• Korean Institute of Interior Design Journal
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• v.22 no.5
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• pp.367-375
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• 2013

Using the 'New material' concept has recently been introduced into the natural characteristics. In the course of such a, Janine M. Benyus has proposed to mimic the characteristics of natural ecosystems to mention the concept of Biomimicry. Process made engineered using technical elements for representing the material properties of Biomimicry such will be acting importantly, This study intends to analyze how new materials applied to 'Biomimicry' characteristics are processed in space. The results were as follows : 1) Processing methods of new materials resulted as 'Forming', 'Surface treatment', 'Bonding', 'Inserting'. These four were divided and analyzed into 'Form', 'System', 'Adaptation'. As a result of this analysis, such significances were shown as 'Forming/Surface treatment/Bonding' in 'Form', 'Bonding' in 'System' and 'Adaptation'. 2) 'Bonding' applied to 'System' of new material can be recycled to be combined with other materials through the existing adhesive material, and present as a solution of 'Sustainable development'. 3) 'Bonding' applied to 'Adaptation' of new material is to impart the ability to react to the environment through the joint, but is characteristic, at this time, using digital and other field technology. It appeared primarily that it can be known to meet the social trends and convergence between fields. Thus, as the finish that are friendly to the environment from the interior design, the results of the study are expected to be utilized in the study of new materials guidelines.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.79-79
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• 2009

Ultrasonic fine welding, cutting, cleaning, inspection and measurement is widely used in various fields over 20kHz. However, for High Frequency of 60kHz or more study areas is still insufficient, and the result is lacking. Therefore, this study used ultrasonic horn to the Bonding of Dissimilar Materials for effective design. Finite element analysis (FEA) is using the equations of motion to establish the model. The optimal design for the basic interpretation of vibration characteristics of the ultrasonic measures horn will examine the design.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.52-58
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• 2011

In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

• Journal of the Korean Society of Safety
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• v.32 no.1
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• pp.9-14
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• 2017

Diffusion bonding is a technique that has the ability to join materials with minimum change in joint micro-structure and deformation of the component. The quality of the joints produced was examined by metallurgical characterization and the joint micro-structure developed across the diffusion bonding was related to changes in mechanical properties as a function of the bonding time. An increase in bonding time also resulted in an increase in the micro-hardness of the joint interface from 55 VHN to 180 VHN, The increase in hardness was attributed to the formation of intermetallic compounds which increased in concentration as bonding time increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.171-171
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• 2008

본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.

• Advances in Computational Design
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• v.4 no.1
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• pp.33-41
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• 2019

In this study, 2-mm Al/Cu bimetallic laminates were produced using asymmetric roll bonding (RB) process. The asymmetric RB process was carried out with thickness reduction ratios of 10%, 20% and 30% and mismatch rolling speeds 1:1, 1:1.1 and 1:1.2, separately. For various experimental conditions, finite element simulation was used to model the deformation of bimetallic Al/Cu laminates. Specific attention was focused on the bonding strength and bonding quality of the interface between Al and Cu layers in the simulation and experiment. The optimization of mismatch rolling speed ratios was obtained for the improvement of the bond strength of bimetallic laminates during the asymmetric RB process. During the finite element simulation, the plastic strain of samples was found to reach the maximum value with a high quality bond for the samples produced with mismatch rolling speed 1:1.2. Moreover, the peeling surfaces of samples around the interface of laminates after the peeling test were studied to investigate the bonding quality by scanning electron microscopy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.35-40
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• 1997

The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.

• Journal of the Korea Society for Simulation
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• v.17 no.4
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• pp.21-27
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• 2008

In this paper, we design and implement the upstream packet bandwidth allocation algorithm on OPNET-based DOCSIS 3.0 simulator including channel-bonding CM (Cable Modem)s. Previous DOCSIS CM could not support channel bonding, it has problem in upstream bandwidth allocation and determine the contention area. The proposed upstream bandwidth allocation algorithm has been improved the queuing time and success rate. For the simulation, we design the MAC frame structure with channel bonding supported CM and not. And then, this paper design and implement the CMTS node model, CM node model, CMTS process model, and CM process model.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.4
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• pp.717-722
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• 2013

In this study, we investigated the design of a wire wedge bonding ultrasonic tool horn using finite element method (FEM) simulations. The proposed method is based on an initial design estimate obtained by FEM analysis. An ultrasonic excitation causes various vibrations of a transducer horn and capillary. A simulated ultrasonic transducer horn and resonator are then built and characterized experimentally using a laser interferometer and electrical impedance analyzer. The vibration characteristics and resonance frequencies close to the exciting frequency are identified using ANSYS. FEM analysis is developed to predict the resonance frequency of the ultrasonic horn and use it in the optimal design of an ultrasonic horn mode shape.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.