• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.272-276
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• 1999

The present paper proposes design and manufacturing methods of the carbon/epoxy square grid structure with near zero-CTE in three geometrical principal directions. Bonding strength of the grid structure is examined for different bonding methods. Numerical examples show that maximum displacement of the composite grid structure is almost zero comparing with that of aluminum grid structure with same dimension under thermal loading.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.155-161
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• 1995

Superplastic forming/diffusion bonding(SPF/DB) processes are analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted using two-node line element based on membrane approximation for plane strain shapes. Material behavior during SPF/DB of the integral structures with complicated shapes are investigated. The tying condition is employed for the analysis inter-sheet contact problems. A movement of rib structure is successfully prodicted during the forming.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.256-257
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• 2003

반도체 와이어 본딩(wire-bonding) 조립공정에 사용되는 검사용 현미경 광학계를 설계하였다. 이러한 와이어는 리드프레임에 대해 $\pm$ 1 mm의 단차를 가진다. 이 때 리드프레임은 6배로 관찰하며, 와이어 부분은 2배로 관찰하고자 한다. 그러나 와이어의 단차로 인해 물체거리가 변하게 되며, 일반 광학계로는 배율도 변하게 된다. 물체거리가 변해도 동일한 배율을 가지는 광학계를 설계하기 위해 유한 물점용 3군 줌 광학계를 목적에 맞게 변형시켰다. (중략)

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.332-335
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• 2007

The superplastic forming (SPF) has been widely used in the automotive and aerospace industry because it has great advantages to produce very light and strong components. Finite element method (FEM) is used to model the process of superplastic forming/diffusion bonding (SPF/DB), to predict the pressure-time curve and to analyze the process parameter. In this study, process design of SPF/DB is carried out a 3-sheet sandwich part. SPF/DB process with pressure control was analyzed by using finite element method. For obtaining proper shape, step-by-step pressurization is proposed. The first step of SPD/DB process is obtained by applying of pressure in patches. From the next step it applied pressure to all regions (between inner sheets, between inner and face sheets). By using the proposed pressurization scheme, deficit in part shape is found to be eliminated.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.53-60
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5mm/min. As a result, the load distribution showed a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.60-64
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• 2006

In modern vehicle construction the search for means of weight reduction, improving durability, increasing comfort and raising body stiffness are issues of priority to the design engineer. The intelligent usage of many materials such as high strength steel, light-alloys and plastics enables a significant vehicle weight reduction to be achieved. The classical joining techniques used in the automobile industry need to be newly-evaluated since they often do not present workable solutions for such mixed-material connections, for example aluminium/steel. Calculation/simulation methods have made progress as a key factor for broader and more cost-effective implementation of structural bonding. This will lead to reduction of spotwelds and accelerate the car development. A special focus of the paper is the use of high strength steel grades. It will be shown that adhesive bonding is a key tool for yielding the potential of advanced high strength steel for low gauging without compromising the stiffness. The latest status of adhesive development has been described. Improvements with physical strength and glass temperature as well as of process relevant properties are shown. Also the situation regarding occupational hygiene is treated, showing that by further spotweld point reduction the emission around the working area can be even lowered against the current praxis. High performing lightweight design cannot longer do without high performing crash durable adhesives.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.14 no.1
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• pp.24-31
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• 2018

The mechanical design procedure is studied for the PCHE(printed circuit heat exchanger) with electrochemical etched flow channels. The effective heat transfer plates of PCHE are assembled by diffusion bonding to make a module. PCHE is widely used for industrial applications due to its compactness, cost efficiency, and serviceability at high pressure and/or temperature conditions. The limitations and technical barriers of PCHE are investigated for application to nuclear components. Rules for design and fabrication of PCHE are specified in ASME Section VIII but not in ASME Section III of nuclear components. Therefore, the calculation procedure of key dimensions of PCHE is defined based on ASME section VIII. The effective heat transfer region of PCHE is defined by several key dimensions such as the flow channel radius, edge width, wall thickness, and ridge width. The mechanical design procedure of key dimensions was incorporated into a program for easy use in the PCHE design. The effect of assumptions used in the key dimension calculation on stress values is numerically investigated. A comparative analysis is done by comparing finite element analysis results for the semi-circular flow channels with the formula based sizing calculation assuming rectangular cross sections.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.1
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• pp.52-58
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• 2007

We propose a new contact detection algorithm for fine pitch wire bonding. Fast and stable contact detection of the z-axis in wire bonding is extremely important to maintain the quality of fine pitch gold wire bonding processes, which use a small pad less than $70{\mu}m$ in diameter. A small perturbation in the contact detection time causes a large difference in the size of the formed squashed ball. The new detection method is based on a statistical approach and designed for a discrete Kalman filter. It is faster and has smaller detection time variations than conventional detection methods. Experimental results are presented to demonstrate the advantages of the proposed algorithm.