• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.605-608
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• 2008

This study investigated fundamental properties corresponding to mixtures for the high strength, and their properties of spalling prevention after a fire test. The results were summarized as following. For the flowability of using mixtures for the high strength, the target flow was satisfied with a small quantity of high performance reducing water agent to compare with silica fume. For the compressive strength in the case of using mixtures for the high strength, it was higher to compare with silica fume at 7 days, so it was proved that using mixtures for the high strength was profitable to prevent early frost damage. The compressive strength at the 28 days of silica fume and mixtures for the high strength were similar. There was no reduced tendency at the compressive strength according fiber contents, so it found out that the bonding strength between the fiber and concrete was hardly effective. For the spalling properties, the specimens without fibers were destroyed, however using over 0.05% of NY and PP fibers was effective to prevent spalling on the high strength concrete.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Korean Wood Science and Technology
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• v.39 no.5
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• pp.429-436
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• 2011

The selected physical and mechanical properties of non-certificated LVL circulated in domestic lumber market were investigated and compared to relevant standards. The tested LVL passed the moisture content and the soaking delamination rate limit as per domestic (KS) and Japanese standard (JAS). The evaluated mechanical properties were flatwise/edgewise bending strength, modulus of elasticity (MOE), horizontal shear and compressive strength. The 30 mm-thick LVL showed significantly higher bending strength than that of the 25 mm-thick LVL. The modulus of elasticity (MOE) showed same tendency in the results of bending strength. The edgewise bending strength and MOE were higher than that of flatwise bending strength and MOE. The horizontal shear strength values were also showed similar results to bending strength values. The tested results were compared each other and each products were graded according to JAS 701 grade specification. The failure mode of LVL in bending test showed the similar failure mode of solidwood that failed in a simple tension manner (splintery tension). The glue line failure was severe in 25 mm-thick specimens due to concentration of shear stress in layer discontinuity containing small voids and starved glue lines. In horizontal shear strength test, failure mode of LVL showed the typical horizontal shear failure. Compressive specimens failed with fiber crushing in company with apparent delamination that splitted along the length of the specimens. From the results, the complete bonding between lamination and consistency in thin veneer layer were considered as a critical factor in the mechanical properties of LVL. Moreover, the standard test procedure and specification for non-certificated LVL should be required to check the performance of uncertificated materials.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06a
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• pp.111-116
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• 2006

The microstickes control effects of some fixing agents, including an inorganic PAC, an organic polyamine (PA) and polydiallydimethyl ammonium chloride (Pdadmac), and a high cationic starch (HCS), were investigated, together with their effects on wet end performances and physical properties of handsheets. Despite that the HCS and Pdadmac had lower cationic charge densities than the PA and PAC (the HCS being even lower), they gave higher zeta potentials to fibers, and lower turbidities, cationic demands and residual COD contents to the pulp liquid phases than the PA and PAC did. In all cases, the HCS showed even better effects than the Pdadmac. In addition, drainage speed was also much higher by the HCS treatments although paper formation was worsened. All the phenomena showed that the HCS can fix more dissolved and colloidal substances to cellulose fibers, indicating that the HCS functioned mainly with flocculation and even hydrogen bonding mechanisms. Data on optical properties further indicated that the HCS interacted preferentially with colloidal substances, since it fixed more 'dirty' microstickes to fibers which decreased more sheet brightness while increasing more sheet opacity (with both higher light absorption and scattering coefficients). Interestingly, the organic fixing agents did not decrease tensile, tearing, and folding strengths of paper sheets made from 100% recycled newsprint pulp, except when they were dosed in high amounts. On the contrary, the inorganic PAC had more serious negative effects on the strength properties, especially on folding endurance. The study suggested that proper use of the HCS can lead to better microstickies control effects than traditional agents and methods.

