• 한국정밀공학회지
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• 제27권8호
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• pp.76-83
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• 2010

Metallic sandwich panels with pyramidal truss structures are high-stiffness and high-strength materials with low weight. In particular, bulk structures have enough space for additional multi-functionalities. In this work, in order to fabricate 3-D structures efficiently, Layered Manufacturing Method (LMM) which was composed of three steps, including crimping process, stacking process and bonding process using rapid infrared brazing, was proposed. The joining time was drastically reduced by employing infrared brazing of which heating rate and cooling rate were faster than those of conventional furnace brazing. By controlling the initial cooling rate slowly, the bonding strength was improved up to the level of strength by conventional vacuum brazing. The observation of infrared brazed specimens by optical microscope and SEM showed no defect on the joining sections. The experiments of 1-layered pyramidal structures and 2-layered pyramidal structures subject to 3-point bending were conducted to determine structural advantages of multilayered structures. From the results, the multi-layered structure has superior mechanical properties to the single-layered structure.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.220-220
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• 2012

저밀도 알곤 유도결합플라즈마(Ar-ICP) 를 적용한 그래핀 클리닝 연구를 보고한다. 알곤 축전결합플라즈마(Ar-CCP)는 높은 이온포격에너지 (수백 eV) 로 인하여 그래핀의 C-C $sp_2$ bonding을 쉽게 파괴하고 defect을 형성시킨다. 그러나 저밀도 ($n_i$ < $5{\times}10^8cm^{-3}$) Ar-ICP 에 노출된 그래핀은 낮은 이온포격에너지, 이온밀도로 인하여 defect 이 형성되지 않고 residue 제거가 가능하였다. Graphene 이 집적된 back-gated field effect transistor (G-FET) 가 저밀도 Ar-ICP 에 노출될 경우 resist residue 제거로 인하여 $V_{dirac}$ 이 0 V 방향으로 이동하고 mobility 가 증가하는 것을 확인하였다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2011년도 추계학술대회
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• pp.382-386
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• 2011

RFID 태그 생산 분야에서 RFID 칩 본딩 과정 이후에 RFID 태그 불량 검출 기능을 수행하는 불량 검출 시스템 개발이 요구되어 왔다. 그러나 RFID 태그의 특징을 이해하면서 제대로 된 설계 개념을 가지고 구현된 시스템을 설계하기가 어렵고 사소한 기능의 변화에도 시스템을 처음부터 설계를 해야 하는 어려움이 있었다. 이 논문에서는 RFID 태그 불량 검출 기능을 수행하는 불량검출 시스템을 UML을 이용하여 객체지향 기법으로 설계하고 UML로 설계된 모델링을 객체지향을 지원하는 비주얼 언어인 LabVIEW OOP로 적용하는 방법을 제시한다. UML과 LabVIEW OOP로 설계되고 구현된 불량검출 시스템에 대한 성능과 시스템의 기능 변화에 따른 재설계 기법에 대한 기법도 제안한다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2001년도 학술논문발표회
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• pp.22-27
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• 2001

The purpose of this study is development of dry floor tile method that practically used for improving wet method's defect, with resin mat design. PE resin used mat which satisfied with bonding test, waterproof test, resistance to chemical attack test, resistance to impact test and freezing and thawing test is confirmed the basic property.

• 한국건축시공학회지
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• 제1권2호
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• pp.185-190
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• 2001

The purpose of this study is the development of practical Dry floor tile unit method that settle the defect of a wet method and designed for resin mat. With use of PE resin which is confirmed the basic property, it is developed that resin mat, joint-sealing compound with fixed form and space management to Dry floor tile unit method. The result of this study is below. 1) To acquire above the 4kgf/$\textrm{cm}^2$ - construction specification criterion, the bonding space that between resin mat and tile has to occupy the 50% of resin mat module space(10,000$\textrm{cm}^2$). 2) Criteria of bonding part plane is below. simpleness of metal form. productivity, uniform quality after injection molding cooling, easy cutting for remain space management, adhesive property, construction ability, transformation of a severed piece under pressure and so on. 3) To get the shape that could protect the interfacial breakdown, it is designed that resin mat and tile are unified after the bond input. 4) Adapted joint-sealing compound is the material of urethane kinds wedge form. Resin mat has the water passageway that could drain the water. 5) To manage the severed piece of tile, the resin mat is likely to divide the half and the quarter and the plastic drainage is developed in the severed piece.

