba~er effect suggests that disproportionation $2Fe^{4+}=Fe^{3+}+Fe^{5+}$ takes place for $CaFe0_3$ at low temperatures. The model cluster calculations for these compounds indicated the existence of considerably strong covalent bonding of Fe-O. The calculations of hyperfine interaction at iron neucleus show very good agreement with the experimental Mossbauer measurements. The result calculated also implies that the disproportionation reaction is strongly possible by assuming the quenching of breathing phonon mode at low temperatures.tures.