• The korean journal of orthodontics
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• v.35 no.6 s.113
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• pp.433-442
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• 2005

The purpose of this study was to evaluate and compare the shear bond strength of orthodontic brackets depending on the variety of adhesives and whether saliva exists, by using self-etching primer (SEP). Groups were divided according to the type of adhesive into resin adhesive (Trans bond XT) and resin-modified glass ionomer cement (Fuji Ortho LC). One group of resin adhesive used XT primer after etching with 37% phosphoric acid, and the other group used self-etching primer. One group of resin-modified glass ionomer cement only used etching for bonding, and the other group used SEP. Each of the groups were also classified by whether saliva was contaminated or not. and then the shear bond strength was measured. The results showed that when using resin adhesive, the shear bond strength of SEP was lower than the XT primer. In the resin-modified glass ionomer cement groups, the shear bond strength which depends on the priming method, did not have a meaningful difference statistically When saliva was contaminated, the group which used SEP, regardless of the adhesive variety, had a greater shear bond strength than the normal priming group. From these results, SEP showed a shear bond strength that is possible to be used clinically, regardless of the adhesive variety. It can especially be clinically useful to use SEP to bond brackets even on tooth surfaces contaminated with saliva, because it offers the appropriate bonding strength as well as shorter treatment time and easy application.

• The korean journal of orthodontics
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• v.26 no.3
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• pp.317-324
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• 1996

This study was conducted to evaluate the tensile bond strength of three commercially available glass ionomer cements as orthodontic bracket adhesives. 120 premolars extracted for orthodontic treatment were prepared for bonding and standard edgewise brackets were bonded with Shofu Glaslonomer Cement (Shofu Co., U.S.A.), GC Fuji ItGC Co., Japan), KETAC-CEM(ESPE Co., West Germany) with different P/L ratio. The tensile bond strength was tested by Instron testing device after 24hours and 3months from bonding. After debracketing, bracket bases were examined to determine the failure sites. The results of this study were as follows: 1. KETAC CEM showed the highest bond strength other than measurement after 24 hours and at its original P/L ratio, and seemed to have clinically a proper bond strength. It seemed, however, that both Shofu Giaslonomer Cement and GC Fuji I had an inappropriate bond strength. 2. The incorporation of additional powder into the mixture improved the tensile bond strength. 3. Prolonged storage time improved the tensile bond strength. 4. Of the failure, failure occured at the tooth-adhesive interface(54.2%) was the most common type. The second type of failure(36.7%) was combination type, where part of the adhesive remained on the tooth and part on the bracket. And the last type of failure(9.1%) occured at the adhesive-bracket interface.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.79-83
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• 2007

We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.5
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• pp.475-484
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• 2020

Individual curing process of each layer in two resin composites can be caused the separation between two layers. In this study, co-curing process for two resin composites is suggested to improve the inter-layer bonding. Glass fiber reinforced composites with phenolic and epoxy resins were manufactured by co-curing process, and several types of glass/phenolic composites were considered to confirm the application on two resin composites. Experiments for smoke resistance, scratch resistance and flexural strength were carried out to verify requirements corresponding to thermal and mechanical environments. It was validated that two resin composites with phenolic resin impregnated prepreg exhibits good thermal and mechanical characteristics, and it can serve as highly effective composite structures in aerospace and many industry areas.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Korean Ceramic Society
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• v.37 no.12
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• pp.1204-1211
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• 2000

Mn-Zn 페라이트 소결체와 SiO$_2$-PbO-ZnO 삼성분계 유리와의 계면반응에서 페라이트와 유리에 각각 첨가된 ZnO가 계면반응에 미치는 영향을 조사하였다. SiO$_2$-PbO-ZnO 삼성분계 유리에 첨가된 ZnO 함량이 낮은 경우 페라이트와의 접합계면에서 생성되는 중간상은 Pb$_2$(Mn,Fe)$_2$Si$_2$O$_{9}$와 Pb$_{8}$(Mn,Fe)Si$_{6}$O$_{21}$의 고용체였으며, ZnO 농도가 증가함에 따라 중간상은 사라졌다. 유리속의 ZnO 성분이 증가함에 따라 페라이트 소결체 쪽의 계면부근에 Zn의 농도가 증가하는 특이한 분포가 나타났다. 이는 유리 속에 첨가된 Zn 이온의 높은 활동도로 인해 페라이트에 포함된 Zn 이온의 용해반응이 선택적으로 억제되어 나타난 것으로 생각된다. 페라이트에 첨가된 ZnO 함량이 낮은 경우 SiO$_2$-PbO 이성분계 유리와의 접합계면에서 페라이트의 용해에 따른 침식과 입계를 통한 유리의 침투가 심하게 일어났으며, ZnO 함량이 증가함에 따라 계면을 통한 상호확산과 반응이 억제되었다.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.31-36
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• 2001

Dielectric material which is suitably designed for the application of the high-temperature electrostatic chucks(HTESCS) has been developed. Electrical resistivities and dielectric constants of the dielectric layer satisfy the demands for the proper operation of HTESC, and coefficient of thermal expansion(CTE) of the dielectric material matches well that of the bottom insulator so that it secures stable structure. In order to minimize particle contaminations, borosilicate glass(BSG) is selected as a bonding layer between dielectric layer and bottom insulator, and silver is used as a electrode. BSG is solidly bonded between upper dielectric and bottom insulator, and no diffusions or reactions are observed among silver electrode, dielectric, and glass layers. The chucking characteristics of the fabricated HTESC are found to be superior to those of the commercialized one.

• Journal of the Korean Ceramic Society
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• v.54 no.5
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• pp.406-412
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• 2017

$70V_2O_5-10Fe_2O_3-13P_2O_5-7B_2O_3$ glasses were prepared to study the electrical conductivity and catalytic properties of the structural change with crystallization. The structural changes were analyzed by determining the molecular volume from the sample density; using X-Ray Diffraction (XRD) analysis, which indicated that $V_2O_5$, $VO_2$ and $B_2O_3$ crystals in heat-treated more than 1h samples. Especially a new crystalline phase of non-stoichiometric $Fe_{0.12}V_2O_5$ was formed after 6 h heat treatment. The V-O bonding change after crystallization was analyzed by Fourier Transform Infrared Spectroscopy (FTIR); V ion change from $V^{5+}$ to $V^{4+}$ was shown by XPS. Conductivity and catalytic properties were examined based on the polaronic hopping of V and Fe ions, which exhibited different valence states with crystallization.

• Structural Engineering and Mechanics
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• v.63 no.5
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• pp.575-583
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• 2017

The study covers the behavior of reinforced concrete deep beams loaded under 4-point bending, failed by shear and repaired using bonding glass fiber reinforced plastics fabrics (GFRP) patches. Two rehabilitation methods have been used to highlight the influence of the composite on the ultimate strength of the beams and their failure modes. In the first series of trials the work has been focused on the reinforcement/rehabilitation of the beam by following the continuous configuration of the FRP fabric. The patch with a U-shape did not provide satisfactory results because this reinforcement strategy does not allow to increase the ultimate strength or to avoid the abrupt shear failure mode. A second methodology of rehabilitation/reinforcement has been developed in the form of SCR (Strips of Critical Region), in which the composite materials reinforcements are positioned to band the inclined cracks (shear) caused by the shear force. The results obtained by using this method lead a superior out come in terms of ultimate strength and change of the failure mode from abrupt shearing to ductile bending.