• Journal of Magnetics
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• v.6 no.2
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• pp.73-76
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• 2001

A double rectangular spiral type inductor has been fabricated by using FeTaN films. The inductor is composed of internal coils sandwiched by magnetic layers. Characteristics of inductor performance are investigated with an emphasis on planarization of magnetic films. In the absence of the planarization process, the grating topology of the upper magnetic films over the coil arrays degrades the soft magnetic properties and the inductor performance. It also induces a longitudinal magnetic anisotropy with the easy axis aligned to the magnetic flux direction. This alignment prevents the upper magnetic films from contributing to the total induction. Glass bonding is a viable method for achieving a completely planar inductor structure. The planar inductor with glass bonding shows excellent performance: inductance of 1.1 $\mu H$, Q factor of 7 (at 5 MHz), and the current capability up to 100 mA.

• Journal of the Korean Wood Science and Technology
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• v.47 no.5
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• pp.655-662
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• 2019

This study evaluated the multi-bonding performances of timbers as well as those of reinforcement and timber to obtain data for preparing guidelines regarding the use of timbers as large structural members. For the multi-bonding performances of timbers, four types of bonding surfaces were prepared according to the pith position. For the bonding performances of FRP (fiber-reinforced plastic)/steel plate and timber, a total of 11 types of specimens were produced for the selection of the appropriate adhesive. The bonding performances of the produced specimens were evaluated through a water soaking delamination test, a water boiling delamination test, and a block shear strength test. The test results showed that the bonding strength of the bonding surface according to the pith position was highest in the specimen for which the two sections with the pith at the center of the cross-section on timber and between the bonding surfaces (the tangential and radial sections were mixed) were bonded. Furthermore, the specimens for which the section (radial section) with the pith on the bonding surface of the timber was bonded showed a high delamination percentage. The results of the block shear strength test showed that the bonding section did not have a significant effect on the shear strength, and that the measured wood failure percentage was higher than the KS standard value. The PVAc adhesive showed the highest bonding strength between larix timber and GFRP (glass FRP). Furthermore, the epoxy and polyurethane adhesives showed good bonding strength for CFRP (carbon FRP) and structure steel, respectively.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.111-115
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• 2005

Recently, natural fibers draw much interests in composite industry due to low cost, light weight, and environment-friendly characteristics compared with glass fibers. In this study, mechanical properties were evaluated for two extreme cases of jute fiber orientations, i.e. the unidirectional yarn composites and the felt fabric composites. Samples of jute fiber composites were fabricated by RTM process using epoxy resin, and tensile, compression, and shear tests were conducted. As can be expected, unidirectional fiber specimens in longitudinal direction showed the highest strength and modulus. Compared with glass/epoxy composites of the similar fabric architecture and fiber volume fraction, the tensile strength and modulus of jute felt/epoxy composites reached only 40% and 50% levels. However, the specific tensile strength and modulus increased to 80% and 90% of the glass/epoxy composites. The main reason for the poor mechanical properties of jute composites is associated with the weak interfacial bonding between fiber and matrix. The effect of surface treatment of jute fibers on the interfacial bonding will be examined in the future work.

• Journal of the Korean Wood Science and Technology
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• v.45 no.6
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• pp.703-719
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• 2017

Miscanthus had a higher lignin content (19.5 wt%) and carbohydrate (67.6 wt%) than other herbaceous crops, resulting in higher pellet strength and positive effect on combustion. However, miscanthus also contains a high amount of hydrophobic waxes on its outer surface, cuticula, which limits the pellet quality. The glass transition of lignin and cuticula were related to forming inter-particle bonding, which determined mechanical properties of pellet. To determine the effects of surface waxes, both on the pelletizing process and the pellet strength were compared with raw and extracted samples through solvent extraction. In addition, to clarify the relationship between pellet process parameters and bonding mechanisms, the particle size and temperature are varied while maintaining the moisture content of the materials and the die pressure at constant values. Furthermore, kraft lignin was employed to determine the effect of kraft lignin as an additive in the pellets. As results, the removal of cuticula through ethanol extractions improved the mechanical properties of the pellet by the formation of strong inter-particle interactions. Interestingly, the presence of lignin in miscanthus improves its mechanical properties and decreases friction against the inner die at temperatures above the glass transition temperature ($T_g$) of lignin. Consequently, it could found that the use of kraft lignin as an additive in pellet reduced friction in the inner die upon reaching its glass transition temperature.

• Journal of the Korean institute of surface engineering
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• v.44 no.5
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• pp.213-219
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• 2011

Recently aspheric lenses are widely used for superpricision optical instruments, such as cellular phone camera modules, digital cameras and optical communication modules. The aspherical lenses are processed using mold core under high temperature compressive forming pressure. It is imperative to develop superhard protective films for the life extension of lens forming mold core. Especially ta-C films with higher $sp^3$ fractions receive attentions for the life extension of lens forming mold and, in turn, the cost reduction of lenses due to their suprior high temperature stability, high hardness and smooth surfaces. In this study ta-C films were processed on WC mold as a function of substrate bias voltage using FVA (Filtered Vacuum Arc) method. The processed films were characterized by Raman spectroscopy and nano-indentation to investigate bonding nature and hardness, respectively. The film with maximun 87% of $sp^3$ fraction was obtained at the substrate bias voltage of -60 V, which was closest to ta-C film. ta-C films showed better high temperature stability by sustaining relatively high fraction of $sp^3$ bonding even after 2,000 glass lens forming applications.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.198-198
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• 2009

The size of LCD Panel is gradually getting bigger. But the efficient uses of glass and the increasing output of narrow bezel type makes importantly the role of sealant which bonding two glasses. We devised a new tester with pre-inserted blade for interfacial fracture toughness measurement, and evaluated quantitatively bonding ability of sealant. The blade tester has been analyzed with two process parameter, moving speed and inserting depth of blade.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.138-140
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• 2001

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.05a
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• pp.43-44
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• 2000