• Journal of IKEEE
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• v.18 no.4
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• pp.559-565
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• 2014

A 3 dB coupler has been designed and implemented using the most commonly used double-sided FR4 boards. The coupling and the bandwidth of the coupler are enhanced with the enlarged overlapped area of the coupler. Major design parameters are plotted as a design guide and the parameters are verified by simulation and measurement. The size of the manufactured coupler is $30{\times}14mm^2$. Its measured insertion loss and phase difference are 0.6 dB and $90.5^{\circ}$ at center frequency of 2.5 GHz, respectively. The operating frequency range is 1.72 GHz to 3.08 GHz for $3.6{\pm}0.5dB$ insertion loss. The coupler has the performance similar to that of conventional Lange coupler, and implementation of the coupler is easy and cheap with wide metal width and spacing and no additional wire bonding process.

• The Journal of Advanced Prosthodontics
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• v.10 no.5
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• pp.340-346
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• 2018

PURPOSE. In this study, the shear bond strengths (SBS) of luting cements to fixed superstructure metal surfaces under various seating forces were investigated. MATERIALS AND METHODS. Seven different cements [Polycarboxylate (PCC), Glass-Ionomer (GIC), Zinc phospahate (ZPC), Self-adhesive resin (RXU), Resin (C&B), and Temporary cements ((RXT) and (TCS))] were bonded to a total number of 224 square blocks ($5{\times}5{\times}3mm$) made of one pure metal [Titanium (CP Ti) and two metal alloys [Gold-Platinum (Au-Pt) and Cobalt-Chrome (Co-Cr)] under 10 N and 50 N seating forces. SBS values were determined and data were analyzed with 3-way ANOVA. Pairwise comparisons and interactions among groups were analyzed with Tukey's simultaneous confidence intervals. RESULTS. Overall mean scores indicated that Co-Cr showed the highest SBS values ($1.96{\pm}0.4$) (P<.00), while Au-Pt showed the lowest among all metals tested ($1.57{\pm}0.4$) (P<.00). Except for PCC/CP Ti, RXU/CP Ti, and GIC/Au-Pt factor level combinations (P<.00), the cements tested under 10 N seating force showed no significantly higher SBS values when compared to the values of those tested under 50 N seating force (P>.05). The PCC cement showed the highest mean SBS score ($3.59{\pm}0.07$) among all cements tested (P<.00), while the resin-based temporary luting cement RXT showed the lowest ($0.39{\pm}0.07$) (P<.00). CONCLUSION. Polycarboxylate cement provides reliable bonding performance to metal surfaces. Resin-based temporary luting cements can be used when retrievability is needed. GIC is not suitable for permanent cementation of fixed dental prostheses consisting of CP Ti or Au-Pt substructures.

• Wind and Structures
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• v.26 no.2
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• pp.75-87
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• 2018

A large number of low-rise buildings experienced serious roof covering failures under strong wind while few suffered structural damage. Clay and concrete tiles are two main kinds of roof covering. For the tile roof system, few researches were carried out based on Finite Element (FE) analysis due to the difficulty in the simulation of the interface between the tiles and the roof sheathing (the bonding materials, foam or mortar). In this paper, the FE analysis of a single clay or concrete tile with foam-set or mortar-set were built with the interface simulated by the equivalent nonlinear springs based on the mechanical uplift and displacement tests, and they were expanded into the whole roof. A detailed wind tunnel test was carried out at Tongji University to acquire the wind loads on these two kinds of roof tiles, and then the test data were fed into the FE analysis. For the purpose of validation and calibration, the results of FE analysis were compared with the full-scale performance ofthe tile roofs under simulated strong wind impact through one-of-a-kind Wall of Wind (WoW) apparatus at Florida International University. The results are consistent with the WoW test that the roof of concrete tiles with mortar-set provided the highest resistance, and the material defects or improper construction practices are the key factors to induce the roof tiles' failure. Meanwhile, the staggered setting of concrete tiles would help develop an interlocking mechanism between the tiles and increase their resistance.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.218.2-218.2
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• 2014

