• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.225-226
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.1309-1310
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.157-158
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• 2010

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 A
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• pp.428-430
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• 2000

This paper describes under-ground transmission cable sheath voltage by using EMTP and proposes a new design method for calculating cable sheath voltage in steady state. The cross bonding system of power cable is modeled on ${\pi}$ equivalent circuit and the sheath voltage(current) of cable can be analyzed with comparing to conventional method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.1049-1050
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• 2009

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.275-276
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1577-1578
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• 2011

• 대한치과보철학회지
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• 제45권2호
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• pp.216-227
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• 2007

Statement of problem: For the long-term success of removable partial dentures, the bonding between metal framework and denture base resin is one of the important factors. To improve bonding between those, macro-mechanical retentive form that is included metal framework design has been generally used. However it has been known that sealing at the interface between metal framework and denture base resin is very weak, because this method uses mechanical bonding. Purpose: Many studies has been made to find a simple method which induces chemical bond, now various bonding system is applied to clinic. In this experiment, shear bond strengths of heat-cured denture base resin to the surface-treated Co-Cr alloy were measured before and after thermocycling. Chemically treated groups with Alloy $Primer^{TM}$, Super-Bond $C&B^{TM}$, and tribochemically treated group with $Rocatec^{TM}$ system were compared to the beadtreated control group. The data were analyzed with two-way ANOVA. Result: 1. Shear bond strength of bead-treated group is highest, and Alloy $Primer^{TM}$ treated group, Super-Bond $C&B^{TM}$ treated group, RocatecTM system treated group were followed. Statistically significant differences were found in each treated group(p<0.05). 2. Surface treatment and thermocycling affected shear bond strength(p<0.05), however there was no interaction between two factors(p>0.05). 3. Shear bond strengths of bead-treated group and Alloy $Primer^{TM}$ treated group showed no statistically significant difference before and after thermocycling(p>0.05), and those of Super-Bond $C&B^{TM}$ treated group and $Rocatec^{TM}$ system treated group showed statistically significant difference after thermocycling(p<0.05).

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.24-27
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• 2009

Solid-state dye-sensitized solar cells (DSSCs) have been constructed employing supramolecular electrolytes with multiple hydrogen bonding. A supramolecule was facilely synthesized by one-pot reaction between the amines of methyl isocytosine (MIC) and the epoxy groups of poly(ethylene glycol diglycidyl ether) (PEGDGE) to produce quadruple hydrogen bonding units. Hydrogen bonding interactions and dissolution behavior of salt in supramolecular electrolytes are investigated. The ionic conductivity of the supramolecular electrolytes with ionic liquid, i.e. 1-methyl-3-propylimidazolium iodide (MPII) reaches $8.5{\times}10^{-5}$ S/cm at room temperature, which is higher than that with metal salt (KI). A worm-like morphology is observed in the FE-SEM micrographs of $TiO_2$ nanoporous layer, due to the connection of $TiO_2$ nanoparticles resulting from adequate coating by electrolytes. DSSCs employing the supramolecular electrolytes with MPII and KI exhibit an energy conversion efficiency of 2.5 % and 0.5 %, respectively, at 100 $mW/cm^2$, indicating the importance of the cation of salt. Solar cell performances were further improved up to 3.7 % upon introduction of poly(ethylene glycol dimethyl ether) (PEGDME) with 500 g/mol.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.159-159
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• 2010

We conducted bum-in test by current stress to evaluate acceleration reliability characteristics about p-resistivity influence of GaN-based light-emitting diodes. The LEDs used in this study are the polarization field-induced LED(PF-LED) having low p-resistivity and the highly resistive LED(HR-LED) having high p-resistivity. The result of high stress experiment shows that current crowding phenomenon is occurred from the center of between p-bonding pad and n-bonding pad to either electrodes. In addition, series resistance and optical power decrease dramatically. These results means that the resistance of between p-bonding pad and p-GaN affect reliability. That's why we need to consider the ohmic contact of p-bonding pad when design the high efficiency and high reliability LEDs.