• 한국재료학회지
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• 제28권5호
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• pp.308-314
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• 2018

Among the fuel cell electrolyte candidates in the intermediate temperature range, glass materials show stable physical properties and are also expected to have higher ion conductivity than crystalline materials. In particular, phosphate glass has a high mobility of protons since such a structure maintains a hydrogen bond network that leads to high proton conductivity. Recently, defects like volatilization of phosphorus and destruction of the bonding structure have remarkably improved with introduction of cations, such as Zr4+ and Nb5+, into phosphate. In particular, niobium has proton conductivity on the surface because of higher surface acidity. It can also retain phosphorus content during heat treatment and improve chemical stability by bonding with phosphorus. In this study, we fabricate niobium phosphate glass thin films through sol-gel processing, and we report the chemical stability and electrical properties. The existence of the hydroxyl group in the phosphate is confirmed and found to be preserved at the intermediate temperature region of $150-450^{\circ}C$.

• Restorative Dentistry and Endodontics
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• 제7권1호
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.

• 한국세라믹학회지
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• 제32권10호
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• pp.1203-1211
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• 1995

The tests of three point bending and vickers hardness have been carried out to investigate mechanical characteristics of bioceramics for artificial dental crowns. And color and color difference test has been performed to study chromaticity changes after sintering specimens composited with glass and leucite powders. In addition, thermal dilation test has been carried out to examine bonding relations between dental porcelain and metal frame (Ni-Cr alloy). The result of three point bending test showed a maximum strength of about 68 MPa. Thermal expansion coefficient changed from 8.3$\times$10-6/$^{\circ}C$ to 13.5$\times$10-6/$^{\circ}C$ with increasing leucite content (0~30wt.%) in glass matrix. Bonding between porcelain (25% leucite-75% glass) and Ni-Cr alloy was excellent.

• 분석과학
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• 제5권3호
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• pp.309-317
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• 1992

졸-겔법에 의해 무기-유기 복합체를 합성하였으며, 복합체의 결합특성을 알아보기 위하여 DMTA(Dynamic Mechanical Thermal Analyzer)를 이용하여 유리전이 온돈(Tg)를 측정하였다. HCl 과 물의 양이 증가될수록 Tg는 고운으로 진행됨으로부터 복합화가 더 잘 일어남을 알 수 있었다. 그러나 반응시간에 따른 Tg의 변화는 관찰되지 않았다.

• 한국레이저가공학회지
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• 제8권3호
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

• Restorative Dentistry and Endodontics
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• 제24권1호
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• pp.136-146
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• 1999

The purpose of this study was to estimate the changes of marginal adaptation to the cavity floor of light-cured glass ionomer cement base after application of a composite restoration. Eighty non-carious extracted human molars were used in the present study. Circular cavities were prepared on the center of the exposed dentin surface to 0.5mm, 1.0mm, 1.5mm, 2.0mm in depth and the prepared cavities were pretreated with Dentin conditioner and filled with Fuji II LC(GC Int. Co., Japan). They randomly assigned into 3 groups according to the difference in application of a composite restoration; Group 1(control group): only glass ionomer base, Group 2: The application of a composite restoration surrounded by dentin with class I cavity over glass ionomer base after conventional dentin bonding to the exposed dentin and glass ionomer base, Group 3: The application of composite restoration not-surrounded by dentin over glass ionomer base after conventional dentin bonding to the exposed dentin and glass ionomer base. To examine the interface between cavity floor and light-cured glass ionomer cement base, each groups were sectioned vertically through the center of restorations with diamond saw and the gap size(${\mu}m$) of interface measured by SEM. The results were analyzed by using One Way ANOVA. The results were as follows: 1. Good adaptation between glass ionomer cement base and cavity floor was showed in specimens with 0.5mm, 1.0mm depth base of control group. But in specimens with 1.5mm, 2.0mm depth base of control group, the gap was measured about $15{\mu}m$, $40{\mu}m$ respectively. 2. Gap size in group 2 was significantly higher than that in control group(P<0.05). 3. Gap size in group 3 was significantly higher than that in control group and group 2(P<0.05). 4. It was possible to observe the good adaptation between glass ionomer cement base and dentin which was intermediated with 4-10${\mu}m$ hybrid layer in specimens with 0.5mm, 1.0mm depth base of control group. Cohesive fracture within cement base was observed in all specimens which had the gap between glass ionomer cement base & dentin. 5. It was possible to observe the gap formation between cement base and bonding agent and between composite resin and dentin in all specimens of group 2.