그래핀은 높은 전기 전도도와 열전도도, 기계적 강도를 가지고 있고 동시에 높은 전자이동도($200,000cm^2{\cdot}V{\cdot}^1{\cdot}s{\cdot}^1$) 특성을 갖는 물질로써 차세대 소재로 각광받고 있다. 하지만 그래핀을 소자에 응용하기 위해서는 전사공정과 lithography 공정 과정에서 발생되는 PMMA(Poly methyl methacrylate) residue를 완벽하게 제거해야 하는 문제점이 있다. 특히, lithography 공정 중 완벽하게 PMMA residue 가 제거되지 않고 잔류해 있을 경우에 소자의 life time, performance에 악영향을 준다는 보고가 있다. 이와같은 문제를 해결하기 위해 화학적 cleaning, 열처리를 통한 cleaning, 전류 인가에 의한 cleaning과 같은 방법들을 이용하여 그래핀의 PMMA residue를 제거하는 공정들이 보고되고 있지만, 화학적 cleaning 방법의 경우 chloroform 이라는 독성물질 사용으로 인해 산업적으로 응용이 어렵고, 열처리 방법은 전극 등의 금속이 $200^{\circ}C$ 이상의 높은 온도에서 장시간 노출될 경우 쉽게 손상을 입으며, 전류 인가에 의한 cleaning 방법은 국부적으로만 효과를 볼 수 있기 때문에 lithography 공정 후 PMMA residue를 효과적으로 제거하기에는 한계를 보이고 있다. 본 연구에서는 Ar을 이용하는 Ion beam 시스템을 통해 beam energy를 제어함으로써 PMMA residue를 효과적으로 제거하는 연구를 진행하였다. 최적화된 플라즈마 발생 조건을 찾기 위해 QMS(Quadrupole Mass Spectrometer)를 이용하여 입사하는 ion energy와 flux 양을 컨트롤 하였고, 250 W에서 최적화된 ion energy distribution 영역이 존재한다는 것을 확인할 수 있었다. 또한, 25 Gauss 정도의 electro-magnetic field를 이용하여 Ar의 ion energy를 10 eV 이하로 낮추어 damage를 최소화함으로써 효과적으로 그래핀을 cleaning 할 수 있었다. Cleaning과정에서 ion bombardment에 의해 발생한 damage는 $250^{\circ}C$에서 6시간 동안 annealing 공정을 거치면서 회복되는 것을 Raman spectroscopy의 D peak ($1335cm{\cdot}^1$) / G peak ($1572cm{\cdot}^1$) ratio 로 확인할 수 있었고, PMMA residue의 cleaning 여부는 G peak ($1580cm{\cdot}^1$)의 blue shift와 2D peak ($2670cm{\cdot}^1$)의 red shift를 통해 확인하였다. 그리고 AFM (Atomic Force Microscopy)을 이용하여 cleaning 공정과정에서 RMS roughness가 4.99 nm에서 2.01 nm로 감소하는 것을 관찰하였다. 마지막으로, PMMA residue의 cleaning 정도를 정량적으로 분석하기 위해 XPS (X-ray Photoelectron Spectroscopy)를 이용하여 sp2 C-C bonding이 74.96%에서 87.66%로 증가함을 확인을 할 수 있었다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.241-244
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• 2012

In this paper, three types of optical receivers are designed using a $0.35-{\mu}m$ standard CMOS technology for plastic optical fiber (POF) applications. Basic common-source transimpedance amplifier (CS-TIA), common-gate TIA (CG-TIA), and regulated-cascode TIA (RGC-TIA) are optimally designed, and their transimpedance gain (TZ gain), 3-dB bandwidth, and noise characteristics are compared and analyzed. As a result of simulations, the RGC-TIA indicates better TZ gain and 3-dB bandwidth than other topologies, and CS-TIA has the best noise performance. Each optical receiver occupies area of $0.35mm^2$.