• Journal of the Korean Wood Science and Technology
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• 제36권6호
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• pp.88-95
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• 2008

내구성과 관련하여 구조부재의 수축문제가 목구조에서는 커다란 관심사가 되고 있다. 특히, 목재 소재를 적극 활용하는 전통공법에서는 짜맞춤 부위, 부재와 벽 등에서 발생하는 건조수축에 의한 갈라짐 등의 결함이 더욱 문제시되고 있다. 또한, 최근 기둥-보 공법에서 많이 사용되고 있는 국내산 낙엽송 집성재의 이용에 있어서도 함수율변화로 인한 수축과 팽윤에 대한 검토를 행할 필요성이 제기되고 있다. 낙엽송 소재와 접착층수를 달리한 낙엽송 집성재의 시험편에 대해 다양한 함수율상태에서의 치수변화율을 살펴보았다. 건조수축에 의한 치수변화 억제효과는 3층 이상의 접착층을 가지는 시험편에서 그 효과가 현저함을 알 수 있었다. 그리하여, 소재를 사용할 경우 최종사용조건에 맞추어 건조를 충분히 행하거나, 구조부재로 집성재를 이용함으로써 건조수축 문제를 어느 정도 해결할 수 있는 것으로 판명되었다.

• 대한기계학회논문집A
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• 제21권11호
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• pp.1896-1911
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• 1997

Effects of fiber-matrix interphases on the micro-and macro-mechanical behaviors of unidirectionally fiber-reinforced composites subjected to transverse shear loading at remote distance have been studied. The interphases between fibers and matrix have been modeled by the spring-layer which accounts for continuity of tractions, but allows radial and circumferential displacement jumps across the interphase that are linearly related to the normal and tangential tractions. Numerical calculations for basic cells of the composites have been carried out using the boundary element method. For an undamaged composite the micro-level stresses at the matrix side of the interphase and effective shear stiffness have been computed as functions of fiber volume ratio $V_f$ and interphase stiffness k. Results are presented for various interphase stiffnesses from the perfect bonding to the case of total debonding. For a square array composite the results show that for a high interphase stiffness k>10, an increase of $V_f$ increases the effective transverse shear modulus G over bar of the composite. For a relatively low interphase stiffness k<1, it is shwon that an increase of $V_f$ slightly decreases the effective transverse shear modulus. For the perfect bonding case, G over bar for a hexagonal array composite is slightly larger than that for a square array composite. Also for a damaged composite partially debonded at the interphase, local stress fields and effective shear modulus are calculated and a decrease in G over bar has been observed.

• 한국재료학회지
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• 제23권10호
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• pp.580-585
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• 2013

To observe the formation of defects at the interface between an oxide semiconductor and $SiO_2$, ZnO was prepared on $SiO_2$ with various oxygen gas flow rates by RF magnetron sputtering deposition. The crystallinity of ZnO depends on the characteristic of the surface of the substrate. The crystallinity of ZnO on a Si wafer increased due to the activation of ionic interactions after an annealing process, whereas that of ZnO on $SiO_2$ changed due to the various types of defects which had formed as a result of the deposition conditions and the annealing process. To observe the chemical shift to understand of defect deformations at the interface between the ZnO and $SiO_2$, the O 1s electron spectra were convoluted into three sub-peaks by a Gaussian fitting. The O 1s electron spectra consisted of three peaks as metal oxygen (at 530.5 eV), $O^{2-}$ ions in an oxygen-deficient region (at 531.66 eV) and OH bonding (at 532.5 eV). In view of the crystallinity from the peak (103) in the XRD pattern, the metal oxygen increased with a decrease in the crystallinity. However, the low FWHM (full width at half maximum) at the (103) plane caused by the high crystallinity depended on the increment of the oxygen vacancies at 531.66 eV due to the generation of $O^{2-}$ ions in the oxygen-deficient region formed by thermal activation energy.

• Restorative Dentistry and Endodontics
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• 제24권1호
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• pp.67-75
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• 1999