• 한국음향학회지
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• 제9권2호
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• pp.5-13
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• 1990

본 연구에서는 수 파장 이상의 깊이에 존재하는 결함을 탐상하기 위하여 50MHz의 중심주파수에서 동작하는 small aperture형 초음파현미경을 구성하였고 다층구조 샘플에 대한 영상을 연구분석하였다. 다층구조물에서의 출력특성을 음향감쇠, 수차, 렌즈형태, 샘플의 특성에 영향을 받으며 이것은 다층구조 I.C.와 bonding층 탐상에 이용할 수 있다. 실험결과, small aperture형 초음파현미경은 large aperture형 시스템에 비하여 두꺼운 샘플의 탐상에 유리하며 타 도구에서 관찰이 어려운 다층구조의 층별 탐상과 내부구조의 변형상태등을 2차원 영상으로 탐상할 수 있는 유용한 도구임을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.197-198
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• 2009

This paper describes the Raman scattering characteristics of polycrystalline (poly) 3C-SiC films, which were deposited on the thermally oxidized Si(100) substrate by the atmosphere pressure chemical vapor deposition (APCVD) method according to growth temperature. TO and LO phonon modes to 2.0m thick poly 3C-SiC deposited at $1180^{\circ}C$ were measured at 794.4 and $965.7\;cm^{-1}$ respectively. From the intensity ratio of $I_{(LO)}/I_{(TO)}$ 1.0 and the broad full width half maximum (FWHM) of TO modes, itcan be elucidated that the crystallinity of 3C-SiC forms polycrystal instead of disordered crystal and the crystal defect is small. At the interface between 3C-SiC and $SiO_2$, $1122.6\;cm^{-1}$ related to C-O bonding was measured. Here poly 3C-SiC admixes with nanoparticle graphite with the Raman shifts of D and G bands of C-C bonding 1355.8 and $1596.8\;cm^{-1}$. Using TO mode of 2.0 m thick poly 3C-SiC, the biaxial stress was calculated as 428 MPa.

• 한국정밀공학회지
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• 제27권7호
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• pp.13-20
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• 2010

Due to the recent quantum leaps forward in bio-, nano-, and information-technologies, the precisionization and miniaturization of mechanical and electrical components are in high demand. The allowable margin for vibration limits for such equipments is becoming stricter. In order to meet this demand, understandings on the characteristics of vibration isolation systems are highly required. Among the components comprising the vibration isolation system, air spring has become a focal point. In order to develop a complex defect tester for COG bonding of display panels, a vibration isolation system composed of air springs for mounting is considered in this study. The dynamic characteristics of the air spring are investigated, which is the most essential ingredient for reducing the vibration problem of the tester to the lowest level. Uncoupled dynamic parameters of the air spring are identified through MTS experiments, followed by suggestion of a model-based approach to obtain the remaining coupled dynamic parameters. Finally, the dynamic behaviors of the air spring are estimated and discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.357-358
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• 2007

Raman spectra of poly (polycrystalline) 3C-SiC thin films, which were deposited on the oxidized Si substrate by APCVD, have been measured. They were used to study the mechanical characteristics of poly 3C-SiC grown in various temperatures. TO and LO modes of 2.0 m poly 3C-SiC grown at 1180 C occurred at 794.4 and $965.7\;cm^{-1}$. Their FWHMs (full width half maximum) were used to investigate the stress and the disorder of 3C-SiC. The broad FWHM can explain that the crystallinity of 3C-SiC grown at 1180 C becomes poly crystalline instead of the disordered crystal. The ratio of intensity $I_{(LO)}/I_{(TO)}$ 1.0 means that the crystal defect of 3C-SiC/$SiO_2$/Si is small. The biaxial stress of poly 3C-SiC was obtained as 428 MPa. In the interface of 3C-SiC/$SiO_2$, the phonon mode of C-O bonding appeared at $1122.6\;cm^{-1}$. The phonon modes related to D and G bands of C-C bonding were measured at 1355.8 and $1596.8\;cm^{-1}$ respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.310-313
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• 2002

Structures obtained with a direct boning of two FZ silicon wafers joined in such a way that a smooth surface of one wafer was attached to the grooved surface of the other were studied. A square net of grooves was made with a conventional photo lithography process. After high temperature annealing the appearance of voids and the rearrangement of structural defects were observed with X-ray diffraction topography techniques. It was shown that the formation of void free grooved boundaries was feasible. In the cases when particulate contamination was prevented, the voids appeared in the grooved structures could be eliminated with annealing. Since it was found that the flattening was accompanied with plastic deformation, this deformation was suggested to be intensively involved in the process of void removal. A model was proposed explaining the interaction between the structural defects resulted in "a dissolution" of cavities. The described processes may occur in grooved as well as in smooth structures, but there are the former that allow to manage air traps and undesirable excess of dislocation density. Grooves can be paths for air leave. According to the established mechanisms, if not outdone, the dislocations form local defect arrangements at the grooves permitting the substantial reduction in defect density over the remainder of the interfacial area.