• Journal of the Korean Wood Science and Technology
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• v.36 no.6
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• pp.88-95
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• 2008

The shrinkage of wood members after construction has been a greater and common concern in wooden buildings with the durability. Particularly, the traditional structure applying solid members actively is easily exposed to the shrinkage that caused by the joints, members, and walls. Moreover, even though domestic larch glulam members are widespread recently in the post-beam construction, the shrinkage (swelling) problem is still the critical defect on the wooden structures by the moisture content change in Korea. Various moisture contents were applied for the specimens to survey the dimensional changes for Japanese larch solid and glulam specimens, and the glulam specimens varied in the number of their laminations. Test results showed that glulam specimens with over 3 bonding layers showed good dimension stabilities. Therefore, to solve the shrinkage problem, sufficient drying fitted to the end-use service conditions should be conducted on the solid or glulam members can be applied.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.11
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• pp.1896-1911
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• 1997

Effects of fiber-matrix interphases on the micro-and macro-mechanical behaviors of unidirectionally fiber-reinforced composites subjected to transverse shear loading at remote distance have been studied. The interphases between fibers and matrix have been modeled by the spring-layer which accounts for continuity of tractions, but allows radial and circumferential displacement jumps across the interphase that are linearly related to the normal and tangential tractions. Numerical calculations for basic cells of the composites have been carried out using the boundary element method. For an undamaged composite the micro-level stresses at the matrix side of the interphase and effective shear stiffness have been computed as functions of fiber volume ratio $V_f$ and interphase stiffness k. Results are presented for various interphase stiffnesses from the perfect bonding to the case of total debonding. For a square array composite the results show that for a high interphase stiffness k>10, an increase of $V_f$ increases the effective transverse shear modulus G over bar of the composite. For a relatively low interphase stiffness k<1, it is shwon that an increase of $V_f$ slightly decreases the effective transverse shear modulus. For the perfect bonding case, G over bar for a hexagonal array composite is slightly larger than that for a square array composite. Also for a damaged composite partially debonded at the interphase, local stress fields and effective shear modulus are calculated and a decrease in G over bar has been observed.

• Korean Journal of Materials Research
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• v.23 no.10
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• pp.580-585
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• 2013

To observe the formation of defects at the interface between an oxide semiconductor and $SiO_2$, ZnO was prepared on $SiO_2$ with various oxygen gas flow rates by RF magnetron sputtering deposition. The crystallinity of ZnO depends on the characteristic of the surface of the substrate. The crystallinity of ZnO on a Si wafer increased due to the activation of ionic interactions after an annealing process, whereas that of ZnO on $SiO_2$ changed due to the various types of defects which had formed as a result of the deposition conditions and the annealing process. To observe the chemical shift to understand of defect deformations at the interface between the ZnO and $SiO_2$, the O 1s electron spectra were convoluted into three sub-peaks by a Gaussian fitting. The O 1s electron spectra consisted of three peaks as metal oxygen (at 530.5 eV), $O^{2-}$ ions in an oxygen-deficient region (at 531.66 eV) and OH bonding (at 532.5 eV). In view of the crystallinity from the peak (103) in the XRD pattern, the metal oxygen increased with a decrease in the crystallinity. However, the low FWHM (full width at half maximum) at the (103) plane caused by the high crystallinity depended on the increment of the oxygen vacancies at 531.66 eV due to the generation of $O^{2-}$ ions in the oxygen-deficient region formed by thermal activation energy.