The use of composite restorative materials is established due to continuing improvements in the materials and restorative techniques. Composite resins are widely used for the restoration of cervical lesions because of esthetics, good physical properties and working time. There are several types of cavity design for class V composite resin filling, but inappropriate cavity form may affect bonding failure, microleakage and fracture during mastication. Cavity preparations for composite materials should be as conservative as possible. The extent of the preparation is usually determined by the size, shape, and location of the defect. The design of the cavity preparation to receive a composite restoration may vary depending on several factors. In this study, 5 types of class V cavity were prepared on each maxillary central incisor. The types are; 1) V-shape, 2) round(U) shape, 3) box form, 4) box form with incisal bevel and 5) box form with incisal bevel and grooves for axial line angles. After restoration, in order to observe the concentration of stress at bonding surfaces of teeth and restorations, developing a 2-dimensional finite element model of labiopalatal section in tooth, surrounding bone, periodontal ligament and gingiva, based on the measurements by Wheeler, loading force from direction of 45 degrees from lingual side near the incisal edge was applied. This study analysed Von Mises stress with SuperSap finite element analysis program(Algor Interactive System, Inc.). The results were as follows : 1. Stress concentration was prevalent at tooth-resin bonding surface of cervical side on each model. 2. In model 2 without line angle, stress was distributed evenly. 3. Preparing bevel eliminated stress concentration much or less at line angle. 4. Model with round-shape distributed stress concentration more evenly than box-type model with sharp line angle, therefore decreased possibility of fracture. 5. Adding grooves to line angles had no effect of decreasing stress concentration to the area.

• 접착 및 계면
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• 제25권2호
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• pp.63-68
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• 2024

본 연구에서는 반도체 패키지용 와이어 본딩 공정에서 금(Au) wire의 표면처리에 적용되는 린스의 종류에 따른 Au wire의 오염 현상을 확인하고자 하였다. Au wire의 표면처리를 위해 실리콘(Si) 성분이 함유된 린스와 유기 계통으로만 이루어진 린스를 주로 사용하고 있으며, 실제 영향성을 확인하기 위해 두 종류의 1.0wt% 린스 용액으로 Au wire에 표면처리를 진행하였다. 이후, 반도체 공정에서 발생할 수 있는 Si 성분이 포함된 분진과의 반응성을 확인하기 위한 모사 실험을 진행하였다. 그 결과, optical microscopy(OM) 및 scanning electron microscopy(SEM) 분석을 통해 Si 성분이 함유된 린스로 표면처리한 Au wire의 경우 분진이 다량 흡착되었으며, 유기 계통으로만 이루어진 린스로 표면처리한 Au wire에는 소량의 분진이 흡착된 것을 확인하였다. 이는 Si 성분이 함유된 린스의 경우 상대적으로 극성을 띠기에, 주성분이 극성인 분진과 극성 상호작용을 일으키기 때문이다. 따라서 Si 성분이 존재하지 않는 린스를 사용하여 Au wire를 표면처리할 경우 분진에 의한 오염 현상이 감소하여 실제 와이어 본딩 공정에서 불량률을 낮추는 효과를 볼 수 있을 것으로 기대한다.

• 접착 및 계면
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• 제7권4호
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• pp.10-12
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• 2006

The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.545-550
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• 2002

In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.29-33
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• 2010

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

• 대한기계학회논문집A
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• 제24권9호
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• pp.2246-2251
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• 2000

Adhesive bonding repair methods has been used for a number of decades for construction of damaged structures. In order to evaluate the life of cracked aging aircraft structures, the repair technique which uses adhesively bonded boron/epoxy composite patches is being widely considered as a cost-effective and reliable method. But, this repair method contains many shortcomings. One of these shortcomings, debonding is major issue. When the adhesive shear stress increases, debonding is caused at the end of patch and plate interface. And this debonding is another defect except cracks propagation. In this paper, we assess safety at the cracked AI-plate repaired by Br/Epoxy composite patch. Firstly, from the view of fracture mechanics, reduction of stress intensity factors is determined by the variety of patch feature. Secondly, using the elastic analysis and finite element analysis, the distribution of adhesive shear stresses is acquired. Finally, The problem of how to optimize the geometric configurations of the patch has been discussed.

• 한국전기전자재료학회논문지
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• 제17권7호
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• pp.760-763
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• 2004

We studied the nematic liquid crystaL(NLC) aligning capabilities using the new alignment material of a nitrogenated diamond-like carbon(NDLC) thin film. The NDLC thin film exhibits high electrical resistivity and thermal conductivity that are similar to the properties shown by diamond-like carbon (DLC) thin films. The diamond-like properties and nondiamond-like bonding make NDLC an attractive candidate for applications. A high pretilt angle of about 9.9$^{\circ}$ by ion beam(IB) exposure on the NDLC thin film surface was measured. A good LC alignment is achieved by the IB alignment method on the NDLC thin films surface at annealing temperature of 200 $^{\circ}C$. The alignment defect of the NLC was observed above annealing temperature of 250 $^{\circ}C$. Consequently, the high pretilt angle and the good LC alignment by the IB alignment method on the NDLC thin film surface can be achieved.