• 대한심미치과학회지
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• 제7권1호
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• pp.42-47
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• 1998

This study was performed to compare the bonding mechanism of glass ionomers. In this study, hybrid glass ionomers were used for restoration(Fuji II LC, GC, Japan) as the material of choice. Two different etching solutions were used in this study, 35% phosphoric acid and 10% polyacrylic acid. The effect of two different conditioners to dentin surface of a primary molar was studied and compared by using scanning electron microscope. Further, the interface of the dentin surface and the hybrid glass ionomers were examined.

• 대한치과교정학회지
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• 제27권5호
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• pp.839-852
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• 1997

Crystal growth 용액인 황화이온을 함유한 폴리아크릴산 용액에 의한 법랑질 표면처리는 법랑질 표면에 crystal growth를 유도함으로써 통상적인 산부식법을 대체하여 교정용 브라켓을 접착하기 위한 법랑질 전처치의 방법으로 사용될 수 있음이 제안된 바 있다. 이 연구는 crystal growth후 교정용 브라켓 접착제로 브라켓을 접착하는 방법의 임상적용 가능성을 구명하기 위하여 시행되었다. 발거된 사람소구치의 법랑질 표면을 $25\%$ 폴리아크릴산과 0.3M 황산을 함유한 기본 crystal growth 용액, 각각 0.3M lithium sulfate, 0.3M magnesium sulfate, 0.3M potassium sulfate를 첨가한 crystal growth 용액, $37\%$ 인산용액, 퍼미스로 각각 처리한 후, 교정용 광중합형 글래스아이오노머 시멘트와 교정용 레진접착제로 금속브라켓을 접착하였다. $37^{\circ}C$의 증류수에 24시간 침지시킨 후, 브라켓 전단결합강도를 측정하고 접착 파절양태를 관찰하였으며 표면처리된 법랑질 표면과 브라켓 제거후의 법랑질 표면을 주사전자현미경으로 관찰하여 다음과 같은 결과를 얻었다. Crystal growth후 광중합형 글래스아이오노머 시멘트로 브라켓 접착시 0.3M magnesium sulfate를 함유한 군의 브라켓 전단결합강도가 가장 높았다(p<0.01). Crystal growth후 광중합형 글래스아이오노머 시멘트로 접착한 군의 브라켓 전단결합강도는 crystal growth 후 레진접착제로 접착한 군보다 높았다(p<0.001). Magnesium sulfate, 또는 potassium sulfate를 함유한 crystal growth 용액으로 법랑질 표면을 처리한 후 글래스아이오노머시멘트로 접착한 군의 브라켓 전단결합강도는 산부식 후 레진 접착제로 접착한 군과 유의한 차이를 보이지 않았다. 브라켓 제거시 잔류접착제의 양은 글래스아이오노머 시멘트로 접착한 것이 가장 적었다. 이상의 결과는 magnesium sulfate나 potassium sulfate를 함유한 crystal growth 용액으로 법랑질 표면처리 후 교정용 광중합형 글래스 아이오노머 시멘트로 브라켓을 접착하는 방법이 통상적으로 사용되는 산부식 후 교정용 레진접착제에 의한 브라켓 접착법을 대체할 수 있음을 시사한다.

• ETRI Journal
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• 제37권2호
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.38-41
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• 2001

In this work, we have been studied the characteristics of each nitride film for the optimization of PMD(pre-metal dielectric) liner nitride process, which can applicable in the recent semiconductor manufacturing process. The deposition conditions of nitride film were splited by PO (protect overcoat) nitride, baseline, low hydrogen, high stress and low hydrogen, respectively. And also we tried to catch hold of correlation between BPSG(boro-phospho silicate glass) deposition and densification. Especially, we used FTIR area method for the analysis of density change of Si-H bonding and Si-NH-Si bonding, which decides the characteristics of nitride film. To judge whether the deposited films were safe or not, we investigated the crack generation of wafer edge after BPSG densification, and the changes of nitride film stress as a function of RF power variation.