• Restorative Dentistry and Endodontics
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• 제23권1호
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• pp.304-315
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• 1998

The purpose of this study was to evaluate the microleakage of light cured glass ionomer restorative materials in class 5 cavities. In this in vitro study, class 5 cavities were prepared on buccal and lingual surfaces of forty extracted human premolars and molars on cementum margin. These specimen were randomly divided into four groups of 10 each : Group 1 was Fugi II (control), Group 2 was Fugi II LC, Group 3 was Vitremer, and Group 4 was Dyract. Group 2 was also divided once more into 2 groups of 5 each : Group 2-1 was pretreated with dentin conditioner and Group 2-2 was not. All teeth were restored according to the manufacturer's instructions. After 500 thermocycling between $5^{\circ}C$ and $55^{\circ}C$, the 40 teeth were placed in 2 % Methylene blue dye for 24hr, then rinsed with tab water. The specimen were embedded in clear resin, then sectioned buccolingually through the center of restoration with a low speed diamond saw. The dye penetration on each of the specimen were then observed with a stereomicroscope at 20. The results of the study were statistically analyzed using the Student-Newman-Keuls Methods and the Mann-Whitney Rank Sum Test. Tooth restorative interfaces were evaluated using SEM analysis. Results were as follows, 1. Compared to conventional glass ionomer restoratioqs, all light cured glass ionomer restorations were fairly resistant to microleakage (P<0.05). 2. Groups 3 (Vitremer) and Group 4 (Dyract) were found to be the most resistant, Group 2 (Fugi II LC) fairly resistant, and Group 1 (Fugi II) least resistant to microleakage(P<0.05). 3. No significant differences were found between Group 2-1 and Group 2-2 (P>0.08). 4. With the backscattered SEM analysis, the degrees to which tight bonding occurred were also observed in all the groups except for Group 1. Group 4 showed the highest degree of tight bonding than any other materials used in this study.

• 대한치과기공학회지
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• 제25권1호
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• pp.21-28
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• 2003

The purpose of this study was to process bio-active glass ceramic composite, reinforced with sapphire fibers, by hot press. Also to study the interface of the matrix and the sapphire fiber, and the mechanical properties. Glass raw materials melted in Pt crucible at 1300$^{\circ}C$ during 3.5 hours. The melt was crushed in ball mill and then crushed material, ground and sieved to $<40{\beta}{\mu}m$. Sapphire fibers cut (30mm) and aligned. Powder and fibers hot pressed. The micrographs show good bonding between the matrix and the fiber and no porosity in the glass matrix. This means ideal fracture phenomena. Glass is fractured before the fiber. This is indication of good fracture strength. EDXS showing aluminum rich phase and crystalline phase. Bright field image of the matrix showing crystalline phase. Also diffraction pattern of TEM showing the crystalline phase and more than one phase. Strength of the samples was determined by 3 point bend testing. Strength of the 10vol% sample was approximately 69MPa, while strength of the control sample is 35MPa. Conclusions through this study as follow: 1. Micrographs show no porosity in the glass matrix and the interface. 2. The interface between the fiber and the glass matrix show no gaps. 3. Fracture of the glass indicates characteristic fiber-matrix separation. 4. Presence of crystalline phase at high processing temperature. 5. Sapphire is compatible with bioactive glass.

• 대한소아치과학회지
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• 제40권3호
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• pp.159-167
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• 2013

이 연구의 목적은 광중합형 글래스아이오노머인 Fuji II $LC^{TM}$를 대조군으로 삼고 다양한 비율의 나노 하이드록시아파타이트(HA ; hydroxyapatite)를 첨가하여 최적의 물성을 나타내는 HA의 첨가비율을 알아보는 것이다. 각각 무게비로 5~30%의 나노 HA를 첨가하여 HA-5, HA-10, HA-15, HA-20, HA-25, HA-30의 여섯 개의 실험군을 설정하였으며 ISO 9917-2:2004 기본 규정에 따른 물리적 성질과 탈회저항성, 결합강도 실험을 시행하고 주사전자 현미경을 통해 탈회양상과 파절 양상을 관찰하였다. 결합강도 실험 결과 HA의 함량이 증가하면서 결합강도는 증가하여 HA-15 군에서 최대치를 기록하였다(p < 0.05). 탈회 저항성 실험으로 4일간의 탈회 후 CLSM을 이용하여 탈회면을 관찰한 결과, HA 첨가군에서 탈회 구간의 감소가 나타났으나 HA의 첨가량에 따른 유의한 차이는 없었다. 주사전자현미경 상에서 탈회면을 관찰한 결과에서는HA 입자가 탈회된 법랑질의 미세공극을 채우고 있는 양상이 나타났다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1103-1107
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• 2005