• Restorative Dentistry and Endodontics
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• v.24 no.1
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• pp.67-75
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• 1999

The use of composite restorative materials is established due to continuing improvements in the materials and restorative techniques. Composite resins are widely used for the restoration of cervical lesions because of esthetics, good physical properties and working time. There are several types of cavity design for class V composite resin filling, but inappropriate cavity form may affect bonding failure, microleakage and fracture during mastication. Cavity preparations for composite materials should be as conservative as possible. The extent of the preparation is usually determined by the size, shape, and location of the defect. The design of the cavity preparation to receive a composite restoration may vary depending on several factors. In this study, 5 types of class V cavity were prepared on each maxillary central incisor. The types are; 1) V-shape, 2) round(U) shape, 3) box form, 4) box form with incisal bevel and 5) box form with incisal bevel and grooves for axial line angles. After restoration, in order to observe the concentration of stress at bonding surfaces of teeth and restorations, developing a 2-dimensional finite element model of labiopalatal section in tooth, surrounding bone, periodontal ligament and gingiva, based on the measurements by Wheeler, loading force from direction of 45 degrees from lingual side near the incisal edge was applied. This study analysed Von Mises stress with SuperSap finite element analysis program(Algor Interactive System, Inc.). The results were as follows : 1. Stress concentration was prevalent at tooth-resin bonding surface of cervical side on each model. 2. In model 2 without line angle, stress was distributed evenly. 3. Preparing bevel eliminated stress concentration much or less at line angle. 4. Model with round-shape distributed stress concentration more evenly than box-type model with sharp line angle, therefore decreased possibility of fracture. 5. Adding grooves to line angles had no effect of decreasing stress concentration to the area.

• Journal of Adhesion and Interface
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• v.25 no.2
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• pp.63-68
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• 2024

In this study, the contamination of gold(Au) wire according to the types of rinse applied for surface treatment in the wire bonding process is investigated and confirmed. For the surface treatment, rinses containing silicon(Si) or those based on organic materials are mainly employed. To identify their effects, surface treatment is conducted on Au wire using two types of rinse at a 1.0 wt% concentration, referred to as Si-including and Oil-based rinse-coated Au wire. Subsequently, a simulation experiment is performed to verify the reactivity of dust containing Si components that could occur in the semiconductor process. Through optical microscopy (OM) and scanning electron microscopy(SEM) analysis, it is observed that a larger amount of dust is adsorbed on the surface of Si-including rinse-coated Au wire compared with the Oil-based rinse-coated Au wire. This is attributed that the rinse containing Si components is relatively polar, causing polar interactions with dust, which also has polarity. Therefore, it is expected that using a rinse without Si components can reduce contamination caused by dust, thereby decreasing the defect rate in the practical wire bonding process.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.10-12
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• 2006

The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.545-550
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• 2002

In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.29-33
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• 2010

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2246-2251
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• 2000

Adhesive bonding repair methods has been used for a number of decades for construction of damaged structures. In order to evaluate the life of cracked aging aircraft structures, the repair technique which uses adhesively bonded boron/epoxy composite patches is being widely considered as a cost-effective and reliable method. But, this repair method contains many shortcomings. One of these shortcomings, debonding is major issue. When the adhesive shear stress increases, debonding is caused at the end of patch and plate interface. And this debonding is another defect except cracks propagation. In this paper, we assess safety at the cracked AI-plate repaired by Br/Epoxy composite patch. Firstly, from the view of fracture mechanics, reduction of stress intensity factors is determined by the variety of patch feature. Secondly, using the elastic analysis and finite element analysis, the distribution of adhesive shear stresses is acquired. Finally, The problem of how to optimize the geometric configurations of the patch has been discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.760-763
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• 2004

We studied the nematic liquid crystaL(NLC) aligning capabilities using the new alignment material of a nitrogenated diamond-like carbon(NDLC) thin film. The NDLC thin film exhibits high electrical resistivity and thermal conductivity that are similar to the properties shown by diamond-like carbon (DLC) thin films. The diamond-like properties and nondiamond-like bonding make NDLC an attractive candidate for applications. A high pretilt angle of about 9.9$^{\circ}$ by ion beam(IB) exposure on the NDLC thin film surface was measured. A good LC alignment is achieved by the IB alignment method on the NDLC thin films surface at annealing temperature of 200 $^{\circ}C$. The alignment defect of the NLC was observed above annealing temperature of 250 $^{\circ}C$. Consequently, the high pretilt angle and the good LC alignment by the IB alignment method on the NDLC thin film surface can be achieved.