• 한국레이저가공학회지
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• 제11권3호
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• pp.10-15
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• 2008

This study is aimed to analyse the laser glass bonding process numerically. Due to the viscoelastic behaviour of glass, the extremely large deformation of the frit seal is resulted continuously over the transition temperature, so that the thermal boundary condition be changed in the entire calculation process. The commercial FEM algorithm is restrictively able to remesh the large geometrical boundary shape and to adapt the boundary conditions simultaneously. According to our manual adaptation of increasing the laser line intensity to 700 mW/mm, it is possible to estimate the thermal glass bonding process under the fracture stress in principle. But it should be studied further in the case of high laser line intensity.

• 한국전기전자재료학회논문지
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• 제19권12호
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• pp.1106-1111
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• 2006

To improve warpage, delamination and the chemical reaction between 2 different co-fired materials, the bonding behavior with common glass was studied. As shown in the previous paper, the phenomenon of the infiltration is different with the composition of the glass. In particular, in the case of low temperature melting glass, infiltration is experimented in this study. GA-1 glass is infiltrated among $BaTiO_3$ particles below $800^{\circ}C$ and is made by glass/ceramic composite. Until the laminate is fired under $850^{\circ}C$, provskite phase is observed. Although in the case of GA-12 glass, the temperature of the glass infiltration is lower than it of GA-l glass, the perovskite phase already disappears at $800^{\circ}C$. As a result, GA-1 and GA-12 glasses are infiltrated among particles at low temperature, however, the chemical reactivity of the glass/ceramic and sintering temperature should be considered.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1999년도 특별강연 및 추계학술발표대회 개요집
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• pp.247-250
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• 1999

• 대한치과교정학회지
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• 제20권3호
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• pp.583-591
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• 1990

If the bond strength is sufficient to resist orthodontic force, orthodontic brackets can be bonded to restorations. Orthodontic brackets were bonded to composite resin and glass ionomer cement restorations with no-mix adhesive or glass ionomer cement. The shear bond strength of adhesives bonded to restorations was studied in vitro. Orthodontic brackets were bonded to 10 extracted natural teeth, 40 composite resin restorations and 40 glass ionomer restorations. The surfaces of composite resin restorations were roughened or applied with bonding agent (Scothbond) after surface roughening. The surfaces of glass ionomer cement restorations were conditioned with acid etching or applied with Scotchbond to etched surface. The adhesive was no-mix resin or glass ionomer cement. The shear bond strength was measured. The results were as follows: 1. Orthodontic brackets could be bonded to composite resin restorations effectively as they could be bonded to acid etched enamel with no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was not affected by bonding agent greatly. 2. The shear bond strength of no-mix adhesive bonded to acid etched glass ionomer cement restorations was sufficient to resist orthodontic force. However. the fracture risk of glass ionomer cement restorations was increased during debonding. The bonding agent couldn't increase the shear bond strength greatly. 3. The shear bond strength of glass ionomer cement bonded to glass ionomer cement restorations was lower than that of no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was greatly decreased by bonding agent. 4. The shear bond strength of glass ionomer cement bonded to composite resin restorations was too low to resist orthodontic force.

• 대한기계학회논문집A
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• 제24권7호
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• pp.1697-1702
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• 2000

This study has been performed to investigate the effects of glass fiber characteristics on the mechanical properties of thermoplastic composite. The surface of glass fiber was coated with the silan e to enhance the bonding strength between fiber and matrix. A micro-droplet pull-off test was performed to investigate the influence of the silane concentration on the bonding strength. The maximum bonding strength was observed around 10.8% silane concentration. In order to examine the influence of the fiber length and fiber content on the properties of the composite, the composite materials involving tile fiber lengths of 5mm, 10mm, 15mm 20mm, and 25mm were tested. The composites used contain 20%, 30%, and 40% by weight of glass fibers. Tension and flexural tests were performed to investigate their mechanical properties of the composites. The tensile strength and tensile modulus of the composite increase with increasing the glass fiber content. The tensile modulus increases slightly with increasing the fiber length. The maximum tensile strength is observed around the fiber length of 15-20mm. The flexural modulus and strength also increase slightly with increasing the fiber length.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• 대한기계학회논문집A
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• 제26권6호
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• pp.1187-1193
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• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.

• 한국재료학회지
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• 제19권11호
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• pp.613-618
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• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• 대한소아치과학회지
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• 제23권2호
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• pp.450-460
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• 1996

The purpose of this study was to compare shear bond strength of composite resin using several dentin bonding agents and light cured glass ionomer cement(Fuji II LC). 40 Bovine primary anterior teeth were used for this experiment. Labial surface of teeth were flattened. It were divided into four groups. Each group was composed of 10 teeth. The material used for this experiment were Scotchbond Multipurpose-Z-100, Allbond 2-Aelitefil, Gluma-Pekalux, light cured glass ionomer cement(Fuji II LC). Each of the materials was applied to the exposed surfaces of 10 teeth by insertion into a cylindrical shaped matrix which is 3mm diameter and 3mm in height. The completed specimens were stored at $37^{\circ}C$ under 100% humidity for 24 hours : the shear bond strength of each material to dentin surface were measured with INSTRON universal testing machine. The results were as follows : 1. Shear bond strength to dentin surface increased in order of light cured glass ionomer cement(Fuji II LC), Gluma, Allbond 2, Scotchbond Multipurpose. 2. Between shear bond strength of light cured glass ionomer cement(Fuji II LC) and Allbond 2, there was statistical significace(p<0.05) 3. Between shear bond strength of light cured glass ionomer cement(Fuji II LC) and Scotchbond Multipurpose, between shear bond strength of Gluma and Scotchbond Multipurpose, there was statistical significance.(p<0.01) The shear bond strength of dentin bonding agents were higher than light cured glass ionomer cement. The reason is that materials and quality of dentin bonding agent were enhanced. Further investigation is necessary to improve shear bond strength of light cured glass ionomer cement.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.338-341
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• 1996

Anodic bonding is a key technology for micromechanical components. The main advantages of this method can be formed in a batch process, over large areas, and is permanent and irreversible. In this paper, the bonding was performed at temperatures ranging from 300 to 450 $^{\circ}C$, voltages 400 to 1000 V, and times 10 to 30 minutes. The sizes of the Si and the Pyrex #7740 glass were 6 mm $\times$6 mm, respectively. Bonding processes and voids were observed by the optical microscope, and the composition of the anodic bonding interface was analyzed by the SIMS. Optimum condition of the anodic bonding was at temperature above 40$0^{\circ}C$ without regard to voltage.