Single-crystal silicon thin films on glass (SOG) and on fused-quartz (SOQ) were prepared using wafer bonding and hydrogen-induced layer transfer. Thinfilm transistors (TFTs) were subsequently fabricated. The high-temperature processed SOQ TFTs show better device performance than the low-temperature processed SOG TFTs. Tensile and compressive strain was measured respectively on SOQ and SOG. Consistent with the tensile strain, enhanced electron effective mobility was measured on the SOQ TFTs.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• 한국산학기술학회논문지
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• 제14권3호
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• pp.991-996
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• 2013

본 논문에서는 유리와 구리의 이종재료 접합을 위해 고유진동수를 60 [kHz]로 갖는 초음파 혼을 설계하고자 하였다. 초음파 혼의 입력단과 출력단의 단면비, 혼의 길이 등 관계식을 통해 설정하였으며 설계된 혼의 타당성 분석을 위해 모달해석을 수행하였다. 기초실험을 통하여 공정변수 및 반응변수를 설정하였으며, 초음파 공구 혼을 이용하여 이종재료 접합 강도 실험을 실시하였다. 또한 실험 결과를 통해 최적 공정조건을 도출하였다.

• Structural Engineering and Mechanics
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• 제6권5호
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• pp.485-496
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• 1998

Standard finite element wave propagation codes are useful for determining stresses caused by the impact of one body with another; however, their applicability to a laminated system such as architectural laminated glass is limited because the important interlayer delamination process caused by impact loading is difficult to model. This paper presents a method that allows traditional wave propagation codes to model the interlayer debonding of laminated architectural glass subject to low velocity, small missile impact such as that which occurs in severe windstorms. The method can be extended to any multilayered medium with adhesive bonding between the layers. Computational results of concern to architectural glazing designers are presented.

• 한국세라믹학회지
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• 제30권6호
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• pp.469-477
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• 1993

Residual stresses is one of the major factors to degrade the magnetic properties of VCR magnetic heads. Vicker's indentation technique was adapted to estimate the residual stresses Residual stresses and distribution in the glass and ferrite were obtained after bonding ferrite with glass, varing the cooling rate. The compressive and tensile stresses were developed in the interface and gradually decreased with increasing distance from the interface. The stresses were decreased with a cooling rate. The mean values of residual stress in ferrite were 10MN/㎡, 8MN/㎡, 5MN/㎡ with cooling rate 10℃/min, 5℃/min, 1℃/min respectively. When the bonded sample was annealed above the glass transition temperature followed by cooling at 5℃/min cooling rate, the residual stress was reduced to 6MN/㎡.

• 한국전기전자재료학회논문지
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• 제16권12호
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• pp.1097-1102
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• 2003

In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode, Considering these results, we fabricated p-i-n diodes on the high resistive(4㏀$.$cm) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of pin diode can be decreased by the application of finger pattern has parallel resistance structure from 571Ω to 393Ω.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.111-111
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• 2000

In order to form a uniform oxidation layer and spinel crystalline phase that has been help strong bonding in Kovar(Fe-29Ni-17Co)-to-glass sealing, the humidified nitrogen and nirtogen/hydrogen mixture was used as an oxidation atmosphere. Kovar oxidation was diffusion-controlled reaction and the activation energy was 25~32 kcal/mol at $600~900^{\circ}C.$ After oxidation at $600^{\circ}C, $ the oxidation layer was under 1 $\mu\textrm{m}$ thickness and crystalline phase was spinel which was found to be suitable for the Kovar-to-glass sealing. The Kovar-to-glass seal was carried out at $1010^{\circ}C$ and humidified nitrogen/hydrogen mixture atmosphere. Sealing properties were tested by Leak tester and SEM.